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US4147669A Expired / Lapsed US ⏱️ 0.0 years remaining

Conductive adhesive for providing electrical and thermal conductivity

Assignee: Boeing North American Inc
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Filing: 1978-01-12
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Granted: 1979-04-03
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Expires: 1998-01-12
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Abstract

Abstract An electrically and thermally conductive adhesive containing a metal alloy dispersed in a resin is disclosed. The composition of the adhesive may include a resin mixture and a gallium-metal alloy. The composition is very stable, is a liquid at room temperature and cures at a relatively low temperature with excellent adhesion and conduction properties and is resistant to relatively high temperatures.

Inventors

  • 👤 Joseph M. Shaheen
  • 👤 Leo J. Quintana

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 07:02
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 209 words
A conductive adhesive comprising: a quantity of gallium; a first powdered conductive material in that quantity which forms a substantially eutectic mixture which is in a completely liquid state at about room temperature when combined with said quantity of gallium wherein said first conductive material is selected from the group consisting of tin, indium, and aluminum; a second powdered conductive material in that quatity which forms a curable alloy initially having the consistency of a paste and having the composition in percent by weight of from 20-80 percent of said eutectic mixture and from 20-80 percent by weight of said second conductive material when said second conductive material is combined with said eutectic mixture wherein said second conductive material is selected from the group consisting of gold, silver, and copper; and a low temperature hardening resin material in that quantity which forms said conductive adhesive when combined with said curable alloy, said conductive adhesive having the composition in percent by weight of from about 75-99 percent of said alloy and from about 1-25 percent of said resin material wherein said resin material is selected from the group consisting of epoxy, silicone rubber, and polyester; and wherein said conductive adhesive hardens to a relatively homogenous mass at relatively low termperatures.
Claim 2
Dependent Claim 209 words
A conductive adhesive comprising: a quantity of gallium; a first powdered conductive material in that quantity which forms a substantially eutectic mixture which is in a completely liquid state at about room temperature when combined with said quantity of gallium wherein said first conductive material is selected from the group consisting of tin, indium, and aluminum; a second powdered conductive material in that quatity which forms a curable alloy initially having the consistency of a paste and having the composition in percent by weight of from 20-80 percent of said eutectic mixture and from 20-80 percent by weight of said second conductive material when said second conductive material is combined with said eutectic mixture wherein said second conductive material is selected from the group consisting of gold, silver, and copper; and a low temperature hardening resin material in that quantity which forms said conductive adhesive when combined with said curable alloy, said conductive adhesive having the composition in percent by weight of from about 75-99 percent of said alloy and from about 1-25 percent of said resin material wherein said resin material is selected from the group consisting of epoxy, silicone rubber, and polyester; and wherein said conductive adhesive hardens to a relatively homogenous mass at relatively low termperatures.
Claim 3
Dependent Claim 51 words
The conductive adhesive recited in claim 1 wherein said alloy is comprised of about 40% of said eutectic mixture and about 60% of said second powdered conductive material, and said conductive adhesive is comprised of about 25% or less of said resin material and about 75% or more of said alloy.
Claim 4
Dependent Claim 19 words
The conductive adhesive recited in claim 1 wherein said eutectic mixture comprises about 89% gallium and about 11% tin.
Claim 5
Dependent Claim 41 words
The conductive adhesive recited in claim 1 wherein said eutectic mixture comprises about 49% of said conductive adhesive, said second powdered conductive material comprises about 48% of said conductive adhesive, and said resin material comprises about 3% of said conductive adhesive.
Claim 6
Dependent Claim 41 words
The conductive adhesive recited in claim 1 wherein said eutectic mixture comprises about 47% of said conductive adhesive, said second powdered conductive material comprises about 47% of said conductive adhesive, and said resin material comprises about 6% of said conductive adhesive.
Claim 7
Dependent Claim 28 words
The conductive adhesive recited in claim 1 wherein said adhesive is cured to an electrically and thermally conductive mass by heating to 125° C. for about two hours.
Claim 8
Independent Claim 200 words
A method of making a conductive adhesive material comprising the steps of: mixing a quantity of gallium with that quantity of a powdered metal which forms a substantially eutectic mixture which is in a completely liquid state at about room temperature, wherein said metal is selected from the group consisting of tin, indium, and aluminum; mixing a quantity of said eutectic mixture with that quantity of an electrically conductive powdered material which forms a curable alloy initially having the consistency of a paste and having the composition in percent by weight of from 20-80 percent of said eutectic mixture and from 20-80 percent of said powdered material wherein said powdered material is selected from the group consisting of gold, silver, and copper; and mixing of said alloy with a low temperature hardening resin material to form a relatively homogeneous conductive adhesive having the composition in percent by weight of from about 75-99 percent of said alloy and from about 1-25 percent of said resin material wherein said conductive adhesive will effectively harden and form an electrically conductive bond at a relatively low temperature and wherein said resin material is selected from the group consisting of epoxy, silcone rubber, and polyester.
Claim 9
Independent Claim 200 words
A method of making a conductive adhesive material comprising the steps of: mixing a quantity of gallium with that quantity of a powdered metal which forms a substantially eutectic mixture which is in a completely liquid state at about room temperature, wherein said metal is selected from the group consisting of tin, indium, and aluminum; mixing a quantity of said eutectic mixture with that quantity of an electrically conductive powdered material which forms a curable alloy initially having the consistency of a paste and having the composition in percent by weight of from 20-80 percent of said eutectic mixture and from 20-80 percent of said powdered material wherein said powdered material is selected from the group consisting of gold, silver, and copper; and mixing of said alloy with a low temperature hardening resin material to form a relatively homogeneous conductive adhesive having the composition in percent by weight of from about 75-99 percent of said alloy and from about 1-25 percent of said resin material wherein said conductive adhesive will effectively harden and form an electrically conductive bond at a relatively low temperature and wherein said resin material is selected from the group consisting of epoxy, silcone rubber, and polyester.

References Cited (Backward Citations)

US3134671A Cited
US3475213A Cited
US3554738A Cited
US4015981A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1982-04-02 1982-10-02 1983-04-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1986-04-02 1986-10-02 1987-04-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1990-04-02 1990-10-02 1991-04-03 $7700.00 Window Closed / Lapsed

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