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US4166286A Expired / Lapsed US ⏱️ 0.0 years remaining

Encapsulated plannar chip capacitor

Assignee: Tansitor Electronics Inc
•
Filing: 1977-06-13
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Granted: 1979-08-28
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Expires: 1997-06-13
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Abstract

Abstract A volumetrically efficient solid electrolyte capacitor includes a metal container electrode with a capacitor chip sealed with a conductive sealant, sealed against heat, moisture and handling damage.

Inventors

  • 👤 John G. Boissonnault

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 15:25
CPC Classifications
H; H01; H01G; H01G9/00; H01G9/15; H01G9/004; H01G9/04; H01G9/06

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 136 words
A non-hermetically sealed capacitor resistant to heat degradation up to 275 degrees centigrade comprising a processed chip; said processed chip including at least a solid electrolyte; a dielectric layer; a semi-conductive layer; a conductive layer; and an anode lead, a conductive metal container open at one end, said container including a moisture-proof conductive void-free adhesive material, said container dimensioned to snugly receive said chip, said adhesive material in said container in a volumetric amount to substantially engage said chip free of said lead without voids between said container and said chip, a moisture-proof non-conductive plastic seal, said non-conductive plastic seal adapted to seal said open end of said metal container with said anode lead extending therethrough, said adhesive material and said chip in said container with said plastic seal substantially free of all moisture and voids.
Claim 2
Dependent Claim 136 words
A non-hermetically sealed capacitor resistant to heat degradation up to 275 degrees centigrade comprising a processed chip; said processed chip including at least a solid electrolyte; a dielectric layer; a semi-conductive layer; a conductive layer; and an anode lead, a conductive metal container open at one end, said container including a moisture-proof conductive void-free adhesive material, said container dimensioned to snugly receive said chip, said adhesive material in said container in a volumetric amount to substantially engage said chip free of said lead without voids between said container and said chip, a moisture-proof non-conductive plastic seal, said non-conductive plastic seal adapted to seal said open end of said metal container with said anode lead extending therethrough, said adhesive material and said chip in said container with said plastic seal substantially free of all moisture and voids.
Claim 3
Dependent Claim 14 words
The invention of claim 1 wherein said chip further includes an outer conductive layer.
Claim 4
Dependent Claim 14 words
The invention of claim 1 wherein said container includes at least one planar surface.
Claim 5
Dependent Claim 15 words
The invention of claim 1 wherein said adhesive material is a high temperature silver epoxy.
Claim 6
Dependent Claim 11 words
The invention of claim 1 wherein said non-conductive seal is epoxy.
Claim 7
Dependent Claim 11 words
The invention of claim 1 wherein said electrolyte is a tantalum.

References Cited (Backward Citations)

US3292053A Cited
US3296505A Cited
US3611054A Cited
US3855505A Cited
US3789274A Cited
US4059887A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1982-08-27 1983-02-26 1983-08-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1986-08-27 1987-02-26 1987-08-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1990-08-27 1991-02-26 1991-08-28 $7700.00 Window Closed / Lapsed

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