Josephson tunnel junction device with hydrogenated amorphous silicon, germanium or silicon-germanium alloy tunneling barrier

Claim 2

A Josephson tunnel junction device comprising first and second layers of superconductive material superposed with respect to each other, and a barrier layer superposed between said first and second superconductive layers whereby Josephson tunneling current can flow therethrough between said superconductive layers, said barrier layer comprised of hydrogenated amorphous semiconductor material selected from the group consisting of silicon, germanium and alloys thereof.

Claim 3

The device of claim 1 in which said barrier layer comprises said hydrogenated amorphous semiconductor deposited on said first superconductive layer by sputter deposition in a partial hydrogen atmosphere.

Claim 4

The device of claim 1 in which said barrier layer comprises said hydrogenated amorphous semiconductor deposited on said first semiconductor layer by rf sputter deposition in a partial hydrogen atmosphere.

Claim 5

The device of claim 1 in which said barrier layer comprises said hydrogenated amorphous semiconductor deposited on said first superconductive layer by rf diode sputter deposition in a partial hydrogen atmosphere.

Claim 6

The device of claim 1 in which said barrier layer comprises doped hydrogenated amorphous semiconductor selected from the group consisting of silicon, germanium and alloys thereof.

Claim 7

The device of claim 5 in which said barrier layer is doped by a dopant selected from the group consisting of phosphorous, arsenic and antimony.

Claim 8

The device of claim 1 further including an insulator layer disposed between said first and second superconductive layers having at least one opening therethrough for defining the Josephson tunneling barrier area of said device.

Claim 9

The device of claim 7 in which said opening is quadralaterally shaped.

Claim 10

The device of claim 8 in which said opening is rectangularly shaped.

Claim 11

The device of claim 7 in which said opening is circularly shaped.

Claim 12

The device of claim 7 in which said opening has an oval shape.

Claim 13

The device of claim 1 further including control line means proximate said superconductive layers and electrically insulated therefrom for providing a control magnetic field to said barrier layer thereby controlling said Josephson tunneling current flowing therethrough.

Claim 14

The device of claim 12 further including superconductive ground plane means with said first and second superconductive layers superposed between said control line means and said ground plane means.

Claim 15

A Josephson tunnel junction device for use as a switch in superconductive circuits comprising a superconductive ground plane, a dielectric layer deposited on said ground plane, a first layer of superconductive material deposited on said dielectric layer, a first insulator layer deposited on said first superconductive layer with at least one opening therethrough for defining a Josephson tunneling barrier area, a layer of hydrogenated amorphous semiconductor material deposited on said first insulator layer and into said opening, said semiconductor selected from the group consisting of silicon, germanium and alloys thereof, a second layer of superconductive material deposited on said layer of semiconductor material, said semiconductor material deposited in said opening forming a Josephson tunneling barrier between said first and second superconductive layers whereby Josephson tunneling current can flow therethrough between said superconductive layers, a second insulator layer deposited on said second superconductive layer, and control line means deposited on said second insulator layer for providing a control magnetic field to said barrier thereby controlling the Josephson tunneling current flowing between said superconductive layers through said barrier.

Claim 16

A Josephson tunnel junction device for use as a switch in superconductive circuits comprising a superconductive ground plane, a dielectric layer deposited on said ground plane, a first layer of superconductive material deposited on said dielectric layer, a first insulator layer deposited on said first superconductive layer with at least one opening therethrough for defining a Josephson tunneling barrier area, a layer of hydrogenated amorphous semiconductor material deposited on said first insulator layer and into said opening, said semiconductor selected from the group consisting of silicon, germanium and alloys thereof, a second layer of superconductive material deposited on said layer of semiconductor material, said semiconductor material deposited in said opening forming a Josephson tunneling barrier between said first and second superconductive layers whereby Josephson tunneling current can flow therethrough between said superconductive layers, a second insulator layer deposited on said second superconductive layer, and control line means deposited on said second insulator layer for providing a control magnetic field to said barrier thereby controlling the Josephson tunneling current flowing between said superconductive layers through said barrier.

Claim 17

A method of manufacturing the device of claim 14 comprising the steps of depositing a dielectric layer on a superconductive ground plane, depositing a first layer of superconductive material on said dielectric layer, depositing a first insulator layer on said first superconductive layer, forming at least one opening through said first insulator layer, sputter depositing a layer of hydrogenated amorphous semiconductor on said first insulator layer in a partial hydrogen atmosphere thereby depositing said hydrogenated amorphous semiconductor material in said opening, said semiconductor material selected from the group consisting of silicon, germanium and alloys thereof, depositing a second layer of superconductive material on said layer of semiconductor material, said semiconductor material within said opening forming a Josephson tunneling barrier between said first and second superconductive layers, depositing a second insulator layer on said second superconductive layer and depositing superconductive control line means on said second insulator layer.

Claim 18

The method of claim 15 further including the step of doping said semiconductor material during said sputter deposition thereof.

Claim 19

The method of claim 15 further including the step of sputter etching said first superconductive layer in the same vacuum system pump down in which said semiconductor layer is deposited.