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US4134066A Expired / Lapsed US ⏱️ 0.0 years remaining

Wafer indexing system using a grid pattern and coding and orientation marks in each grid cell

Assignee: International Business Machines Corp
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Filing: 1977-03-24
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Granted: 1979-01-09
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Expires: 1997-03-24
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Abstract

Abstract A wafer indexing and mapping system is useful for precisely locating artifacts, defects, and fabricated structural components on a wafer. A permanent micrometer grid pattern is applied to the backside of the wafer, for example, a transparent bubble wafer. The grid pattern forms an array of uniform size cells, for example, 40 unit cells wide by 40 unit cells long. Each unit cell is divided into smaller units on each side. Each cell contains a coding or indexing system to identify the row and column of the cell in the grid pattern. The grid pattern contains orientation bars which identify orientation with respect to particular wafer reference lines. The simultaneous viewing of the wafer and the grid pattern permits an accurate permanent mapping of the artifacts, defects, and fabricated structural components on the wafer, as well as on the individual small chips formed by dicing the wafer.

Inventors

  • 👤 Marcel J. Vogel
  • 👤 Siegfried F. Vogel

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 12:59
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70483; G01; G01B; G01B11/00; G01B11/30; G01B11/303; G01B3/00; G01B3/02; H; H10; H10W; H10W46/00; H10W46/501; Y; Y10; Y10S; Y10S438/00; Y10S438/975

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 110 words
A wafer assembly for providing a permanent two-dimensional wafer indexing and mapping system comprising a wafer having a first side and a second side, a grid pattern engraved into the surface of one side of said wafer, said grid pattern dividing said wafer into a plurality of uniform size cells, a coding system in said cells engraved into the surface of one side of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, and an orientation system including at least two marks of different dimensions for alignment purposes in said cells engraved into the surface of one side of said wafer.
Claim 2
Dependent Claim 110 words
A wafer assembly for providing a permanent two-dimensional wafer indexing and mapping system comprising a wafer having a first side and a second side, a grid pattern engraved into the surface of one side of said wafer, said grid pattern dividing said wafer into a plurality of uniform size cells, a coding system in said cells engraved into the surface of one side of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, and an orientation system including at least two marks of different dimensions for alignment purposes in said cells engraved into the surface of one side of said wafer.
Claim 3
Dependent Claim 26 words
A wafer assembly as described in claim 1 wherein said cells contain a center crossline positioned to subdivide said cells into four quadrants of equal dimensions.
Claim 4
Dependent Claim 27 words
A wafer assembly as described in claim 1, wherein said orientation system includes a first mark which is parallel to a first side of said grid pattern.
Claim 5
Dependent Claim 27 words
A wafer assembly as described in claim 3 wherein said orientation system includes a second mark which is perpendicular to said first side of said grid pattern.
Claim 6
Dependent Claim 101 words
A wafer assembly for providing a permanent two-dimensional wafer indexing and mapping system comprising a wafer having a first side and a second side, a grid pattern engraved into the surface of one side of said wafer, said grid pattern dividing said wafer into a plurality of uniform size cells, a binary coding system in said cells engraved into the surface of one side of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, and an orientation system including at least two marks of different dimensions for alignment purposes in said cells.
Claim 7
Dependent Claim 101 words
A wafer assembly for providing a permanent two-dimensional wafer indexing and mapping system comprising a wafer having a first side and a second side, a grid pattern engraved into the surface of one side of said wafer, said grid pattern dividing said wafer into a plurality of uniform size cells, a binary coding system in said cells engraved into the surface of one side of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, and an orientation system including at least two marks of different dimensions for alignment purposes in said cells.
Claim 8
Dependent Claim 25 words
A wafer assembly as described in claim 5 wherein said binary coding system describes the column in the grid pattern where said cell is located.
Claim 9
Dependent Claim 25 words
A wafer assembly as described in claim 5 wherein said binary coding system describes the row in the grid pattern where said cell is located.
Claim 10
Independent Claim 100 words
A method of precisely locating defects in a wafer comprising the steps of: engraving a permanent grid pattern which forms a plurality of uniform size cells as a integral part into one side of a water, engraving a coding system into the surface of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, engraving an orientation system including at least two marks of different dimensions for alignment purposes in said cells, and identifying the position of said defects in said grid pattern by utilizing said coding system and said orientation system.
Claim 11
Independent Claim 100 words
A method of precisely locating defects in a wafer comprising the steps of: engraving a permanent grid pattern which forms a plurality of uniform size cells as a integral part into one side of a water, engraving a coding system into the surface of said wafer which uniquely identifies each cell and defines the exact location of each cell of said wafer, engraving an orientation system including at least two marks of different dimensions for alignment purposes in said cells, and identifying the position of said defects in said grid pattern by utilizing said coding system and said orientation system.

References Cited (Backward Citations)

US3259037A Cited
US3607347A Cited
DE2226149A1 Cited
US3742229A Cited
US3863764A Cited
US3998639A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1982-01-08 1982-07-10 1983-01-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1986-01-08 1986-07-10 1987-01-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1990-01-08 1990-07-10 1991-01-09 $7700.00 Window Closed / Lapsed

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