Plural semiconductor devices mounted between plural heat sinks

Claim 1

A microwave diode device comprising in combination: a metal base, said base having a lower threaded portion, an upper planar surface, and a flanged portion between said upper planar surface and said lower threaded portion; a layer of electrically and thermally conductive metal disposed upon said upper planar surface of said base; a plurality of diode device bodies having a first surface in electrical and thermal contact with said first layer of electrically and thermally conductive metal; a second layer of electrically and thermally conductive metal disposed upon a second surface of said plurality of diode device bodies; a body of metal electrically and thermally in contact with a second surface of said plurality of diode device bodies, said body of metal having a larger volume than the volume of said plurality of diode device bodies; an insulating spacer having a hollow cylindrical shape, one end of said spacer coupled to said flanged portion of said base; a conducting annularly shaped flange coupled to the end of said spacer opposite said flanged portion; a flexible metal layer, center portions of said flexible metal layer being coupled thermally to said body of metal and outer portions of said flexible metal layer being coupled to said flange; and a disc-shaped lid positioned over said flexible metal layer.