Method and holding fixture for soldering lead frames to hybrid substrates

Claim 2

In a dip solder machine including means for moving a portion of a work piece into and out of a molten solder bath, apparatus for holding in a generally upright position a hybrid assembly work piece including a substrate which may have electrical components soldered to conductive patterns on one side thereof at positions spaced at least a prescribed distance from conductive lands on the one side and adjacent to one edge of the substrate and an elongated lead frame having a conductive bar and a plurality of parallel leads projecting therefrom in the same direction with fingers on free-ends of leads fitting over the one edge of the substrate and at least some fingers contacting associated lands on the substrate for dip soldering lead frame fingers to associated lands, comprising; a plate oriented in a generally upright position; a plurality of hook elements each comprising a relatively straight shank portion connecting one end portion thereof to a curved hook portion having a base and an arm extending from the base in the general direction of the shank portion; means for attaching the one end portions of said hook elements to said plate with the hook portions opening in the same-one direction and their bases all in the same-one line that is substantially perpendicular to the one directipn; and means cooperating with said plate for supporting a substrate in a generally upright positon next to said plate with the bar of a lead frame on the substrate contacting hook element bases as said apparatus is moved generally in the direction opposite the one direction to place the hook portions and lead frame in molten solder and removed therefrom for soldering lead fingers to associated lands.

Claim 3

In a dip solder machine including means for moving a portion of a work piece into and out of a molten solder bath, apparatus for holding in a generally upright position a hybrid assembly work piece including a substrate which may have electrical components soldered to conductive patterns on one side thereof at positions spaced at least a prescribed distance from conductive lands on the one side and adjacent to one edge of the substrate and an elongated lead frame having a conductive bar and a plurality of parallel leads projecting from the bar in the same direction with fingers on free-ends of leads fitting over the one edge of the substrate and at least some fingers contacting associated lands on the substrate for dip soldering lead frame fingers to associated lands, comprising: a first place oriented in a generally upright position; a plurality of hook elements each comprising a relatively straight shank portion connecting one end portion thereof to a curved hook portion having a base and an arm extending from the base in the general direction of the shank portion; means for attaching the one end portions of said hook elements to said first plate with the hook portions opening in the same-one direction and their bases all in the same-one line that is substantially perpendicular to the one direction; and a second plate cooperating with said first plate for supporting a substrate in a generally upright position next to the first plate with the bar of a lead frame on the substrate contacting said hook element bases, said second plate contacting one of the substrate or a component thereon for maintaining the position of the substrate relatively fixed in the apparatus as it is moved generally in the direction opposite the one direction to place the hook portions and lead frame in molten solder and removed therefrom for soldering lead fingers to associated lands.

Claim 4

In a dip solder machine including means for moving a portion of a work piece into and out of a molten solder bath, apparatus for holding in a generally upright position a hybrid assembly work piece including a substrate which may have electrical components soldered to conductive patterns on one side thereof at positions spaced at least a prescribed distance from conductive lands on the one side and adjacent to one edge of the substrate and an elongated lead frame having a conductive bar and a plurality of parallel leads projecting from the bar in the same direction with fingers on free-ends of leads fitting over the one edge of the substrate and at least some fingers contacting associated lands on the substrate for dip soldering lead frame fingers to associated lands, comprising: a first place oriented in a generally upright position; a plurality of hook elements each comprising a relatively straight shank portion connecting one end portion thereof to a curved hook portion having a base and an arm extending from the base in the general direction of the shank portion; means for attaching the one end portions of said hook elements to said first plate with the hook portions opening in the same-one direction and their bases all in the same-one line that is substantially perpendicular to the one direction; and a second plate cooperating with said first plate for supporting a substrate in a generally upright position next to the first plate with the bar of a lead frame on the substrate contacting said hook element bases, said second plate contacting one of the substrate or a component thereon for maintaining the position of the substrate relatively fixed in the apparatus as it is moved generally in the direction opposite the one direction to place the hook portions and lead frame in molten solder and removed therefrom for soldering lead fingers to associated lands.

Claim 5

Apparatus according to claim 2 wherein said hook elements are made of a nonsolderable material.

Claim 6

Apparatus according to claim 3 wherein said hook elements are made of at least commercially pure titanium.

Claim 7

Apparatus according to claim 3 wherein said hook elements are made of music wire.

Claim 8

Apparatus according to claim 3 wherein said hook elements are made of sheet stock.

Claim 9

Apparatus according to claim 3 wherein said second plate is suspended from said first plate at points thereon that are spaced in the one direction from the bases of said hook elements.

Claim 10

Apparatus according to claim 7 including mechanical means for tilting the first plate for making the one line substantially parallel to the surface of the molten solder.

Claim 11

Apparatus according to claim 3 wherein said second plate is a cover that is hingedly attached to said first plate at points thereon that are spaced in the one direction from the bases of said hook elements.

Claim 12

Apparatus according to claim 3 wherein said hook portions open with arms spaced from one side of said first plate for supporting the substrate with the back thereof against the one side of said first plate, said first plate having an elongated slot in the one side thereof and contacting the back of the substrate and extending a distance which is greater than the length of the substrate in the same general direction as the one line and in a common plane.

Claim 13

A machine for receiving a hybrid assembly including a substrate which may have electrical components soldered to conductive patterns on one side thereof at positions spaced at least a prescribed distance from conductive lands on the one side and adjacent to one edge of the substrate and an elongated lead frame having a conductive bar and a plurality of parallel leads projecting therefrom in the same direction with fingers on free-ends of leads fitting over the one edge of the substrate and at least some fingers contacting associated lands on the substrate for dip soldering lead frame fingers to associated lands, comprising: means producing a relatively flat surface area of molten solder; means for holding a hybrid substrate and lead frame assembly comprising a first plate; a plurality of hook elements each having a relatively straight shank portion connecting one end thereof to a curved hook portion having a base and an arm extending back in the general direction of the shank portion; means for attaching the one ends of said hook elements to said plate with hook portions opening in the same one direction and bases in the same one line that is substantially perpendicular to the one direction; and a second plate cooperating with the first plate for contacting one of the substrate or a component on a substrate, with a lead frame pressed over the one edge thereof, located in said holding means with the lead frame bar contacting the base portions of hook elements; and means for moving the holding means to place the hook portions, the lead frame, and the one substrate edge and adjacent lands on a hybrid substrate in said holding means into molten solder and then removing them from the solder for soldering lead fingers to associated lands.

Claim 14

A machine for receiving a hybrid assembly including a substrate which may have electrical components soldered to conductive patterns on one side thereof at positions spaced at least a prescribed distance from conductive lands on the one side and adjacent to one edge of the substrate and an elongated lead frame having a conductive bar and a plurality of parallel leads projecting therefrom in the same direction with fingers on free-ends of leads fitting over the one edge of the substrate and at least some fingers contacting associated lands on the substrate for dip soldering lead frame fingers to associated lands, comprising: means producing a relatively flat surface area of molten solder; means for holding a hybrid substrate and lead frame assembly comprising a first plate; a plurality of hook elements each having a relatively straight shank portion connecting one end thereof to a curved hook portion having a base and an arm extending back in the general direction of the shank portion; means for attaching the one ends of said hook elements to said plate with hook portions opening in the same one direction and bases in the same one line that is substantially perpendicular to the one direction; and a second plate cooperating with the first plate for contacting one of the substrate or a component on a substrate, with a lead frame pressed over the one edge thereof, located in said holding means with the lead frame bar contacting the base portions of hook elements; and means for moving the holding means to place the hook portions, the lead frame, and the one substrate edge and adjacent lands on a hybrid substrate in said holding means into molten solder and then removing them from the solder for soldering lead fingers to associated lands.

Claim 15

The machine according to claim 11 wherein said hook elements are made of a nonsolderable material.

Claim 16

The machine according to claim 12 including flux station means and cleaning station means, said moving means successively moving the holding means to said flux station means for applying flux to lead frames and lands of a substrate in said holding means, moving the holding means to the solder means, and moving the holding means with a soldered substrate therein to said cleaning station means for cleaning and defluxing the substrate and lead frame.

Claim 17

The machine according to claim 13 wherein said second plate is hingedly secured to said first plate for rotation into contact with one of the substrate and a component thereon.

Claim 18

The machine according to claim 11 including means for attaching said holding means to said moving means and operable for selectively providing tilt of said holding means in a generally vertical plane for making the one line substantially parallel to the surface of the solder when the hook portions are dipped in the solder.