Process for the vapor growth of a thin film

Claim 2

A process for the vapor growth of a thin film on the exposed surface of each of a plurality of wafers, said method comprising the steps of: supporting said plurality of wafers at their peripheral edges within, and essentially concentric with and substantially perpendicular to the axis of, a reaction tube, to provide a constant clearance W between the inner wall of said reaction tube and said wafers around substantially the entire portion of said peripheral edges, and said wafers being arranged to have a constant distance H between adjacent pairs of said exposed surfaces; flowing a reaction gas through said reaction tube via said clearance W; heating said wafers to a required uniform temperature for depositing said film on said wafers; and maintaining a pressure within said reaction tube at a predetermined reduced average value P; wherein said supporting step comprises arranging said wafers so that the ratio of said H to said W is determined by H/W=a·P+b (1) in the range 1.2≦P≦5.0 Torr, wherein "a" ≦0.8 Torr -1 and "b" is a constant in the range from 0.3 to 1.2 depending on the kind of said reaction gas, and by 0.8P+0.3=H/W=2 (2) in the range 0.5≦P≦1.2 Torr.

Claim 3

A process according to claim 1, wherein said "b" is approximately one hundredth of the the molecular mass of said reaction gas.

Claim 4

A process according to claim 1, wherein said reaction gas is SiH 4 , wherein said thin film is polycrystalline silicon, and said constant "b" is in the range from 0.3 to 0.5.

Claim 5

A process according to claim 3, wherein said constant "b" is 0.3.

Claim 6

A process according to claim 1, wherein said reaction gas comprises SiH 4 and NH 3 , said thin film comprises Si 3 N 4 , and said constant "b" is chosen in the range from 0.5 to 0.6.

Claim 7

A process according to claim 5, wherein said constant "b" is 0.5.

Claim 8

A process according to claim 1, wherein said reaction gas comprises SiH 4 and NO, said thin film is SiO 2 , and said constant "b" is chosen between 0.5 to 0.6.

Claim 9

A process according to claim 7, wherein said constant "b" is 0.6.

Claim 10

A process according to claim 1, wherein said reaction gas comprises SiH 4 and O 2 , said thin film comprises SiO 2 , and said constant "b" is chosen in the range from 0.7 to 0.8.

Claim 11

A process according to claim 9, wherein said constant "b" is 0.7.

Claim 12

A process according to claim 1, wherein said reaction gas comprises ALCL 3 , H 2 and NO, said thin film comprises AL 2 O 3 , and said constant "b" is chosen in the range from 0.9 to 1.2.

Claim 13

A process according to claim 11, wherein said constant "b" is 1.0.

Claim 14

A process according to claim 1, wherein said reaction gas comprises a metal halide and hydrogen gas, said metal being selected from the group of metals consisting of Mo and W, said thin film comprising said metal, and said constant "b" is chosen in the range from 0.9 to 1.2.

Claim 15

A process according to claim 13, wherein said constant "b" is 1.0.

Claim 16

A process according to claim 1, wherein the ratio H/W in formula (2) is determined by: H/W=c·P+d, where "c" is a constant that decreases from 0.8 to 0, and "d" is a constant that increases from 0.3 to 2.0, in linar relation with increase in the molecular weight of said reaction gas from 30 to 100.

Claim 17

A process for vapor growth of a thin film on the exposed surface of each of a plurality of wafers in a reaction tube, said wafers having a shape not similar to the cross-sectional shape of said reaction tube, said method comprising the steps of: providing plates having a shape similar to but smaller than the cross-section of said wafers; placing each of said wafers flat against a respective one of said plates with each said plate being essentially concentric with the respective wafer; supporting a plurality of the combined pieces of said wafers and plates at the peripheral edges of said combined pieces and essentially concentric with and substantially perpendicular to the axis of said reaction tube, with a constant clearance W for substantially the entire area between the inner wall of said reaction tube and said peripheral edge of each of said combined pieces, said combined pieces being arranged to provide a constant distance H between successive pairs of said exposed surfaces, flowing said reaction gas through said reaction tube via said clearance H; heating said wafers to a uniform required temperature for depositing said film on said wafers; and maintaining a pressure within said reaction tube to a predetermined reduced average value P; wherein said arranging said combined pieces so that the ratio of said H to said W is determined by the formula H/W=a·P+b, in the range 1.2≦P≦5.0 Torr, wherein "a" ≦0.8 Torr -1 and "b" is a constant in the range from 0.3 to 1.2 depending on the kind of said reaction gas selected and by 0.8P+0.3=H/W=2 in the range 0.5≦P≦1.2 Torr.

Claim 18

A process for vapor growth of a thin film on the exposed surface of each of a plurality of wafers in a reaction tube, said wafers having a shape not similar to the cross-sectional shape of said reaction tube, said method comprising the steps of: providing plates having a shape similar to but smaller than the cross-section of said wafers; placing each of said wafers flat against a respective one of said plates with each said plate being essentially concentric with the respective wafer; supporting a plurality of the combined pieces of said wafers and plates at the peripheral edges of said combined pieces and essentially concentric with and substantially perpendicular to the axis of said reaction tube, with a constant clearance W for substantially the entire area between the inner wall of said reaction tube and said peripheral edge of each of said combined pieces, said combined pieces being arranged to provide a constant distance H between successive pairs of said exposed surfaces, flowing said reaction gas through said reaction tube via said clearance H; heating said wafers to a uniform required temperature for depositing said film on said wafers; and maintaining a pressure within said reaction tube to a predetermined reduced average value P; wherein said arranging said combined pieces so that the ratio of said H to said W is determined by the formula H/W=a·P+b, in the range 1.2≦P≦5.0 Torr, wherein "a" ≦0.8 Torr -1 and "b" is a constant in the range from 0.3 to 1.2 depending on the kind of said reaction gas selected and by 0.8P+0.3=H/W=2 in the range 0.5≦P≦1.2 Torr.

Claim 19

The method of claim 16, said wafers having a shape similar to said cross-section of said reaction tube, except for a deficient part of said wafers, and said plates providing only said deficient part to the combined shape of said wafer and said plate.

Claim 20

The method of claim 16, one of said wafers being mounted on each side of said respective plate.

Claim 21

The method of claim 2, wherein pairs of said wafers are mounted together.

Claim 22

The method of claim 1, said reaction tube having a circular shape.

Claim 23

The method of claim 16, said reaction tube having a circular shape.

Claim 24

The method of claim 1, said reaction tube having a polygon shape.

Claim 25

The method of claim 16, said reaction tube having a polygon shape.