Patent US4131699A successfully refreshed from Google Patents.
US4131699A
Expired / Lapsed
US
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Method of preparation and use of electroless plating catalysts
Assignee: Individual
•
Filing: 1977-08-01
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Granted: 1978-12-26
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Expires: 1997-08-01
Abstract
Abstract A method for the formation of novel colloidal catalytic electroless plating compositions comprises admixing a highly stable non active (weakly active) colloidal dispersion with a reactivity modifier. The admixture so formed is used in electroless plating processes wherein a substrate is contacted with the novel colloidal catalytic composition, rinsed, contacted with a reducing or activating solution (which may be optional) and then contacted with an electroless plating solution.
Inventors
- 👤 Nathan Feldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 20:39
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 54
Claim 1
Independent Claim
118 words
A process for electroless or chemical plating onto a non-conductor substrate comprises the step of contacting said substrate in an activated colloidal dispersion wherein said colloidal dispersion comprises a metal capable of electroless or chemical plating initiation and wherein said activated colloidal dispersion is derived from the admixing of a weakly active colloidal dispersion of said metal or alloy or compound of said metal containing a colloid stabilizer with a reactivity modifier thereby increasing the activity of said weakly active colloidal dispersion and wherein said colloid stabilizer and said reactivity modifier are different materials and further wherein said reactivity modifier is inherently a colloid stabilizer and thus said activated colloidal dispersion comprises of at least two colloidal stabilizers.
Claim 2
Dependent Claim
118 words
A process for electroless or chemical plating onto a non-conductor substrate comprises the step of contacting said substrate in an activated colloidal dispersion wherein said colloidal dispersion comprises a metal capable of electroless or chemical plating initiation and wherein said activated colloidal dispersion is derived from the admixing of a weakly active colloidal dispersion of said metal or alloy or compound of said metal containing a colloid stabilizer with a reactivity modifier thereby increasing the activity of said weakly active colloidal dispersion and wherein said colloid stabilizer and said reactivity modifier are different materials and further wherein said reactivity modifier is inherently a colloid stabilizer and thus said activated colloidal dispersion comprises of at least two colloidal stabilizers.
Claim 3
Dependent Claim
28 words
The process according to claim 1 wherein said weakly active colloidal dispersion is prepared by the nucleation of the insoluble phase in the presence of a secondary colloid.
Claim 4
Dependent Claim
13 words
The process according to claim 2 wherein said secondary colloid is a protein.
Claim 5
Dependent Claim
13 words
The process according to claim 1 wherein said electroless plating is of copper.
Claim 6
Dependent Claim
13 words
The process according to claim 1 wherein said electroless plating is of nickel.
Claim 7
Dependent Claim
22 words
The process according to claim 1 wherein said metal is selected from the group consisting of copper, cobalt, nickel, palladium and iron.
Claim 8
Dependent Claim
37 words
The process according to claim 6 further containing a metal selected from the group consisting of cobalt, nickel and iron, and further wherein the concentration of said copper is in excess to any of the other metal(s).
Claim 9
Dependent Claim
11 words
The process according to claim 1 wherein said metal is copper.
Claim 10
Dependent Claim
20 words
The process according to claim 8 further containing a metal selected from the group consisting of cobalt, nickel and iron.
Claim 11
Dependent Claim
14 words
The process according to claim 1 wherein said activated colloid is of negative charge.
Claim 12
Dependent Claim
14 words
The process according to claim 1 wherein said activated colloid is of positive charge.
Claim 13
Dependent Claim
25 words
The process according to claim 1 wherein said weakly active colloidal dispersion is prepared through the chemical interaction of the catalytic metals with soluble hydrides.
Claim 14
Dependent Claim
12 words
The process according to claim 1 further containing the step of activation.
Claim 15
Dependent Claim
14 words
The process according to claim 13 further containing the step of electroless metal deposition.
Claim 16
Dependent Claim
13 words
The process according to claim 1 further containing the step of metal deposition.
Claim 17
Dependent Claim
30 words
The process according to claim 1 wherein said reactivity modifier is selected from the group consisting of surfactants, alcohol, dispersants, mercapto-benzotriazole and its derivatives and soluble halides and mixtures thereof.
Claim 18
Dependent Claim
20 words
The process according to claim 1 wherein said reactivity modifier is capable of adsorbing onto the nucleus of the colloid.
Claim 19
Dependent Claim
17 words
The process according to claim 1 wherein said weakly active colloidal dispersion contains an hydrous oxide colloid.
Claim 20
Dependent Claim
21 words
The process according to claim 1 further containing the step of activation and wherein said activation is via a reduction step.
Claim 21
Dependent Claim
12 words
The process according to claim 1 wherein said non-conductor substrate is ABS.
Claim 22
Dependent Claim
13 words
The process according to claim 1 wherein said colloid stabilizer is gum arabic.
Claim 23
Dependent Claim
14 words
The process according to claim 1 wherein said colloid stabilizer is a soluble lignosulfonate.
Claim 24
Dependent Claim
23 words
The process according to claim 1 wherein said weakly active colloidal dispersion is derived through the nucleation reaction carried forth above room temperature.
Claim 25
Dependent Claim
13 words
The process according to claim 1 further containing the step of water rinsing.
Claim 26
Dependent Claim
11 words
The process according to claim 1 wherein said substrate is ABS.
Claim 27
Dependent Claim
30 words
The process according to claim 1 wherein the admixing of the weakly active colloidal dispersion with the reactivity modifier further resuits in a reduction of the colloid particle size distribution.
