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US4136216A
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US
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Non-precious metal colloidal dispersions for electroless metal deposition
Assignee: Surface Technology Inc
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Filing: 1976-10-12
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Granted: 1979-01-23
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Expires: 1996-10-12
Abstract
Abstract Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.
Inventors
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 16:58
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 55
Claim 1
Independent Claim
88 words
An improved process for the preparation of non-conductor substrates for electroless metal or alloy plating thereon comprising contacting said substrate with a catalytic non-precious metal colloidal composition wherein said catalytic non-precious metal is the admixture of copper and at least one metal selected from the group consisting of nickel, cobalt, and iron and wherein said colloidal composition is formed by interaction of the metal ions with a precipitating agent and wherein said precipitating agent is selected from the group of hypophosphorus acid and its derivatives and hydroxyl ions.
Claim 2
Dependent Claim
88 words
An improved process for the preparation of non-conductor substrates for electroless metal or alloy plating thereon comprising contacting said substrate with a catalytic non-precious metal colloidal composition wherein said catalytic non-precious metal is the admixture of copper and at least one metal selected from the group consisting of nickel, cobalt, and iron and wherein said colloidal composition is formed by interaction of the metal ions with a precipitating agent and wherein said precipitating agent is selected from the group of hypophosphorus acid and its derivatives and hydroxyl ions.
Claim 3
Dependent Claim
15 words
The process according to claim 1 wherein the colloidal composition further contains a colloidal stabilizer.
Claim 4
Dependent Claim
16 words
The process according to claim 1 wherein the catalytic non-precious metal is part of an alloy.
Claim 5
Dependent Claim
16 words
The process according to claim 1 wherein the catalytic non-precious metal is in an elemental state.
Claim 6
Dependent Claim
27 words
The process according to claim 1 further containing the step of activation thereby activating the catalytic sites towards electroless plating wherein said activation comprises a reducing composition.
Claim 7
Dependent Claim
23 words
The process according to claim 1 wherein said colloidal composition is derived by the dispersion of a powder in a suitable solvent medium.
Claim 8
Dependent Claim
16 words
The process according to claim 1 wherein said colloidal composition further containing a mild reducing agent.
Claim 9
Dependent Claim
88 words
An improved process for the metallization of non-conductor substrate by electroless plating thereon comprising (a) contacting said substrate with a colloidal composition said composition comprised of a colloid of a catalytic non-precious metal wherein said metal is higher in the EMF series in comparison to said platable metal ion present in the electroless bath with said colloid reduced after the substrate has been treated to a lower or elemental state prior to the electroless plating build-up, and b) plating from an electroless bath comprising said platable metal ion.
Claim 10
Dependent Claim
88 words
An improved process for the metallization of non-conductor substrate by electroless plating thereon comprising (a) contacting said substrate with a colloidal composition said composition comprised of a colloid of a catalytic non-precious metal wherein said metal is higher in the EMF series in comparison to said platable metal ion present in the electroless bath with said colloid reduced after the substrate has been treated to a lower or elemental state prior to the electroless plating build-up, and b) plating from an electroless bath comprising said platable metal ion.
Claim 11
Dependent Claim
16 words
The process according to claim 8 wherein said colloidal catalytic composition further contains a colloid stabilizer.
Claim 12
Dependent Claim
17 words
The process according to claim 8 wherein said colloidal catalytic composition further containing a mild reducing agent.
Claim 13
Dependent Claim
23 words
The process according to claim 8 wherein said colloidal catalytic composition is derived by the dispersion of a powder in a suitable medium.
Claim 14
Dependent Claim
59 words
An improved process of electroless metal deposition of dielectric substrates comprising the steps of, (A) Coating the surface of the substrate with colloid of at least one non-precious elemental metal wherein said elemental metal is selected from the group consisting of copper, cobalt, iron and nickel and mixtures thereof, and (B) Immersing the substrate in an electroless plating composition.
Claim 15
Dependent Claim
59 words
An improved process of electroless metal deposition of dielectric substrates comprising the steps of, (A) Coating the surface of the substrate with colloid of at least one non-precious elemental metal wherein said elemental metal is selected from the group consisting of copper, cobalt, iron and nickel and mixtures thereof, and (B) Immersing the substrate in an electroless plating composition.
Claim 16
Dependent Claim
18 words
The process recited in claim 12 including the step of activating the substrate by reduction subsequent to coating.
Claim 17
Dependent Claim
15 words
The process according to claim 12 wherein said colloid further containing a mild reducing agent.
Claim 18
Dependent Claim
21 words
The process according to claim 12 wherein said colloid is derived by the dispersion of a powder in a suitable medium.
Claim 19
Dependent Claim
78 words
An improved process for electroless plating of a non-conductor substrate comprising (a) contacting the non-conductor with a colloidal catalytic composition of non-noble elemental metal and/or alloy thereof wherein said metal is catalytic for electroless metal initiation and further wherein said composition was previously contacted with water and air; and subsequently (b) contacting the treated non-conductor with a composition comprising a reducing agent capable of interacting with the treated non-conductor and thereby rendering said non-conductor active for electroless build-up.
