Bonding thermoplastic resins

Claim 1

An improved thermoplastic resin composition, having excellent bond strength with inorganic oxide substrates, comprising: (A) a thermoplastic resin; (B) from about 0.05 to about 10 weight percent, based on the weight of said thermoplastic resin (A) of a copolymer having polymerized therein (i) from 75 to 95 mole percent of at least one ethylenically unsaturated organic monomer and (ii) from 5 to 25 mole percent of at least one unsaturated organosilane monomer of the formula RSiX n R'.sub.(3-n) wherein R is a monovalent organic radical containing a vinyl group, R' is a monovalent hydrocarbon radical containing up to 10 carbon atoms, n is a integer from 1 to 3, and X is a hydrolyzable group chosen from the group consisting of alkoxy of 1 to 4 carbon atoms, alkoxyalkoxy containing up to 6 carbon atoms, acyloxy of 2 to 4 carbon atoms, phenoxy, and oxime; and (C) from about 0.1 to about 100 mole percent, based on the number of moles of polymerized unsaturated organosilane present in the copolymer component (B) of a monomeric hydrolytically reactive organosilane of the formula R".sub.(4-x) SiX x wherein X is a hydrolyzable group as previously defined, R" is a monovalent organic radical of from 1 to 12 carbon atoms and x is a integer having a value of from 1 to 4.