US4119688A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electro-lithography method
Assignee: International Business Machines Corp
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Filing: 1977-06-17
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Granted: 1978-10-10
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Expires: 1997-06-17
Abstract
Abstract An electro-lithography method suitable for forming a high resolution pattern in an electron sensitive resist material is disclosed. This technology permits the inexpensive high resolution reproduction of masks for use in integrated circuits and magnetic bubbles. The method involves the application of a pulsed, electric field to two parallel electrodes having an electron beam resist layer positioned on one of the electrodes and a mask positioned between the second electrode and the resist layer. The mask forms a gap having a thickness of 10-4m to 10-5m with the resist layer.
Inventors
- 👤 Hiroyuki Hiraoka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 08:23
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/30; H01J37/317; H01J37/3174; H01J37/3175; B; B82; B82Y; B82Y10/00; B82Y40/00; G; G03; G03F; G03F1/00; G03F1/20; G03F1/50; H10; H10P; H10P76/00; H10P76/20; H10P76/204; H10P76/2045; H01J2237/00; H01J2237/30; H01J2237/317; H01J2237/3175; H01J2237/31777; H01J2237/31781; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
153 words
An electro-lithographic method adapted to form a pattern of high resolution in an electron sensitive resist material comprising the steps of: applying a layer of E-beam resist onto an anode, placing a platelike opaque cathode parallel to said anode and facing said layer of resist to form a first gap therebetween, placing a mask in said first gap between said cathode and said resist layer to form a second gap having a thickness of 10 -4 m to 10 -5 m between said mask and said resist layer, regulating the pressure to 10 -3 to 10 -7 torr between said electrodes by pump means to provide an environment suitable for the formation of secondary electrons, and applying a pulsed electric field of at least 2 KV to said cathode whereby secondary electrons from said cathode pass through the mask and are collimated to form a high resolution mask image in said resist layer.
Claim 2
Dependent Claim
153 words
An electro-lithographic method adapted to form a pattern of high resolution in an electron sensitive resist material comprising the steps of: applying a layer of E-beam resist onto an anode, placing a platelike opaque cathode parallel to said anode and facing said layer of resist to form a first gap therebetween, placing a mask in said first gap between said cathode and said resist layer to form a second gap having a thickness of 10 -4 m to 10 -5 m between said mask and said resist layer, regulating the pressure to 10 -3 to 10 -7 torr between said electrodes by pump means to provide an environment suitable for the formation of secondary electrons, and applying a pulsed electric field of at least 2 KV to said cathode whereby secondary electrons from said cathode pass through the mask and are collimated to form a high resolution mask image in said resist layer.
Claim 3
Dependent Claim
28 words
A method as described in claim 1 whereby the mask is placed to form said second gap having a thickness of 5×10 -5 m to 2×10 -5 m.
Claim 4
Dependent Claim
46 words
A method as described in claim 1 whereby said mask is self sustaining and is placed on spacing means positioned on said resist layer to form said second gap between said resist layer and said mask and a third gap between said cathode and said mask.
Claim 5
Dependent Claim
15 words
A method as described in claim 1 whereby said mask is placed on said cathode.
Claim 6
Dependent Claim
23 words
A method as described in claim 1 whereby said E-beam resist is applied until the layer is between 1000 and 10,000 A° thick.
Claim 7
Dependent Claim
21 words
A method as described in claim 1 whereby the pressure is in the range of 10 -3 to 10 -5 Torr.
Claim 8
Dependent Claim
22 words
A method as described in claim 1 including the step of placing a substrate layer between the anode and E-beam resist layer.
Claim 9
Dependent Claim
23 words
A method as described in claim 1 including the step of applying a magnetic field perpendicular to the plane of said first gap.
References Cited (Backward Citations)
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US3679497A
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US3668028A
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US3956052A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-10-09 | 1982-04-10 | 1982-10-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-10-09 | 1986-04-10 | 1986-10-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-10-09 | 1990-04-10 | 1990-10-10 | $7700.00 | Window Closed / Lapsed |