Patent US4169230A successfully refreshed from Google Patents.
US4169230A
Expired / Lapsed
US
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Method of exposure by means of corpuscular beam shadow printing
Assignee: International Business Machines Corp
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Filing: 1978-05-08
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Granted: 1979-09-25
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Expires: 1998-05-08
Abstract
Abstract A method of exposure of a target object by means of corpuscular beam shadow printing through a mask with several complementary zones wherein the beam, shiftable and tiltable about a point in the mask plane and arranged in parallel at a small distance from the target object, is first impinged upon a first of the complementary zones, then the object is shifted under a second of the complementary zones, and the positioning of the beam is changed so that any deviation of the actual position of the second area of the target object to be exposed from its nominal position is determined and compensated for by tilting the beam about a point substantially in the mask plane.
Inventors
- 👤 Harald Bohlen
- 👤 Johann Greschner
- 👤 Werner Kulcke
- 👤 Peter Nehmiz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 23:32
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/20; H; H01; H01J; H01J37/00; H01J37/30; H01J37/3002; H01J37/3007
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
155 words
A method of exposing a resist layer in semiconductor fabrication by particle beam shadow printing using a mask (7) having complementary zones (7A, 7B) arranged between a source of a particle beam (10) and close to a target object (8) that is controllably moveable with respect to the beam, and wherein the beam is controllably tiltable about a point approximately in the mask plane, including the steps of: directing the beam onto a first complementary zone (7A) of the mask, shifting the exposed area (7C) of the target object under the second complementary zone (7B) of the mask, whereby the relative positioning of the particle beam with respect to the target object is changed, measuring alignment error by determining the deviation of the actual position of the exposed region (7C) from its nominal position, and compensating for the alignment error by tilting the particle beam about said point approximately in the plane of the mask.
Claim 2
Independent Claim
155 words
A method of exposing a resist layer in semiconductor fabrication by particle beam shadow printing using a mask (7) having complementary zones (7A, 7B) arranged between a source of a particle beam (10) and close to a target object (8) that is controllably moveable with respect to the beam, and wherein the beam is controllably tiltable about a point approximately in the mask plane, including the steps of: directing the beam onto a first complementary zone (7A) of the mask, shifting the exposed area (7C) of the target object under the second complementary zone (7B) of the mask, whereby the relative positioning of the particle beam with respect to the target object is changed, measuring alignment error by determining the deviation of the actual position of the exposed region (7C) from its nominal position, and compensating for the alignment error by tilting the particle beam about said point approximately in the plane of the mask.
Claim 3
Dependent Claim
40 words
The method of claim 1 wherein any identified alignment errors are compensated by moving a table (9) carrying the target object, and subsequently by tilting the particle beam (10) about a point approximately in the plane of the mask (7).
References Cited (Backward Citations)
US3326176A
Cited
US3811069A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-09-24 | 1983-03-26 | 1983-09-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-09-24 | 1987-03-26 | 1987-09-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-09-24 | 1991-03-26 | 1991-09-25 | $7700.00 | Window Closed / Lapsed |