Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
60 words
A microwave integrated circuit delay line device comprising in combination: a substrate of dielectric material; a plurality of conductive strips disposed on a surface of said substrate to form a delay line; and means for maintaining the delay time for signals propagating along said delay line substantially constant over a predetermined range of temperature for at least a predetermined frequency.
Claim 2
Dependent Claim
60 words
A microwave integrated circuit delay line device comprising in combination: a substrate of dielectric material; a plurality of conductive strips disposed on a surface of said substrate to form a delay line; and means for maintaining the delay time for signals propagating along said delay line substantially constant over a predetermined range of temperature for at least a predetermined frequency.
Claim 3
Dependent Claim
28 words
The combination of claim 1 wherein said delay time maintaining means comprises means for varying the electromagnetic field pattern adjacent said conductive strips in accordance with ambient temperature.
Claim 4
Dependent Claim
42 words
The combination of claim 2 wherein said electromagnetic field pattern varying means comprises: one or more conductors disposed adjacent said substrate; and means for varying the position of said one or more conductors relative to said substrate in accordance with ambient temperature.
Claim 5
Dependent Claim
75 words
A temperature-compensated microwave integrated circuit device comprising in combination: a substrate of dielectric material; a plurality of conductive strips disposed on a surface of said substrate; a conductive plate disposed adjacent said substrate; and means for varying the position of said conductive plate with respect to said substrate in accordance with changes in temperature to maintain predetermined parameters for signals upon said conductive strips at a substantially constant value over a predetermined range of temperature.
Claim 6
Dependent Claim
75 words
A temperature-compensated microwave integrated circuit device comprising in combination: a substrate of dielectric material; a plurality of conductive strips disposed on a surface of said substrate; a conductive plate disposed adjacent said substrate; and means for varying the position of said conductive plate with respect to said substrate in accordance with changes in temperature to maintain predetermined parameters for signals upon said conductive strips at a substantially constant value over a predetermined range of temperature.
Claim 7
Dependent Claim
19 words
The combination of claim 4 wherein said conductive strips are disposed in a pattern to provide a delay line.
Claim 8
Dependent Claim
14 words
The combination of claim 5 wherein said predetermined parameters comprise the even-mode dielectric constant.
Claim 9
Dependent Claim
101 words
A temperature-compensated microwave integrated circuit device comprising in combination: a substrate of dielectric material; a plurality of conductive strips disposed on a surface of said substrate, said plurality of conductive strips including an input conductor and output conductor; a first conductive plate disposed adjacent said substrate; and means for varying the position of said first conductive plate with respect to said substrate in accordance with changes in temperature, the movement of said first conductive plate being such that the phase of signals at said output conductor is independent of temperature over a predetermined temperature range for signals of a predetermined frequency.
Claim 10
Dependent Claim
101 words
A temperature-compensated microwave integrated circuit device comprising in combination: a substrate of dielectric material; a plurality of conductive strips disposed on a surface of said substrate, said plurality of conductive strips including an input conductor and output conductor; a first conductive plate disposed adjacent said substrate; and means for varying the position of said first conductive plate with respect to said substrate in accordance with changes in temperature, the movement of said first conductive plate being such that the phase of signals at said output conductor is independent of temperature over a predetermined temperature range for signals of a predetermined frequency.
Claim 11
Dependent Claim
72 words
The combination of claim 7 further comprising means for providing mechanical support for said substrate, and wherein said position varying means comprises a body of material coupling said first conductive plate to said mechanical support providing means, said body having dimensions and a coefficient of expansion such that the phase of signals at said output conductor is substantially independent of temperature over a predetermined temperature range for signals of a predetermined frequency.
Claim 12
Dependent Claim
32 words
The combination of claim 8 wherein said mechanical support providing means comprises a second conductive plate disposed parallel to said substrate on the side of said substrate opposite said first conductive plate.
Claim 13
Dependent Claim
43 words
The combination of claim 9 wherein said mechanical support providing means comprises at least one conductive wall, said conductive wall being coupled to said second conductive plate and said body of material coupling said first conductive plate to said mechanical supporting providing means.
Claim 14
Dependent Claim
29 words
The combination of claim 10 wherein said first and second conductive plates and said at least one conductive wall form a closed cavity for signals of said predetermined frequency.
Claim 15
Dependent Claim
16 words
The combination of claim 7 wherein said conductive strips are disposed to form a delay line.
Claim 16
Dependent Claim
143 words
A temperature-compensated microwave integrated circuit device comprising in combination: a substrate of dielectric material; a plurality of conductive strips disposed on said layer including an input and output conductor; a first conductive plate disposed adjacent said substrate, there being a gap between said substrate and said first conductive plate; a conductive support frame, said frame comprising a second conductive plate and four conductive walls coupled to said conductive plate, said substrate being disposed within said frame between and parallel to said first and second conductive plates; a cover connected to said conductive walls and closing said frame; and a temperature compensating layer coupling said first conductive plate to said cover, the thickness and coefficient of expansion of said temperature compensating layer being such that the phase of signals at said output conductor is substantially independent of temperature for signals of a predetermined frequency.
Claim 17
Dependent Claim
143 words
A temperature-compensated microwave integrated circuit device comprising in combination: a substrate of dielectric material; a plurality of conductive strips disposed on said layer including an input and output conductor; a first conductive plate disposed adjacent said substrate, there being a gap between said substrate and said first conductive plate; a conductive support frame, said frame comprising a second conductive plate and four conductive walls coupled to said conductive plate, said substrate being disposed within said frame between and parallel to said first and second conductive plates; a cover connected to said conductive walls and closing said frame; and a temperature compensating layer coupling said first conductive plate to said cover, the thickness and coefficient of expansion of said temperature compensating layer being such that the phase of signals at said output conductor is substantially independent of temperature for signals of a predetermined frequency.
Claim 18
Dependent Claim
14 words
The combination of claim 13 wherein said temperature compensating layer comprises a silicon resin.
Claim 19
Dependent Claim
16 words
The combination of claim 14 wherein said conductive strips are disposed to form a delay line.
Claim 20
Dependent Claim
14 words
The combination of claim 13 wherein said substrate of dielectric material comprises fused silica.
Claim 21
Dependent Claim
17 words
The combination of claim 13 wherein said first and second conductive plates are substantially rectangular in shape.