Patent US4203129A successfully refreshed from Google Patents.
US4203129A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bubble generating tunnels for cooling semiconductor devices
Assignee: International Business Machines Corp
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Filing: 1978-07-11
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Granted: 1980-05-13
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Expires: 1998-07-11
Abstract
Abstract A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned so that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels.
Inventors
- 👤 Sevgin Oktay
- 👤 Gerard J. Torgersen
- 👤 Alexander C. Wong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 11:51
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; H10W40/40; H10W40/47; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10S; Y10S165/00; Y10S165/908
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
128 words
A liquid encapsulated module comprising: a plurality of heat generating devices on a substrate; a container attached to said substrate in sealed relationship such that the substrate forms a vertical side wall to the inside of said container; a heat sink composed of a heat conducting body having a plurality of vertically oriented tunnels therein formed on one side of said heat generating components; a low boiling point liquid partially filling said container and completely covering said heat generating components; a vapor space above the liquid surface level; said tunnels being of such dimension so as to provide enhanced bubble nucleation growth and the movement of bubbles upward and out of the tunnels to promote cooling of said devices; and means for removing heat from the said container.
Claim 2
Dependent Claim
128 words
A liquid encapsulated module comprising: a plurality of heat generating devices on a substrate; a container attached to said substrate in sealed relationship such that the substrate forms a vertical side wall to the inside of said container; a heat sink composed of a heat conducting body having a plurality of vertically oriented tunnels therein formed on one side of said heat generating components; a low boiling point liquid partially filling said container and completely covering said heat generating components; a vapor space above the liquid surface level; said tunnels being of such dimension so as to provide enhanced bubble nucleation growth and the movement of bubbles upward and out of the tunnels to promote cooling of said devices; and means for removing heat from the said container.
Claim 3
Dependent Claim
13 words
The module of claim 1 wherein said heat generating devices are integrated circuits.
Claim 4
Dependent Claim
29 words
The module of claim 1 wherein the said devices are physically and electrically connected to said substrate by metal connections which space the said devices from the said substrate.
Claim 5
Dependent Claim
34 words
The module of claim 3 wherein said heat sink is a heat conductive wax located within the space between the said devices and substrate and said vertically oriented tunnels are formed within the wax.
Claim 6
Dependent Claim
33 words
The module of claim 3 wherein said heat sink is a heat conductive member bonded to the side of the said devices opposite to that of said substrate and having said tunnels therein.
Claim 7
Dependent Claim
56 words
The module of claim 3 wherein said heat sink includes a heat conductive wax located within the space between the said devices and substrate and vertically oriented tunnels are formed within the wax, and a heat conductive member bonded to the side of the said devices opposite to that of said substrate and having tunnels therein.
Claim 8
Dependent Claim
12 words
The module of claim 5 wherein said tunnels have a circular cross-section.
Claim 9
Dependent Claim
13 words
The module of claim 5 wherein the heat sink is composed of silicon.
Claim 10
Dependent Claim
13 words
The module of claim 5 wherein said heat sink is composed of copper.
Claim 11
Dependent Claim
13 words
The module of claim 1 wherein said liquid is a fluorocarbon dielectric liquid.
Claim 12
Dependent Claim
35 words
The module of claim 1 further comprising means held at least closely adjacent to the side of each of said devices to remove heat from said devices by conduction as well as by nucleate boiling.
Claim 13
Dependent Claim
32 words
The module of claim 4 further comprising means held contiguous to the side of each of said devices to remove heat from said devices by conduction as well as by nucleate boiling.
Claim 14
Dependent Claim
38 words
The module of claim 5 further comprising means held contiguous to the side of said heat sinks opposite to that of the said devices to remove heat from said devices by conduction as well as by nucleate boiling.
Claim 15
Dependent Claim
20 words
The module of claims 11, 12 or 13 wherein said means to remove heat by conduction includes a spring-loaded piston.
Claim 16
Dependent Claim
20 words
The module of claim 1 wherein the vapor produced from said liquid is circulated through said means for removing heat.
