Semiconductor device having bump terminal electrodes

Claim 2

A semiconductor device comprising; a semiconductor substrate, an insulating film covering at least a portion of the surface of said substrate, a bump terminal electrode formed on a portion of said insulating film, and a protrusion formed between said bump terminal electrode and the peripheral edge of said semiconductor substrate opposing said bump terminal electrode, said protrusion being separated from said bump terminal electrode by a predetermined distance, and a lower surface of said protrusion being directly attached to said insulating film.

Claim 3

A semiconductor device comprising; a semiconductor substrate, an insulating film formed on said semiconductor substrate, a wiring layer electrically connected to one region of said semiconductor substrate and extending on said insulating film, a bump terminal electrode electrically connected to said wiring layer and formed on said insulating film, a connecting lead bonded to the upper surface of said bump terminal electrode and extending outwardly from said semiconductor substrate, and a protrusion formed on said insulating film between said bump terminal electrode and the peripheral edge of said semiconductor substrate opposing said bump terminal electrode, said protrusion being positioned under said connecting lead, and said connecting lead not being fixed to said protrusion.

Claim 4

A semiconductor device comprising; a semiconductor substrate, an insulating film formed on said semiconductor substrate, a wiring layer electrically connected to one region of said semiconductor substrate and extending on said insulating film, a bump terminal electrode electrically connected to said wiring layer and formed on said insulating film, a connecting lead bonded to the upper surface of said bump terminal electrode and extending outwardly from said semiconductor substrate, and a protrusion formed on said insulating film between said bump terminal electrode and the peripheral edge of said semiconductor substrate opposing said bump terminal electrode, said protrusion being positioned under said connecting lead, and said connecting lead not being fixed to said protrusion.

Claim 5

The semiconductor device of claim 1 or 2, in which said protrusion is made of the same material as that of said bump terminal electrode.

Claim 6

The semiconductor device of claim 3, in which the lowermost layer of said protrusion and of said bump terminal electrode is continuously formed on said insulating film.

Claim 7

The semiconductor device of claim 1 or 2, in which said protrusion and said bump terminal electrode have the same construction as that of said wiring layer with the exception of their uppermost layer.

Claim 8

The semiconductor device of claim 1 or 2, in which at least two protrusions having a smaller planar shape than that of said bump terminal electrode are formed on said insulating film between said bump terminal electrode and the peripheral edge of said semiconductor substrate.

Claim 9

The semiconductor device of claim 1 or 2, in which said protrusion is made of a dielectric material.

Claim 10

The semiconductor device of claim 7, in which said protrusion extends in parallel with a plurality of said bump terminal electrodes.

Claim 11

The semiconductor device of claim 1 or 2, in which a plurality of said protrusions are aligned in parallel with the peripheral edge of said semiconductor substrate.

Claim 12

The semiconductor device of claim 1 or 2, in which a gap between said protrusion and the peripheral edge of said semiconductor substrate ranges from 20 to 150 μm.

Claim 13

The semiconductor device of claim 1 or 2, in which the gap between said bump terminal electrode and said protrusion ranges from 30 to 100 μm.

Claim 14

The semiconductor device of claim 1 or 2, in which the height of said protrusion is at least 4 μm.

Claim 15

The semiconductor device of claim 1 or 2, in which the height of said protrusion is substantially equal to that of said bump terminal electrode.

Claim 16

The semiconductor device of claim 7, in which the height of said protrusion ranges from 10 to 30 μm.

Claim 17

The semiconductor device of claim 1 or 2, in which the shape in plan view of said protrusion is substantially the same as that of said bump terminal electrode.

Claim 18

The semiconductor device of claim 3, in which said protrusion includes a titanium film contacting said insulating film, a platinum film on said titanium film, and a gold layer on said platinum film.

Claim 19

The semiconductor device of claim 3, in which said protrusion includes an aluminum film touching said insulating film and a gold layer on said aluminum film.