US4171225A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroless copper plating solutions
Assignee: US Philips Corp
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Filing: 1978-04-21
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Granted: 1979-10-16
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Expires: 1998-04-21
Abstract
Abstract Electroless copper plating bath containing a copper salt, a complexing agent, alkali and by way of reducing agent a complex of formaldehyde with an aminocarboxylic acid, -sulphonic acid or -phosphonic acid. Consequently, decomposition of the bath is greatly reduced and furthermore copper of a superior quality is obtained.
Inventors
- 👤 Arian Molenaar
- 👤 Henricus M. Van Den Bogaert
- 👤 Jan Boven
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 15:28
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; C23C18/405
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
95 words
In an aqueous electroless copper plating bath comprising cupric ions, at least one compound capable of forming watersoluble complexes with cupric ions, alkali for maintaining the pH of said bath from about 12 to 13, a formaldehyde yielding compound reducing agent; the improvement consisting of an addition product of formaldehyde and an alkali metal salt of an amino acid containing at least one free --NH 2 group selected from the group consisting of aminoalkanecarboxylic acids and aminoalkanesulfonic acids free of bivalent sulfur, said addition product having substantially equimolar quantities of formaldehyde and amino acid salt.
Claim 2
Dependent Claim
95 words
In an aqueous electroless copper plating bath comprising cupric ions, at least one compound capable of forming watersoluble complexes with cupric ions, alkali for maintaining the pH of said bath from about 12 to 13, a formaldehyde yielding compound reducing agent; the improvement consisting of an addition product of formaldehyde and an alkali metal salt of an amino acid containing at least one free --NH 2 group selected from the group consisting of aminoalkanecarboxylic acids and aminoalkanesulfonic acids free of bivalent sulfur, said addition product having substantially equimolar quantities of formaldehyde and amino acid salt.
Claim 3
Dependent Claim
23 words
A copper plating bath according to claim 1, containing ethylenediaminetetrasodium acetate as a complexing agent for cupric ions and glycine as the amino-acid.
Claim 4
Dependent Claim
23 words
A method of preparing the bath of claim 1 wherein the amino acid salts and the formaldehyde are separately added to the bath.
Claim 5
Dependent Claim
15 words
The copper plating bath of claim 1 wherein a polyoxy ethylene oxide is also present.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-10-15 | 1983-04-16 | 1983-10-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-10-15 | 1987-04-16 | 1987-10-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-10-15 | 1991-04-16 | 1991-10-16 | $7700.00 | Window Closed / Lapsed |