Patent US4204187A successfully refreshed from Google Patents.
← Back to Patent Explorer
US4204187A Expired / Lapsed US ⏱️ 0.0 years remaining

Printed circuit substrate with resistance elements

Assignee: Nitto Denko Corp
•
Filing: 1978-03-07
•
Granted: 1980-05-20
•
Expires: 1998-03-07
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.

Inventors

  • 👤 Takeshi Kakuhashi
  • 👤 Yasufumi Miyake

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 22:09
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H01; H01C; H01C17/00; H01C17/06; H01C17/07; H01C7/00; H01C7/22; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0361; H05K2203/00; H05K2203/03; H05K2203/0338; H05K2203/07; H05K2203/0703; H05K2203/0726; H05K3/00; H05K3/02; H05K3/06; H05K3/061; H05K3/062; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49128; Y10T29/49155

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 115 words
A printed substrate incorporating resistive elements comprising in combination: (a) an insulating support; (b) a layer of resistive material of predetermined dimensions embedded in said insulating support and having an outer surface flush with an outer surface of said insulating support; (c) first and second regions of highly conductive material positioned in contact with spaced-apart portions of said layer of resistive material, said first and second regions of highly conductive material being positioned upon at least portions of said outer surface of said resistive layer; and (d) first and second conductor pattern film layers formed on said first and second regions of highly conductive material respectively at a position opposite said layer of resistive material.
Claim 2
Dependent Claim 115 words
A printed substrate incorporating resistive elements comprising in combination: (a) an insulating support; (b) a layer of resistive material of predetermined dimensions embedded in said insulating support and having an outer surface flush with an outer surface of said insulating support; (c) first and second regions of highly conductive material positioned in contact with spaced-apart portions of said layer of resistive material, said first and second regions of highly conductive material being positioned upon at least portions of said outer surface of said resistive layer; and (d) first and second conductor pattern film layers formed on said first and second regions of highly conductive material respectively at a position opposite said layer of resistive material.
Claim 3
Dependent Claim 45 words
A printed circuit substrate with resistance elements as claimed in claim 1, wherein said first and second regions of highly conductive material are positioned both upon portions of said outer surface of said resistive layer and portions of said outer surface of said insulating support.
Claim 4
Dependent Claim 43 words
A printed circuit substrate with resistance elements as claimed in claim 1, in which said conductor pattern film layers are made of a metallic material which is anti-corrosive against an etching solution for etching the material of said regions of highly conductive material.
Claim 5
Dependent Claim 50 words
A printed circuit substrate with resistance elements as claimed in claim 1, in which said layer of resistive material and conductor pattern film layers are made of the same anti-corrosive metallic material which is anti-corrosive against an etching solution for etching the material of said regions of highly conductive material.
Claim 6
Dependent Claim 51 words
A printed circuit substrate with resistance elements as claimed in claim 1, in which said layer of resistive material and conductor pattern film layers are made of different anti-corrosive metallic materials each of which is anti-corrosive against an etching solution for etching the material of said regions of highly conductive material.
Claim 7
Dependent Claim 28 words
A printed circuit substrate with resistance elements as claimed in claim 1, in which said layer of resistive material and conductor pattern film layers are formed by plating.
Claim 8
Dependent Claim 58 words
A printed circuit substrate with resistance elements as claimed in claim 1, in which said layer of resistive material is formed by printing a resistance material, while said conductor pattern film layers are formed by plating with a metallic material which is anti-corrosive against an etching solution for etching the material of said regions of highly conductive material.

References Cited (Backward Citations)

US3256588A Cited
US3287191A Cited
US3390992A Cited
US3864180A Cited
US3904461A Cited
US4077854A Cited
US4025404A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1983-05-20 1983-11-19 1984-05-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1987-05-20 1987-11-19 1988-05-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1991-05-20 1991-11-19 1992-05-20 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag