Soldering apparatus for printed circuit boards

Abstract

Abstract APPARTUS FOR THE DIP SOLDERING OF PRINTED CIRCUIT BOARDS INCLUDES A PLATFORM OR FRAME CARRIED ON A PLURALITY OF PIVOTALLY MOUNTED LINKS OR ARMS HAVING THEIR LOWER ENDS CARRIED BY THE BASE SO AS TO BE DISPOSED IN A PARALLELOGRAM ARRAY. WITH THE PLATFORM MOVED TO AN UP CONDITION, A PRINTED CIRCUIT BOARD IS REMOVABLY GRIPPED IN SPRING FINGERS ADJUSTABLY CARRIED BY THE PLATFORM. IN THIS UP CONDITION THE GRIPPED PRINTED CIRCUIT BOARD IS ABOVE AND PARALLEL TO THE SURFACE OF A BODY OF MOLTEN SOLDER IN A HEATED CONTAINER. TO SOLDER THE CIRCUIT OF THE BOARD, THE PLATFORM AND GRIPPER BOARD IS SWUNG ON THE LINKS TOWARD THE MOLTEN SOLDER UNTIL THE UNDER SURFACE OF THE BOARD JUST ENTERS THE MOLTEN SOLDER TO A SHALLOW DETERMINED DEPTH. THE LOADING PLATFORM IS CARRIED ON RODS DISPOSED TO PERMIT THE TRANSVERSE MOVEMENT OF THE LOADING PLATFORM FROM A POSITION ABOVE THE MOLTEN SOLDER TROUGH OR CONTAINER TO A POSITION TO THE SIDE OF AND ABOVE THE SOLDER TROUGH. THIS MANIPULATION IS PREFERABLY ACCOMPLISHED BY PULLING THE LATFORM OUTWARDLY FROM ABOVE THE SOLDER TROUGH. THE SWINGING OF THE PLATFORM ON THE ARMS IS PREFERABLY BY A PNEUMATIC CYLINDER WHICH AS IT MOVES THE PLATFORM TOWARDS THE SOLDER ENGAGES AN ADJUSTABLE STOP DISPOSED TO LIMIT THE PENTRATION OF THE PRINTED CIRCUIT BOARD INTO THE MOLTEN SOLDER TO A DETERMINED DEPTH. A DROSS SKIMMER AS PART OF THE COVER IS ALSO PROVIDED ON THIS APPARTUS SO THAT THE DROSS WHICH ACCUMULATES ON TOP OF THE SOLDER MAY BE READILY SKIMMED THEREFROM TO PROVIDE CLEAN MOLTEN SOLDER ADAPTED FOR MAKING THE CONNECTIONS ON THE PRINTED CIRCUIT BOARD.

Inventors

• 👤 Ralph A Rinaldi
• 👤 William Tippy

Bibliographic Details