Claim 20
Dependent Claim
78 words
An improved process for electroless plating of a non-conductor substrate comprising (a) contacting the non-conductor with a colloidal catalytic composition of non-noble elemental metal and/or alloy thereof wherein said metal is catalytic for electroless metal initiation and further wherein said composition was previously contacted with water and air; and subsequently (b) contacting the treated non-conductor with a composition comprising a reducing agent capable of interacting with the treated non-conductor and thereby rendering said non-conductor active for electroless build-up.
Claim 21
Dependent Claim
26 words
The process according to claim 16 wherein said non-noble metal is selected from the group consisting of copper, cobalt, nickel and iron, mixtures and alloys thereof.
Claim 22
Dependent Claim
17 words
The process according to claim 16 wherein said reducing agent is part of the electroless plating bath.
Claim 23
Dependent Claim
12 words
The process according to claim 16 wherein said non-conductor substrate is ABS.
Claim 24
Dependent Claim
18 words
The process according to claim 16 wherein said electroless build-up is carried forth utilizing an electroless copper composition.
Claim 25
Dependent Claim
17 words
The process according to claim 16 wherein said colloidal composition further contains at least one colloid stabilizer.
Claim 26
Dependent Claim
14 words
The process according to claim 16 wherein said colloidal catalytic composition comprises negative colloids.
Claim 27
Dependent Claim
14 words
The process according to claim 16 wherein said colloidal catalytic composition comprises positive colloids.
Claim 28
Dependent Claim
17 words
The process according to claim 16 wherein said colloidal composition is prepared by a chemical precipitation method.
Claim 29
Dependent Claim
46 words
The process according to claim 16 wherein said colloidal composition was prepared by the admixing of a soluble metal compound comprising a catalytic metal along with a reducing agent capable of homogeneous reduction of the metal ions within said metal compound to a lower oxidation state.
Claim 30
Dependent Claim
16 words
The process according to claim 16 wherein said catalytic composition further containing a mild reducing agent.
Claim 31
Dependent Claim
22 words
The process according to claim 16 wherein said catalytic composition is derived by the dispersion of a powder in a suitable medium.
Claim 32
Dependent Claim
56 words
An improved process for the preparation of non-conductor substrates prior to electroless metal deposition comprising the steps of: a. Coating the surface of the substrate with a colloidal composition comprising cuprous oxide, and b. Contacting the coated surface with a composition comprising a reducing agent capable of reducing the cuprous oxidation state to the metallic state.
Claim 33
Dependent Claim
56 words
An improved process for the preparation of non-conductor substrates prior to electroless metal deposition comprising the steps of: a. Coating the surface of the substrate with a colloidal composition comprising cuprous oxide, and b. Contacting the coated surface with a composition comprising a reducing agent capable of reducing the cuprous oxidation state to the metallic state.
Claim 34
Dependent Claim
97 words
An improved process for the preparation of non-conductor substrates for electroless plating thereon comprising the contacting of said substrate with a colloidal catalytic composition, said composition comprised of a colloid of a catalytic non-precious metal compound wherein said metal is higher in the EMF series in comparison to said platable metal ion(s) present in the electroless bath, and wherein said non-precious metal compound of said colloid is reduced to a lower or elemental state prior to the electroless plating build-up and wherein said colloidal composition is derived by the dispersion of a powder in a suitable medium.
Claim 35
Dependent Claim
97 words
An improved process for the preparation of non-conductor substrates for electroless plating thereon comprising the contacting of said substrate with a colloidal catalytic composition, said composition comprised of a colloid of a catalytic non-precious metal compound wherein said metal is higher in the EMF series in comparison to said platable metal ion(s) present in the electroless bath, and wherein said non-precious metal compound of said colloid is reduced to a lower or elemental state prior to the electroless plating build-up and wherein said colloidal composition is derived by the dispersion of a powder in a suitable medium.
Claim 36
Dependent Claim
105 words
An improved process for electroless plating a non-conductor substrate comprising the steps of (a) contacting the non-conductor with a stabilized colloidal composition of non-noble metal selected from the group comprising hydrous oxides, metals and alloys and mixtures thereof and wherein said metal is catalytic for electroless plating initiation and further wherein said composition is derived by the dispersion of a powder in a suitable medium and is further permitted to be contacted with water and air, and (b) contacting the treated non-conductor with a composition comprising a reducing agent capable of interacting with the treated non-conductor and thereby rendering said non-conductor active for electroless build-up.
Claim 37
Dependent Claim
105 words
An improved process for electroless plating a non-conductor substrate comprising the steps of (a) contacting the non-conductor with a stabilized colloidal composition of non-noble metal selected from the group comprising hydrous oxides, metals and alloys and mixtures thereof and wherein said metal is catalytic for electroless plating initiation and further wherein said composition is derived by the dispersion of a powder in a suitable medium and is further permitted to be contacted with water and air, and (b) contacting the treated non-conductor with a composition comprising a reducing agent capable of interacting with the treated non-conductor and thereby rendering said non-conductor active for electroless build-up.
