US4153491A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Accelerated sintering for a green ceramic sheet
Assignee: International Business Machines Corp
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Filing: 1977-02-14
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Granted: 1979-05-08
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Expires: 1997-02-14
Abstract
Abstract A green ceramic sheet material adaptable for accelerated sintering comprising a high alumina ceramic green sheet having an average particle size greater than one micron with a close particle size distribution and being formed into a solid integrated circuit interconnection substrate by heating the ceramic green sheet directly to its sintering temperature, absent the binder burn-off step.
Inventors
- 👤 William R. Swiss
- 👤 Wayne S. Young
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 08:48
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/622; C04B35/626; C04B35/63; C04B35/632; C04B35/634; C04B35/63404; C04B35/6342; C04B35/01; C04B35/10; C04B35/111; C04B35/64
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
81 words
A method of forming a solid integrated circuit interconnection dielectric substrate comprising the steps of: (a) forming a flexible ceramic dried green sheet having a high content of ceramic particles, the said ceramic particles having a uniform distribution with an average particle size represented by point 40 on the graph of FIG. 8 with 95% of said particles falling within two microns of said point, and heating said green sheet directly to its sintering temperature for forming said solid dielectric substrate.
Claim 2
Independent Claim
81 words
A method of forming a solid integrated circuit interconnection dielectric substrate comprising the steps of: (a) forming a flexible ceramic dried green sheet having a high content of ceramic particles, the said ceramic particles having a uniform distribution with an average particle size represented by point 40 on the graph of FIG. 8 with 95% of said particles falling within two microns of said point, and heating said green sheet directly to its sintering temperature for forming said solid dielectric substrate.
Claim 3
Dependent Claim
27 words
A method of forming a solid integrated circuit interconnection dielectric substrate as in claim 1 further including the step of: (a) selecting alumina, for said ceramic particles.
Claim 4
Dependent Claim
55 words
A method of forming a solid integrated circuit interconnection dielectric substrate as in claim 2 wherein said forming step further includes the steps of: adding binder and glassy frit materials for forming a flexible ceramic dried green sheet dispersion with said binder material occupying the interstices defined by said alumina particles and glassy frit material.
Claim 5
Dependent Claim
32 words
A method of forming a solid integrated circuit interconnection dielectric substrate as in claim 3 further including the step of: (a) depositing a metallized pattern on said flexible ceramic dried green sheet.
Claim 6
Dependent Claim
34 words
A method of forming a solid integrated circuit interconnection dielectric substrate as in claim 4 further including the step of: (a) laminating a plurality of said metallized green sheets prior to said heating step.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-05-07 | 1982-11-06 | 1983-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-05-07 | 1986-11-06 | 1987-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-05-07 | 1990-11-06 | 1991-05-08 | $7700.00 | Window Closed / Lapsed |