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US4149907A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making camera tube target by modifying Schottky barrier heights

Assignee: RCA Corp
•
Filing: 1977-09-16
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Granted: 1979-04-17
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Expires: 1997-09-16
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Abstract

Abstract A photoconductor body for a camera tube includes a semiconductor body including an overlayer of a material selected from a granular metal-insulator system. Suitable semiconductor materials are limited to those materials capable of providing Schottky barrier heights in excess of 0.9 eV. when fabricated with such overlayers and those having bandgaps greater than about 1.4 eV. A method of fabricating such photoconductive bodies is disclosed wherein a cadmium selenide semiconductor material is thermally treated to modify the Schottky barrier heights to a desired value in excess of about 0.9 eV.

Inventors

  • 👤 Christopher R. Wronski
  • 👤 Benjamin Abeles

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 01:24
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/011; H10D30/00; H10D30/60; H10D30/67; H10D30/6729; H10D30/6737; H10D30/6738; H10D30/674; H10D30/675; H10D62/00; H10D62/80; H10D62/85; H10D64/012; H10D64/0124; H10D64/60; H10D64/64

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 155 words
A method of fabricating a target for a camera tube including a semiconductor body having opposed major surfaces and having a bandgap greater than about 1.4 ev and less than about 1.8 ev and a layer of transparent conductive material along one of said major surfaces of said body, including the steps of: (a) incorporating a conductivity modifier along the other major surface of the semiconductor body to achieve a barrier height exceeding 0.9 ev and less than said bandgap by at least 0.5 ev whenever a metal body is abutted therewith which is capable of forming a metal-semiconductor blocking contact, (b) codepositing insulating material and conductive metal particles to form a layer having said conductive particles dispersed throughout along said treated surface wherein a plurality of said metal particles abut a surface region of said semiconductor body whereby a metal-semiconductor blocking contact may be achieved therebetween having a barrier height exceeding about 0.9 ev.
Claim 2
Independent Claim 155 words
A method of fabricating a target for a camera tube including a semiconductor body having opposed major surfaces and having a bandgap greater than about 1.4 ev and less than about 1.8 ev and a layer of transparent conductive material along one of said major surfaces of said body, including the steps of: (a) incorporating a conductivity modifier along the other major surface of the semiconductor body to achieve a barrier height exceeding 0.9 ev and less than said bandgap by at least 0.5 ev whenever a metal body is abutted therewith which is capable of forming a metal-semiconductor blocking contact, (b) codepositing insulating material and conductive metal particles to form a layer having said conductive particles dispersed throughout along said treated surface wherein a plurality of said metal particles abut a surface region of said semiconductor body whereby a metal-semiconductor blocking contact may be achieved therebetween having a barrier height exceeding about 0.9 ev.
Claim 3
Dependent Claim 25 words
The method of claim 1 wherein said semiconductor consists of a material selected from the group consisting of cadmium selenide, cadmium telluride, and gallium arsenide.
Claim 4
Dependent Claim 13 words
The method of claim 2 wherein said semiconductor material is polycrystalline cadmium selenide.
Claim 5
Dependent Claim 27 words
The method of claim 3 wherein said step of incorporating said conductivity modifier comprises the step of thermally treating said surface region in an atmosphere containing oxygen.
Claim 6
Dependent Claim 38 words
The method of claim 4 wherein said thermal treating step comprises thermally treating said major surface of the semiconductor body in air at a temperature of about 350° C. for a period of time of about 30 minutes.
Claim 7
Dependent Claim 58 words
The method of claim 3, wherein said step of incorporating a conductivity modifier comprises the step of depositing along said major surface of the semiconductor body at least one monolayer of a material capable of achieving said barrier height, said material being dissimilar from that of said semiconductor body and layer, whereby said barrier height may be achieved.
Claim 8
Dependent Claim 11 words
The method of claim 6 wherein said conductivity modifier comprises copper.

References Cited (Backward Citations)

US2688564A Cited
US3634692A Cited
US3928865A Cited
US3716406A Cited
US4045248A Cited
US3967151A Cited
US3964084A Cited
US4035197A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1982-04-16 1982-10-16 1983-04-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1986-04-16 1986-10-16 1987-04-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1990-04-16 1990-10-16 1991-04-17 $7700.00 Window Closed / Lapsed

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