Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
110 words
A wafer assembly for providing a permanent two-dimensional wafer indexing and mapping system comprising a wafer having a first side and a second side, a grid pattern engraved into the surface of one side of said wafer, said grid pattern dividing said wafer into a plurality of uniform size cells, a coding system in said cells engraved into the surface of one side of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, and an orientation system including at least two marks of different dimensions for alignment purposes in said cells engraved into the surface of one side of said wafer.
Claim 2
Dependent Claim
110 words
A wafer assembly for providing a permanent two-dimensional wafer indexing and mapping system comprising a wafer having a first side and a second side, a grid pattern engraved into the surface of one side of said wafer, said grid pattern dividing said wafer into a plurality of uniform size cells, a coding system in said cells engraved into the surface of one side of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, and an orientation system including at least two marks of different dimensions for alignment purposes in said cells engraved into the surface of one side of said wafer.
Claim 3
Dependent Claim
26 words
A wafer assembly as described in claim 1 wherein said cells contain a center crossline positioned to subdivide said cells into four quadrants of equal dimensions.
Claim 4
Dependent Claim
27 words
A wafer assembly as described in claim 1, wherein said orientation system includes a first mark which is parallel to a first side of said grid pattern.
Claim 5
Dependent Claim
27 words
A wafer assembly as described in claim 3 wherein said orientation system includes a second mark which is perpendicular to said first side of said grid pattern.
Claim 6
Dependent Claim
101 words
A wafer assembly for providing a permanent two-dimensional wafer indexing and mapping system comprising a wafer having a first side and a second side, a grid pattern engraved into the surface of one side of said wafer, said grid pattern dividing said wafer into a plurality of uniform size cells, a binary coding system in said cells engraved into the surface of one side of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, and an orientation system including at least two marks of different dimensions for alignment purposes in said cells.
Claim 7
Dependent Claim
101 words
A wafer assembly for providing a permanent two-dimensional wafer indexing and mapping system comprising a wafer having a first side and a second side, a grid pattern engraved into the surface of one side of said wafer, said grid pattern dividing said wafer into a plurality of uniform size cells, a binary coding system in said cells engraved into the surface of one side of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, and an orientation system including at least two marks of different dimensions for alignment purposes in said cells.
Claim 8
Dependent Claim
25 words
A wafer assembly as described in claim 5 wherein said binary coding system describes the column in the grid pattern where said cell is located.
Claim 9
Dependent Claim
25 words
A wafer assembly as described in claim 5 wherein said binary coding system describes the row in the grid pattern where said cell is located.
Claim 10
Independent Claim
100 words
A method of precisely locating defects in a wafer comprising the steps of: engraving a permanent grid pattern which forms a plurality of uniform size cells as a integral part into one side of a water, engraving a coding system into the surface of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, engraving an orientation system including at least two marks of different dimensions for alignment purposes in said cells, and identifying the position of said defects in said grid pattern by utilizing said coding system and said orientation system.
Claim 11
Independent Claim
100 words
A method of precisely locating defects in a wafer comprising the steps of: engraving a permanent grid pattern which forms a plurality of uniform size cells as a integral part into one side of a water, engraving a coding system into the surface of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, engraving an orientation system including at least two marks of different dimensions for alignment purposes in said cells, and identifying the position of said defects in said grid pattern by utilizing said coding system and said orientation system.