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US4211564A Expired / Lapsed US ⏱️ 0.0 years remaining

Chemical copper plating solution

Assignee: Hitachi Ltd
•
Filing: 1979-04-18
•
Granted: 1980-07-08
•
Expires: 1999-04-18
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Abstract

Abstract An aqueous plating solution consists essentially of a copper ion-releasing compound, a copper ion-complexing agent, a copper ion-reducing agent, a hydroxide of alkali metal, 2,2'-dipyridyl, polyethyleneglycolstearylamine, and silver sulfide has a good liquid stability and a high plating speed, and a chemical copper plating film obtained from the plating solution has a high toughness (tensile strengthxelongation).

Inventors

  • 👤 Hitoshi Oka

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 06:11
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; C23C18/405

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 67 words
In an aqueous chemical copper plating solution which consists essentially of a water soluble copper salt, a complex agent, a reducing agent, a hydroxide of alkali metal, surfactant, 2,2'-dipyridyl the improvement consisting of silver sulfide in an amount sufficient to provide a chemical copper plating solution having a better stability and higher plating speed and to provide a tougher plating film than conventional chemical copper plating solutions.
Claim 2
Dependent Claim 67 words
In an aqueous chemical copper plating solution which consists essentially of a water soluble copper salt, a complex agent, a reducing agent, a hydroxide of alkali metal, surfactant, 2,2'-dipyridyl the improvement consisting of silver sulfide in an amount sufficient to provide a chemical copper plating solution having a better stability and higher plating speed and to provide a tougher plating film than conventional chemical copper plating solutions.
Claim 3
Dependent Claim 14 words
An aqueous chemical copper solution according to claim 1, wherein the surfactant is polyethyleneglycolstearylamine.
Claim 4
Dependent Claim 23 words
An aqueous chemical copper plating solution which consists essentially of CuSO 4 .5H 2 O, EDTA·2Na, formalin, NaOH, polyethyleneglycolstearylamine, 2,2-dipyridyl and silver sulfide.
Claim 5
Dependent Claim 23 words
An aqueous chemical copper plating solution which consists essentially of CuSO 4 .5H 2 O, EDTA·2Na, formalin, NaOH, polyethyleneglycolstearylamine, 2,2-dipyridyl and silver sulfide.
Claim 6
Dependent Claim 49 words
An aqueous chemical copper plating solution which consists essentially of 5-18 g/l of CuSO 4 .5H 2 O, 15-54 g/l of EDTA·2Na, 1-10 ml/l of 37% formalin, 5-500 mg/l of polyethyleneglycolstearylamine, 1-30 mg/l of 2,2'-dipyridyl and 2.5×10 -15 g/l-5 g/l of Ag 2 S at a pH of 11.9-12.8.
Claim 7
Dependent Claim 49 words
An aqueous chemical copper plating solution which consists essentially of 5-18 g/l of CuSO 4 .5H 2 O, 15-54 g/l of EDTA·2Na, 1-10 ml/l of 37% formalin, 5-500 mg/l of polyethyleneglycolstearylamine, 1-30 mg/l of 2,2'-dipyridyl and 2.5×10 -15 g/l-5 g/l of Ag 2 S at a pH of 11.9-12.8.
Claim 8
Dependent Claim 48 words
An aqueous chemical copper plating solution which consists essentially of 10-15 g/l of CuSO 4 .5H 2 O, 30-45 g/l of EDTA 2Na, 2-5 ml/l of 37% formalin, 50-200 mg/l of polyethyleneglycolstearylamine, 5-20 mg/l of 2,2'-dipyridyl and 0.01-0.5 g/l of Ag 2 S at a pH of 11.9-12.5.
Claim 9
Dependent Claim 48 words
An aqueous chemical copper plating solution which consists essentially of 10-15 g/l of CuSO 4 .5H 2 O, 30-45 g/l of EDTA 2Na, 2-5 ml/l of 37% formalin, 50-200 mg/l of polyethyleneglycolstearylamine, 5-20 mg/l of 2,2'-dipyridyl and 0.01-0.5 g/l of Ag 2 S at a pH of 11.9-12.5.

References Cited (Backward Citations)

US4002786A Cited
US3515563A Cited
US3804638A Cited
US3843373A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1983-07-08 1984-01-07 1984-07-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1987-07-08 1988-01-07 1988-07-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1991-07-08 1992-01-07 1992-07-08 $7700.00 Window Closed / Lapsed

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