Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
156 words
A solid-state imaging device comprising a semiconductor body of a first conductivity type having first, second, third and fourth surface regions, a plurality of photoelectric elements disposed in a first surface region, arranged in a two dimensional array, a plurality of vertical switching MOSTs disposed in a first surface region, and being for addressing a vertical direction of said array, a plurality of horizontal switching MOSTs disposed in a second surface region, and being for addressing a horizontal direction of said array, a plurality of first MOSTs constituting a vertical scanning circuit for addressing said vertical switching MOSTs, and disposed in a third surface region, and a plurality of second MOSTs constituting a horizontal scanning circuit for addressing said horizontal switching MOSTs, and disposed in a fourth surface region, and wherein a threshold voltage V T H .sub.(SC) of said second MOST is lower than a threshold voltage V T V .sub.(SC) of said first MOST.
Claim 2
Dependent Claim
156 words
A solid-state imaging device comprising a semiconductor body of a first conductivity type having first, second, third and fourth surface regions, a plurality of photoelectric elements disposed in a first surface region, arranged in a two dimensional array, a plurality of vertical switching MOSTs disposed in a first surface region, and being for addressing a vertical direction of said array, a plurality of horizontal switching MOSTs disposed in a second surface region, and being for addressing a horizontal direction of said array, a plurality of first MOSTs constituting a vertical scanning circuit for addressing said vertical switching MOSTs, and disposed in a third surface region, and a plurality of second MOSTs constituting a horizontal scanning circuit for addressing said horizontal switching MOSTs, and disposed in a fourth surface region, and wherein a threshold voltage V T H .sub.(SC) of said second MOST is lower than a threshold voltage V T V .sub.(SC) of said first MOST.
Claim 3
Dependent Claim
36 words
A solid-state imaging device according to claim 1, wherein a threshold voltage V T V .sub.(SW) of said vertical switching MOST is higher than a threshold voltage V T H .sub.(SW) of said horizontal switching MOST.
Claim 4
Dependent Claim
29 words
A solid-state imaging device according to claim 2, wherein said V T V .sub.(SW) is 0.25 V or more higher voltage then said V T H .sub.(SW) or more.
Claim 5
Dependent Claim
20 words
A solid-state imaging device according to claim 2, wherein said first surface region is included in said third surface region.
Claim 6
Dependent Claim
20 words
A solid-state imaging device according to claim 2, wherein said second surface region is included in said fourth surface region.
Claim 7
Dependent Claim
20 words
A solid-state imaging device according to claim 1, wherein said second surface region is included in said fourth surface region.
Claim 8
Dependent Claim
20 words
A solid-state imaging device according to claim 1, wherein said second surface region is included in said first surface region.
Claim 9
Dependent Claim
28 words
A solid-state imaging device according to claim 1, wherein said first, second third and fourth surface region have a second conductivity type opposite to said first conductivity type.
Claim 10
Dependent Claim
40 words
A solid-state imaging device according to claim 1, wherein said first, second, third and fourth surface region has said first conductivity type, and a impurity concentration of said third surface region is higher than that of said fourth surface region.
Claim 11
Dependent Claim
28 words
A solid-state imaging device according to claim 1, wherein a impurity concentration of a channel region of said first MOST is higher than that of said second MOST.
Claim 12
Dependent Claim
206 words
A solid-state imaging evice comprising a semiconductor body of a first conductivity type having first, second, third and fourth surface regions of a second conductivity type opposite to said first conductivity type, a plurality of picture elements disposed in said first surface region, arranged in a two dimensional array, and having a vertical switching MOST for addressing a vertical direction of said array, a source junction of said vertical switching MOST constitutes a pn junction photodiode between a source region of said vertical switching MOST and said first surface region, a plurality of horizontal switching MOSTs disposed in a second surface region, and being for addressing a horizontal direction of said array, a vertical scanning circuit for addressing said vertical switching MOSTs disposed in a third surface region, a horizontal scanning circuit for addressing said horizontal switching MOSTs disposed in a fourth surface region, first means for applying a first voltage V 2 V .sub.(SC) to an first electrode disposed on said third surace region, and second means for applying a second voltage V 2 H .sub.(SC) to a second electrode disposed on said fourth surface region, and wherein said first voltage V 2 V .sub.(SC) is higher than said second voltage V 2 H .sub.(SC).
Claim 13
Dependent Claim
206 words
A solid-state imaging evice comprising a semiconductor body of a first conductivity type having first, second, third and fourth surface regions of a second conductivity type opposite to said first conductivity type, a plurality of picture elements disposed in said first surface region, arranged in a two dimensional array, and having a vertical switching MOST for addressing a vertical direction of said array, a source junction of said vertical switching MOST constitutes a pn junction photodiode between a source region of said vertical switching MOST and said first surface region, a plurality of horizontal switching MOSTs disposed in a second surface region, and being for addressing a horizontal direction of said array, a vertical scanning circuit for addressing said vertical switching MOSTs disposed in a third surface region, a horizontal scanning circuit for addressing said horizontal switching MOSTs disposed in a fourth surface region, first means for applying a first voltage V 2 V .sub.(SC) to an first electrode disposed on said third surace region, and second means for applying a second voltage V 2 H .sub.(SC) to a second electrode disposed on said fourth surface region, and wherein said first voltage V 2 V .sub.(SC) is higher than said second voltage V 2 H .sub.(SC).
Claim 14
Dependent Claim
48 words
A solid-state imaging device according to claim 11, wherein said first means biases backwardly a pn junction which is constituted by said body and said third surface region, and said second means biases backwardly a pn junction which is constituted by said body and said fourth surface region.
Claim 15
Dependent Claim
23 words
A solid-state imaging device according to claim 11, wherein impurity concentrations of said surface regions are higher than that of said semiconductor body.
Claim 16
Dependent Claim
20 words
A solid-state imaging device according to claim 11, wherein said first surface region is included in said third surface region.
Claim 17
Dependent Claim
20 words
A solid-state imaging device according to claim 14, wherein said second surface region is included in said third surface region.
Claim 18
Dependent Claim
20 words
A solid-state imaging device according to claim 11, wherein said second surface region is included in said fourth surface region.
Claim 19
Dependent Claim
30 words
A solid-state imaging device according to claim 11, further comprising means for applying a third voltage V 2 V .sub.(SW) to a third electrode disposed on said first surface region.
Claim 20
Dependent Claim
20 words
A solid-state imaging device accrding to claim 17, wherein said second surface region is included in said first surface region.
Claim 21
Dependent Claim
20 words
A solid-state imaging device according to claim 17, wherein said second surface region is included in said fourth surface region.
Claim 22
Dependent Claim
40 words
A solid-state imaging device according to claim 17, further comprising fourth means for applying a fourth voltage V 2 H .sub.(SW) lower than said third voltage V 2 V .sub.(SW) to a fourth electrode disposed on said second surface region.