Semiconductor devices

Claim 2

A semiconductor device comprising: a substrate having an outer surface and made of a semiconductor material having a first type of conductivity; a region in said substrate at said outer surface of said substrate having a second type of conductivity, said region being doped with a doping agent to form a PN junction with said material of said first type of conductivity; and a layer on said outer surface of said substrate covering at least a major part of said region of said second type of conductivity, said layer being made of a material having a permeability to said doping agent under normal operating and storage conditions of the semiconductor device which is significantly lower than its permeability to said doping agent under the operating conditions of at least one method of diffusing said doping agent onto said substrate, said layer at least principally consisting of cadmium telluride.

Claim 3

A semiconductor device comprising: a substrate made of a material having a first type of conductivity, said substrate having an outer surface and being made of an alloy having the formula Cd x Hg 1-x Te, where x is a non-zero number less than 1; and a region in said substrate at said outer surface of said substrate, said region having a second type of conductivity and forming a junction with said material of said first type of conductivity; said device further including a layer on said outer surface of said substrate convering at least a major part of said region of said second type of conductivity, said layer consisting at least mainly of cadmium telluride and said device further including an electrical contact which extends above said layer.

Claim 4

A semiconductor device comprising: a substrate made of a material having a first type of conductivity, said substrate having an outer surface and being made of an alloy having the formula Cd x Hg 1-x Te, where x is a non-zero number less than 1; and a region in said substrate at said outer surface of said substrate, said region having a second type of conductivity and forming a junction with said material of said first type of conductivity; said device further including a layer on said outer surface of said substrate convering at least a major part of said region of said second type of conductivity, said layer consisting at least mainly of cadmium telluride and said device further including an electrical contact which extends above said layer.

Claim 5

A semiconductor device as claimed in claim 2, wherein said substrate has type P conductivity and said region has type N conductivity, said region being doped with a doping agent.

Claim 6

A semiconductor device as claimed in claim 3, wherein said doping agent is mercury.

Claim 7

A semiconductor device as claimed in claim 3, wherein said doping agent is indium.

Claim 8

A semiconductor device as claimed in claim 2, wherein apertures are formed in said surface layer over said region having said second type of conductivity, metal being deposited in said apertures and extending above said layer to form said electrical contact.

Claim 9

A semiconductor device as claimed in claim 2, wherein said layer has a thickness between 500 and 5,000 A.

Claim 10

A semiconductor device as claimed in claim 2, said device further comprising a portion of said outer surface of said substrate having said first type of conductivity, and a second layer on said surface portion, said second layer consisting at least mainly of cadmium telluride.

Claim 11

A semiconductor device as claimed in claim 8, further comprising a masking layer of insulating material over said second layer.

Claim 12

A semiconductor device as claimed in claim 8, wherein said second layer covers part of said junction which is level with said outer surface of said substrate.

Claim 13

A semiconductor device as claimed in claim 8, wherein said layer and said second layer form a single layer on said outer surface of said substrate.

Claim 14

A semiconductor device comprising: a substrate made of a material having a first type of conductivity, said substrate having an outer surface and being made of an alloy of a first constituent having a first forbidden band width and a second constituent having a second forbidden band width greater than said first forbidden band width, the width of the forbidden band of said alloy being dependent on the relative proportions of said first and second constituents in said alloy; and a region in said substrate at said outer surface of said substrate, said region having a second type of conductivity and forming a junction with said material of said first type of conductivity; said device including a layer on said outer surface of said substrate covering at least a major part of said region of said second type of conductivity, said layer consisting at least mainly of said second constituent of said alloy and a metallic electrical contact which extends through said layer to make contact with said outer surface of said substrate and which includes a terminal portion which extends above said layer.

Claim 15

A semiconductor device comprising: a substrate made of a material having a first type of conductivity, said substrate having an outer surface and being made of an alloy of a first constituent having a first forbidden band width and a second constituent having a second forbidden band width greater than said first forbidden band width, the width of the forbidden band of said alloy being dependent on the relative proportions of said first and second constituents in said alloy; and a region in said substrate at said outer surface of said substrate, said region having a second type of conductivity and forming a junction with said material of said first type of conductivity; said device including a layer on said outer surface of said substrate covering at least a major part of said region of said second type of conductivity, said layer consisting at least mainly of said second constituent of said alloy and a metallic electrical contact which extends through said layer to make contact with said outer surface of said substrate and which includes a terminal portion which extends above said layer.