Improved copper base alloys

Claim 2

An annealed copper base alloy having a high bend ductility, said alloy having a stacking fault energy of less than 30 ergs per square centimeter, said alloy consisting essentially of a first element selected from the group consisting of about 2 to 12% aluminum, about 2 to 6% germanium, about 2 to 10% gallium, about 3 to 12% indium, about 1 to 5% silicon, about 4 to 12% tin, about 8 to 37% zinc, balance essentially copper, said alloy having a non-random texture with a plastic strain ratio measured 90° to the rolling direction of less than about 0.75, wherein the grain structure is either unrecrystallized or partially recrystallized.

Claim 3

A high strength alloy according to claim 1 in the cold worked condition and has an ultimate plane strain tensile strength in the transverse direction of from 0 to 12% greater than the longitudinal ultimate tensile strength.

Claim 4

An alloy according to claim 2 containing from 25 to 35% zinc.

Claim 5

An alloy according to claim 2 containing from 2 to 3% aluminum, from 1 to 3% silicon, from 0.2 to 0.5% cobalt and the balance essentially copper.

Claim 6

An alloy according to claim 2 containing at least one second element different from said first element selected from the group consisting of about 0.001 to 10% aluminum, about 0.001 to 4% germanium, about 0.001 to 8% gallium, about 0.001 to 10% indium, about 0.001 to 4% silicon, about 0.001 to 10% tin, about 0.001 to 37% zinc, about 0.001 to 25% nickel, about 0.001 to 0.4% phosphorus, about 0.001 to 5% iron, about 0.001 to 5% cobalt, about 0.001 to 5% zirconium, about 0.001 to 10% manganese and mixtures thereof.

Claim 7

A copper base alloy having a high bend ductility, said alloy comprising the product of a process comprising: (a) providing a copper base alloy having a stacking fault energy of less than 30 ergs per square centimeter consisting essentially of a first element selected from the group consisting of about 2 to 12% aluminum, about 2 to 6% germanium, about 2 to 10% gallium, about 3 to 12% indium, about 1 to 5% silicon, about 4 to 12% tin, about 8 to 37% zinc, and the balance essentially copper wherein said alloy is fully recrystallized and has a fine grain size of less than 0.015 mm; (b) cold working said alloy at least 60%; (c) annealing said alloy at a metal temperature of from 280° to 425° C to obtain a non-random texture with a plastic strain ratio measured 90° to the rolling direction of less than about 0.75; wherein the grain structure after said annealing is either unrecrystallized or partially recrystallized; and (d) finally cold working said alloy less than 40%.

Claim 8

A copper base alloy having a high bend ductility, said alloy comprising the product of a process comprising: (a) providing a copper base alloy having a stacking fault energy of less than 30 ergs per square centimeter consisting essentially of a first element selected from the group consisting of about 2 to 12% aluminum, about 2 to 6% germanium, about 2 to 10% gallium, about 3 to 12% indium, about 1 to 5% silicon, about 4 to 12% tin, about 8 to 37% zinc, and the balance essentially copper wherein said alloy is fully recrystallized and has a fine grain size of less than 0.015 mm; (b) cold working said alloy at least 60%; (c) annealing said alloy at a metal temperature of from 280° to 425° C to obtain a non-random texture with a plastic strain ratio measured 90° to the rolling direction of less than about 0.75; wherein the grain structure after said annealing is either unrecrystallized or partially recrystallized; and (d) finally cold working said alloy less than 40%.