Claim 28
Dependent Claim
106 words
A process for electroless or chemical plating onto a non-conductor substrate comprises the step of contacting said substrate in an activated colloidal dispersion wherein said colloidal dispersion comprises a metal capable of electroless or chemical plating initiation and wherein said activated colloidal dispersion is derived from the admixing of a weakly active colloidal dispersion of said metal or alloy or compound of said metal containing a colloid stabilizer with an adsorbant thereby increasing the activity of said weakly active colloidal dispersion and wherein said colloid stabilizer and said adsorbant are different materials, and further wherein said adsorbant is capable of adsorbing onto said weakly active colloid.
Claim 29
Dependent Claim
106 words
A process for electroless or chemical plating onto a non-conductor substrate comprises the step of contacting said substrate in an activated colloidal dispersion wherein said colloidal dispersion comprises a metal capable of electroless or chemical plating initiation and wherein said activated colloidal dispersion is derived from the admixing of a weakly active colloidal dispersion of said metal or alloy or compound of said metal containing a colloid stabilizer with an adsorbant thereby increasing the activity of said weakly active colloidal dispersion and wherein said colloid stabilizer and said adsorbant are different materials, and further wherein said adsorbant is capable of adsorbing onto said weakly active colloid.
Claim 30
Dependent Claim
23 words
The process according to claim 27 wherein said catalytic metal is selected from the group consisting of copper, cobalt, nickel, iron and palladium.
Claim 31
Dependent Claim
14 words
The process according to claim 27 wherein said activated colloid is of negative charge.
Claim 32
Dependent Claim
14 words
The process according to claim 27 wherein said activated colloid is of positive charge.
Claim 33
Dependent Claim
35 words
The process according to claim 27 wherein said weakly active colloidal dispersion is prepared by the nucleation of the colloid through the chemical interaction of a compound bearing said catalytic metal with a soluble hydride.
Claim 34
Dependent Claim
13 words
The process according to claim 27 further containing the step of metal deposition.
Claim 35
Dependent Claim
11 words
The process according to claim 27 wherein said substrate is ABS.
Claim 36
Dependent Claim
14 words
The process according to claim 27 wherein said colloid stabilizer is a soluble lignosulfonate.
Claim 37
Dependent Claim
15 words
The process according to claim 27 wherein said activated colloidal dispersion is of a metal.
Claim 38
Dependent Claim
23 words
The process according to claim 27 wherein said activated colloidal dispersion is of an alloy comprising a metal catalytic for electroless metal initiation.
Claim 39
Dependent Claim
23 words
The process according to claim 27 wherein said activated colloidal dispersion is of a compound comprising a metal catalytic for electroless metal initiation.
Claim 40
Dependent Claim
17 words
The process according to claim 27 wherein said weakly active colloidal dispersion was nucleated above room temperature.
Claim 41
Dependent Claim
13 words
The process according to claim 27 further containing the step of water rinsing.
Claim 42
Dependent Claim
27 words
The process according to claim 27 wherein said catalytic metal is copper and further contains a metal selected from the group consisting of cobalt, nickel and iron.
Claim 43
Dependent Claim
22 words
The process according to claim 40 wherein the concentration of copper is greater than the concentration of cobalt or nickel or iron.
Claim 44
Dependent Claim
27 words
The process according to claim 37 wherein the admixing of the weakly active colloidal dispersion with said adsorbant further results in a reduction in particle size distribution.
Claim 45
Dependent Claim
111 words
A process for electroless or chemical plating a non-conductor substrate which comprises the steps of: a. contacting said substrate with a colloidal dispersion wherein said colloidal dispersion comprises a metal capable of electroless or chemical plating initiation and wherein said dispersion is a dispersion of said metal or alloy or compound of said metal containing a colloid stabilizer and further said colloidal dispersion is highly stable weakly active when used alone in said process, and b. contacting the treated substrate with a composition comprising a reactivity modifier thereby increasing the activity of the treated substrate for said plating process and wherein said colloid stabilizer and said reactivity modifier are different materials.
Claim 46
Dependent Claim
111 words
A process for electroless or chemical plating a non-conductor substrate which comprises the steps of: a. contacting said substrate with a colloidal dispersion wherein said colloidal dispersion comprises a metal capable of electroless or chemical plating initiation and wherein said dispersion is a dispersion of said metal or alloy or compound of said metal containing a colloid stabilizer and further said colloidal dispersion is highly stable weakly active when used alone in said process, and b. contacting the treated substrate with a composition comprising a reactivity modifier thereby increasing the activity of the treated substrate for said plating process and wherein said colloid stabilizer and said reactivity modifier are different materials.
Claim 47
Dependent Claim
20 words
The process according to claim 43 wherein said metal is selected from the group of copper, nickel, cobalt and iron.
Claim 48
Dependent Claim
24 words
The process according to claim 43 wherein said metal is copper and a metal selected from the group consisting of cobalt, iron and nickel.
Claim 49
Dependent Claim
13 words
The process according to claim 44 wherein said reactivity modifier is an acid.
Claim 50
Dependent Claim
21 words
The process according to claim 43 wherein said reactivity modifier is a chemical capable of adsorbing onto the weakly active colloid.
Claim 51
Dependent Claim
22 words
The process according to claim 43 wherein said reactivity modifier is a chemical capable of adsorbing onto the nucleus of the colloid.
Claim 52
Dependent Claim
11 words
The process according to claim 43 wherein said substrate is ABS.
Claim 53
Dependent Claim
14 words
The process according to claim 43 wherein said colloid stabilizer is a soluble lignosulfonate.
Claim 54
Dependent Claim
11 words
The process according to claim 43 wherein said plating is copper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-12-25 | 1982-06-26 | 1982-12-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-12-25 | 1986-06-26 | 1986-12-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-12-25 | 1990-06-26 | 1990-12-26 | $7700.00 | Window Closed / Lapsed |