Magazine apparatus for semiconductor processing device

Claim 2

In an automatic semiconductor bonder, prober or like device which operates with lead frames, trays, mounting strips or other holders or with semiconductor wafers; an apparatus for handling such holders or wafers comprising: a magazine having an interior for receiving at least one of said holders or wafers, the exterior of said magazine including teeth and mounting means for mounting said magazine for movement on said device; and, driving means coupled to said device for engaging said teeth to selectively provide said movement of said magazine relative to said device; said teeth defining a rack on said magazine in-line with the direction of said movement; said mounting means comprising an elongated channel on said exterior of said magazine generally parallel to said rack, said channel having an elongated outer opening more narrow than the inner width of said channel for engaging a T-shaped mount extending from said device; whereby said holders or wafers may be removed from a plurality of said magazines for bonding, probing or other operations.

Claim 3

The apparatus defined by claim 1 wherein said teeth of said rack are spaced apart from opposite edges of said magazine such that when said driving means reaches the end of one of said racks on a first of said magazines said driving means next engages the end of another of said racks on a second of said magazines, whereby magazines are automatically fed-through.

Claim 4

The apparatus defined by claim 2 wherein said driving means comprises a geneva movement.

Claim 5

The apparatus defined by claim 3 wherein the interior of said magazine includes a plurality of ribs for receiving said holders or wafers, said ribs generally transverse to the direction of movement of said magazine.

Claim 6

The apparatus defined by claim 4 wherein said magazine is generally rectilinear in shape and said magazine includes one of said racks and one of said channels on each of opposite sides of said magazine.

Claim 7

In an automatic semiconductor bonder, prober or like device which operates with lead frames, trays, mounting strips or other holders or semiconductor wafers; an apparatus for handling such holders comprising: a generally rectilinear magazine having an interior for receiving at least one of said holders or wafers, the exterior of said magazine including a rack defined by a plurality of in-line teeth and mounting means for mounting said magazine for movement on said device; said mounting means includes a channel disposed generally parallel to said rack on the exterior of said magazine, said channel including an elongated outer opening more narrow than the inner width of said channel for engaging T-shaped mounts on said device; and, driving means coupled to said device for selectively moving said magazine in the direction of said in-line teeth, said driving means including a geneva movement having indexing pins which cooperatively engage said teeth; whereby said holders or wafers may be removed from a plurality of said magazines for bonding, probing or other operations.

Claim 8

In an automatic semiconductor bonder, prober or like device which operates with lead frames, trays, mounting strips or other holders or semiconductor wafers; an apparatus for handling such holders comprising: a generally rectilinear magazine having an interior for receiving at least one of said holders or wafers, the exterior of said magazine including a rack defined by a plurality of in-line teeth and mounting means for mounting said magazine for movement on said device; said mounting means includes a channel disposed generally parallel to said rack on the exterior of said magazine, said channel including an elongated outer opening more narrow than the inner width of said channel for engaging T-shaped mounts on said device; and, driving means coupled to said device for selectively moving said magazine in the direction of said in-line teeth, said driving means including a geneva movement having indexing pins which cooperatively engage said teeth; whereby said holders or wafers may be removed from a plurality of said magazines for bonding, probing or other operations.

Claim 9

The apparatus defined by claim 6 wherein said teeth of said rack begin at points spaced apart from the edges of said magazine such that when said pins reach the end of one of said racks on a first of said magazines said pins next engage the end of another of said racks on a second of said magazines, whereby magazines are automatically fed-through.

Claim 10

The apparatus defined by claim 7 wherein said interior of said magazine includes a plurality of parallel ribs for engaging said holders or wafers, said ribs generally transverse to said rack.

Claim 11

The apparatus defined by claim 8 wherein one of said racks and one of said channels are disposed on each of opposite sides of said magazine.

Claim 12

The apparatus defined by claim 9 including pushing means for urging holders from said magazine, said pushing means driven by a cam.

Claim 13

The apparatus defined by claim 10 wherein said cam is mounted for rotation with an intermittent gear means which indexes said geneva movement.

Claim 14

In an automatic semiconductor bonder, prober or like device which operates with lead frames, trays, mounting strips, or other holders or with semiconductor wafers; an apparatus for handling such holders or wafers comprising: a plurality of magazines each having an interior for receiving at least one of said holders or wafers, the exterior of said magazines including teeth and mounting means for mounting said magazines for movement on said device, said teeth forming a rack on each of said magazines in-line with the direction of said movement; said teeth having a first pitch in the central region of each of said racks and a second pitch, greater than said first pitch, at the ends of each of said racks, said second pitch to compensate for the thickness of the end walls of said magazines; driving means coupled to said device for engaging said teeth to selectively provide said movement of said magazines relative to said device; whereby said magazines are automatically fed through such that said holders or wafers may be removed from said plurality of said magazines for bonding, probing or other operations.

Claim 15

In an automatic semiconductor bonder, prober or like device which operates with lead frames, trays, mounting strips, or other holders or with semiconductor wafers; an apparatus for handling such holders or wafers comprising: a plurality of magazines each having an interior for receiving at least one of said holders or wafers, the exterior of said magazines including teeth and mounting means for mounting said magazines for movement on said device, said teeth forming a rack on each of said magazines in-line with the direction of said movement; said teeth having a first pitch in the central region of each of said racks and a second pitch, greater than said first pitch, at the ends of each of said racks, said second pitch to compensate for the thickness of the end walls of said magazines; driving means coupled to said device for engaging said teeth to selectively provide said movement of said magazines relative to said device; whereby said magazines are automatically fed through such that said holders or wafers may be removed from said plurality of said magazines for bonding, probing or other operations.