Patent US4153491A successfully refreshed from Google Patents.
US4153491A
Expired / Lapsed
US
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Accelerated sintering for a green ceramic sheet
Assignee: International Business Machines Corp
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Filing: 1977-02-14
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Granted: 1979-05-08
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Expires: 1997-02-14
Abstract
Abstract A green ceramic sheet material adaptable for accelerated sintering comprising a high alumina ceramic green sheet having an average particle size greater than one micron with a close particle size distribution and being formed into a solid integrated circuit interconnection substrate by heating the ceramic green sheet directly to its sintering temperature, absent the binder burn-off step.
Inventors
- 👤 William R. Swiss
- 👤 Wayne S. Young
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 10:58
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/622; C04B35/626; C04B35/63; C04B35/632; C04B35/634; C04B35/63404; C04B35/6342; C04B35/01; C04B35/10; C04B35/111; C04B35/64
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
81 words
A method of forming a solid integrated circuit interconnection dielectric substrate comprising the steps of: (a) forming a flexible ceramic dried green sheet having a high content of ceramic particles, the said ceramic particles having a uniform distribution with an average particle size represented by point 40 on the graph of FIG. 8 with 95% of said particles falling within two microns of said point, and heating said green sheet directly to its sintering temperature for forming said solid dielectric substrate.
Claim 2
Independent Claim
81 words
A method of forming a solid integrated circuit interconnection dielectric substrate comprising the steps of: (a) forming a flexible ceramic dried green sheet having a high content of ceramic particles, the said ceramic particles having a uniform distribution with an average particle size represented by point 40 on the graph of FIG. 8 with 95% of said particles falling within two microns of said point, and heating said green sheet directly to its sintering temperature for forming said solid dielectric substrate.
Claim 3
Dependent Claim
27 words
A method of forming a solid integrated circuit interconnection dielectric substrate as in claim 1 further including the step of: (a) selecting alumina, for said ceramic particles.
Claim 4
Dependent Claim
55 words
A method of forming a solid integrated circuit interconnection dielectric substrate as in claim 2 wherein said forming step further includes the steps of: adding binder and glassy frit materials for forming a flexible ceramic dried green sheet dispersion with said binder material occupying the interstices defined by said alumina particles and glassy frit material.
Claim 5
Dependent Claim
32 words
A method of forming a solid integrated circuit interconnection dielectric substrate as in claim 3 further including the step of: (a) depositing a metallized pattern on said flexible ceramic dried green sheet.
Claim 6
Dependent Claim
34 words
A method of forming a solid integrated circuit interconnection dielectric substrate as in claim 4 further including the step of: (a) laminating a plurality of said metallized green sheets prior to said heating step.
References Cited (Backward Citations)
US3538202A
Cited
US3517093A
Cited
US3917778A
Cited
US3698923A
Cited
US3988405A
Cited
US3792139A
Cited
US3948706A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-05-07 | 1982-11-06 | 1983-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-05-07 | 1986-11-06 | 1987-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-05-07 | 1990-11-06 | 1991-05-08 | $7700.00 | Window Closed / Lapsed |