Claim 38
Dependent Claim
13 words
The process according to claim 30 wherein said colloidal composition comprises positive colloids.
Claim 39
Dependent Claim
13 words
The process according to claim 30 wherein said colloidal composition comprises negative colloids.
Claim 40
Dependent Claim
83 words
An improved process for preparing dielectric substrates for electroless plating comprising a. coating the surface of a dielectric substrate to be plated with a hydrous oxide colloid of a non-precious metal selected from the group consisting of cobalt, iron, nickel and copper and alloys of said metals, and mixtures thereof, and at least one colloid stabilizer, and b. reducing said metal to a lower or zero valence state with a chemical reducing agent to effect a catalytic surface receptive to electroless plating initiation.
Claim 41
Dependent Claim
83 words
An improved process for preparing dielectric substrates for electroless plating comprising a. coating the surface of a dielectric substrate to be plated with a hydrous oxide colloid of a non-precious metal selected from the group consisting of cobalt, iron, nickel and copper and alloys of said metals, and mixtures thereof, and at least one colloid stabilizer, and b. reducing said metal to a lower or zero valence state with a chemical reducing agent to effect a catalytic surface receptive to electroless plating initiation.
Claim 42
Dependent Claim
26 words
The process of claim 33 wherein said reducing agent is selected from the group consisting of dimethylamine borane, diethylhydroxylamine, N-alkyl-borozones, N-alkyl-borozoles, borozenes, borozines, and mixtures thereof.
Claim 43
Dependent Claim
24 words
The process of claim 33 wherein said reducing agent is selected from the group consisting of the alkali metal and alkaline earth metal borohydrides.
Claim 44
Dependent Claim
21 words
The process of claim 33, wherein said dielectric substrate is coated by immersion in a bath of said hydrous oxide colloid.
Claim 45
Dependent Claim
23 words
The process of claim 33, wherein said metal is reduced by immersion of said dielectric substrate into aqueous bath of said reducing agent.
Claim 46
Dependent Claim
11 words
The process of claim 33, wherein said dielectric substrate is ABS.
Claim 47
Dependent Claim
14 words
The process of claim 33 wherein said dielectric substrate is etched prior to coating.
Claim 48
Dependent Claim
83 words
An improved process for the electroless plating of dielectric substrates comprising a. coating the surface of a dielectric substrate with a hydrous oxide colloid of a non-precious metal selected from the group consisting of copper, nickel, iron and cobalt and alloys of said metals, and mixtures thereof and further containing at least one colloid stabilizer; b. reducing the valence state of said metal to effect a catalytic surface receptive to electroless plating; and c. contacting the catalytic surface with an electroless plating bath.
Claim 49
Dependent Claim
83 words
An improved process for the electroless plating of dielectric substrates comprising a. coating the surface of a dielectric substrate with a hydrous oxide colloid of a non-precious metal selected from the group consisting of copper, nickel, iron and cobalt and alloys of said metals, and mixtures thereof and further containing at least one colloid stabilizer; b. reducing the valence state of said metal to effect a catalytic surface receptive to electroless plating; and c. contacting the catalytic surface with an electroless plating bath.
Claim 50
Dependent Claim
14 words
The process of claim 40, wherein said dielectric substrate is etched prior to coating.
Claim 51
Dependent Claim
34 words
The process of claim 40, wherein the valence state of said metal is reduced with a reducing agent selected from the group consisting of dimethylamine borane, diethylhydroxylomine, N-alkyl-borazones, N-alkyl-borazoles, borazenes, borazines, and mixtures thereof.
Claim 52
Dependent Claim
32 words
The process of claim 40, wherein the valence state of said metal is reduced with a reducing agent selected from the group consisting of the alkali metal and alkaline earth metal borohydrides.
Claim 53
Dependent Claim
11 words
The process of claim 40, wherein said dielectric substrate is ABS.
Claim 54
Dependent Claim
89 words
An improved process for preparing dielectric substrates for electroless plating comprising a. coating the surface of a dielectric substrate to be plated with a hydrous oxide colloid of a non-precious metal selected from the group consisting of cobalt, iron, nickel and copper and alloys of said metals, and mixtures thereof and at least one colloid stabilizer; b. rinsing said substrate to remove excess colloid; and c. reducing said metal to a lower or zero valence state with a chemical reducing agent to render the surface catalytic for electroless plating.
Claim 55
Dependent Claim
89 words
An improved process for preparing dielectric substrates for electroless plating comprising a. coating the surface of a dielectric substrate to be plated with a hydrous oxide colloid of a non-precious metal selected from the group consisting of cobalt, iron, nickel and copper and alloys of said metals, and mixtures thereof and at least one colloid stabilizer; b. rinsing said substrate to remove excess colloid; and c. reducing said metal to a lower or zero valence state with a chemical reducing agent to render the surface catalytic for electroless plating.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-01-22 | 1982-07-24 | 1983-01-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-01-22 | 1986-07-24 | 1987-01-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-01-22 | 1990-07-24 | 1991-01-23 | $7700.00 | Window Closed / Lapsed |