Claim 17
Dependent Claim
29 words
The module of claim 1 wherein said means for removing heat is a liquid cooling jacket attached to the side of said container opposite to that of said substrate.
Claim 18
Dependent Claim
17 words
The module of claim 1 wherein said tunnels have an aspect ratio, L/D, of 4 to 7.
Claim 19
Dependent Claim
101 words
A cooling system for high density integrated circuit devices comprising: a heat sink composed of a heat conductive body having a plurality of tunnels therein bonded to the back side of each said high density integrated circuit device; said devices are mounted upon a substrate; the said substrate is so positioned in said system that said tunnels in the back side of said chips are substantially vertically oriented; and means for totally immersing the said heat sink having said tunnels in a liquid to promote and augment boiling of said liquid within and through said tunnels to thereby cool said devices.
Claim 20
Dependent Claim
101 words
A cooling system for high density integrated circuit devices comprising: a heat sink composed of a heat conductive body having a plurality of tunnels therein bonded to the back side of each said high density integrated circuit device; said devices are mounted upon a substrate; the said substrate is so positioned in said system that said tunnels in the back side of said chips are substantially vertically oriented; and means for totally immersing the said heat sink having said tunnels in a liquid to promote and augment boiling of said liquid within and through said tunnels to thereby cool said devices.
Claim 21
Dependent Claim
13 words
The cooling system of claim 18 wherein said tunnels have a circular cross-section.
Claim 22
Dependent Claim
18 words
The cooling system of claim 19 wherein said tunnels have an aspect ratio, L/D, of 4 to 7.
Claim 23
Dependent Claim
14 words
The cooling system of claim 18 wherein said liquid is a fluorocarbon dielectric liquid.
Claim 24
Dependent Claim
31 words
The cooling system of claim 18 and further comprising means for removing heat from said system which includes circulation of a two-phase mixture produced from said liquid through a heat exchanger.
Claim 25
Dependent Claim
26 words
The cooling system of claim 18 and further comprising means for removing heat from said system which includes a liquid cooling jacket attached to said system.
Claim 26
Dependent Claim
30 words
The cooling system of claim 18 wherein said devices are physically and electrically connected to the said substrate by metal connections which space the said devices from the said substrate.
Claim 27
Dependent Claim
114 words
A cooling system for high density integrated circuit devices comprising: a substrate for mounting said devices; said devices are physically and electrically connected to said substrate by metal connections which space the said devices from said substrate; heat sink means composed of a heat conducting wax located within the space between the said devices and substrate and vertically oriented tunnels formed within the wax; the said substrate is so positioned in said system that said tunnels are substantially vertically oriented; and means for totally immersing the said heat sink means having said tunnels in a liquid to promote and augment boiling of said liquid within and through said tunnels to thereby cool said devices.
Claim 28
Dependent Claim
114 words
A cooling system for high density integrated circuit devices comprising: a substrate for mounting said devices; said devices are physically and electrically connected to said substrate by metal connections which space the said devices from said substrate; heat sink means composed of a heat conducting wax located within the space between the said devices and substrate and vertically oriented tunnels formed within the wax; the said substrate is so positioned in said system that said tunnels are substantially vertically oriented; and means for totally immersing the said heat sink means having said tunnels in a liquid to promote and augment boiling of said liquid within and through said tunnels to thereby cool said devices.
Claim 29
Dependent Claim
31 words
The cooling system of claim 25 and further comprising: means for removing heat from said system which includes circulation of a two-phase mixture produced from said liquid through a heat exchanger.
Claim 30
Dependent Claim
42 words
The cooling system of claim 25 and further comprising: a second heat sink means bonded to the side of the said devices opposite to that of said substrate and having tunnels therein oriented parallel in length with said tunnels within said wax.
Claim 31
Dependent Claim
20 words
The cooling system of claim 25 or 27 wherein said tunnels have an aspect ratio, L/D, of 30 to 70.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-05-13 | 1983-11-12 | 1984-05-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-05-13 | 1987-11-12 | 1988-05-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-05-13 | 1991-11-12 | 1992-05-13 | $7700.00 | Window Closed / Lapsed |