US4204918A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroplating procedure
Assignee: Dow Chemical Co
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Filing: 1979-04-04
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Granted: 1980-05-27
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Expires: 1999-04-04
Abstract
Abstract A porous electroplatable body is interiorly electroplated and the like by: making an at least substantial initial capacity filling of all or at least a portion of the void spaces in the body with an appropriate electroplating or other deposit-releasing bath solution or other dispersion; effecting subsequent immersion of the bath-replete body in a non-plating or non-depositing electroconductive liquid media; then following these steps by application of plating current to and through the bath containing body whereupon the interior surfaces of the body are plated or coated.
Inventors
- 👤 James A. McIntyre
- 👤 Robert F. Phillips
- 👤 Joseph D. Lefever
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:13
CPC Classifications
C; C25; C25D; C25D7/00
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
141 words
Procedure for providing internal surface deposit layers on the walls of void spaces in a porous electroconductive body comprising: at least substantially filling the void space in the porous body with a bath of a therein dispersed electrodepositable substance which forms deposit layers on an oppositely electrocharged body when subject to passage therethrough of a deposit-forcing electrical current; immersing the bath-replete porous body in an electroconductive liquid medium that is different than the bath and which in itself contains substantially nothing of a deposit-releasing nature when the liquid is subject to passage of electrical current therethrough; then applying a direct electrical potential across the liquid and to said bath-replete body to cause current to flow through said liquid and body whereupon interior deposits are laid on the internal surface areas of said body from said bath occupying the void space therein.
Claim 2
Dependent Claim
141 words
Procedure for providing internal surface deposit layers on the walls of void spaces in a porous electroconductive body comprising: at least substantially filling the void space in the porous body with a bath of a therein dispersed electrodepositable substance which forms deposit layers on an oppositely electrocharged body when subject to passage therethrough of a deposit-forcing electrical current; immersing the bath-replete porous body in an electroconductive liquid medium that is different than the bath and which in itself contains substantially nothing of a deposit-releasing nature when the liquid is subject to passage of electrical current therethrough; then applying a direct electrical potential across the liquid and to said bath-replete body to cause current to flow through said liquid and body whereupon interior deposits are laid on the internal surface areas of said body from said bath occupying the void space therein.
Claim 3
Dependent Claim
67 words
Electroplating procedure for plating the internal surface areas of a porous electroplatable body comprising: at least substantially filling void space in the porous body with an electroplating bath; immersing the bath-replete body in a non-plating electroconductive liquid medium; then passing under applied voltage an electroplating current through said liquid medium and said bath-containing body to lay a plate deposit on the interior surface area of said body.
Claim 4
Dependent Claim
67 words
Electroplating procedure for plating the internal surface areas of a porous electroplatable body comprising: at least substantially filling void space in the porous body with an electroplating bath; immersing the bath-replete body in a non-plating electroconductive liquid medium; then passing under applied voltage an electroplating current through said liquid medium and said bath-containing body to lay a plate deposit on the interior surface area of said body.
Claim 5
Dependent Claim
156 words
Procedure for providing internal surface deposit layers on the walls of void spaces in at least a portion of a porous electroconductive body comprising: at least substantially filling the void space in a portion of the porous body with a bath of a therein dispersed electrodepositable substance which forms deposit layers on an oppositely electrocharged body when subject to passage therethrough of a deposit-forcing electrical current; immersing at least the portion of bath-replete porous body to be plated in an electroconductive liquid medium that is different than the bath and which in itself contains substantially nothing of a deposit-releasing nature when the liquid is subject to passage of electrical current therethrough; then applying a direct electrical potential across the liquid and to said bath-replete body to cause current to flow through said liquid and body whereupon interior deposits are laid on the internal surface areas of said body from said bath occupying the void space therein.
Claim 6
Dependent Claim
156 words
Procedure for providing internal surface deposit layers on the walls of void spaces in at least a portion of a porous electroconductive body comprising: at least substantially filling the void space in a portion of the porous body with a bath of a therein dispersed electrodepositable substance which forms deposit layers on an oppositely electrocharged body when subject to passage therethrough of a deposit-forcing electrical current; immersing at least the portion of bath-replete porous body to be plated in an electroconductive liquid medium that is different than the bath and which in itself contains substantially nothing of a deposit-releasing nature when the liquid is subject to passage of electrical current therethrough; then applying a direct electrical potential across the liquid and to said bath-replete body to cause current to flow through said liquid and body whereupon interior deposits are laid on the internal surface areas of said body from said bath occupying the void space therein.
Claim 7
Dependent Claim
81 words
Electroplating procedure for plating the internal surface areas of a portion of a porous electroplatable body comprising: at least substantially filling void space in a portion of the porous body with an electroplating bath; immersing at least the portion of the bath-replete body to be plated in a non-plating electroconductive liquid medium; then passing under applied voltage an electroplating current through said liquid medium and said bath-containing body to lay a plate deposit on the interior surface area of said body.
Claim 8
Dependent Claim
81 words
Electroplating procedure for plating the internal surface areas of a portion of a porous electroplatable body comprising: at least substantially filling void space in a portion of the porous body with an electroplating bath; immersing at least the portion of the bath-replete body to be plated in a non-plating electroconductive liquid medium; then passing under applied voltage an electroplating current through said liquid medium and said bath-containing body to lay a plate deposit on the interior surface area of said body.
Claim 9
Dependent Claim
28 words
In the procedure of claims 2 or 4, electroplating a porous metallic electrode body having internal, body-traversing pores of an average diameter of less than about 10 microns.
Claim 10
Dependent Claim
35 words
A procedure according to the procedure of claim 5, wherein the electrode body is comprised of a metal selected from the group consisting of nickel, iron and its alloys including corrosion-resisting steels, copper and titanium.
Claim 11
Dependent Claim
20 words
In the procedure of claims 2 or 4, filling the body with an electroplating bath composed for plating of silver.
Claim 12
Dependent Claim
35 words
A procedure according to the procedure of claim 7, wherein the electrode body is comprised of a metal selected from the group consisting of nickel, iron and its alloys including corrosion-resisting steels, copper and titanium.
Claim 13
Dependent Claim
38 words
A procedure according to the procedure of claim 7, wherein said bath is an effective plating mixture in aqueous solution of silver and potassium cyanides and said electroconductive liquid medium is an aqueous solution of potassium per chlorate.
Claim 14
Dependent Claim
24 words
In the procedure of claims 2 or 4, immersing said body in an aqueous non-plating, electroconductive liquid medium for passage of the electroplating current.
Claim 15
Dependent Claim
41 words
In the procedure of claims 2 or 4, passing said current through said electroconductive liquid medium at a density that is between about 0.05 amp/in 2 and that causing formation and evolution of hydrogen at and from the body being plated.
Claim 16
Dependent Claim
45 words
A procedure according to the procedure of claim 7, wherein the current is passed through the electroconductive liquid medium at a density that is between about 0.05 amp/in 2 and that causing formation and evolution of hydrogen at and from the body being silver plated.
Claim 17
Dependent Claim
20 words
A procedure according to claim 10, wherein said current density is on the order of about 0.1 amp/in 2 .
Claim 18
Dependent Claim
18 words
Repeating the procedure of claims 1 or 3 through a multiple series of sequential plating and filling steps.
Claim 19
Dependent Claim
18 words
Repeating the procedure of claims 2 or 4 through a multiple series of sequential plating and filling steps.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-05-27 | 1983-11-26 | 1984-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-05-27 | 1987-11-26 | 1988-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-05-27 | 1991-11-26 | 1992-05-27 | $7700.00 | Window Closed / Lapsed |