← Back to Patent Explorer
US4097310A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of forming silicon solar energy cells

Assignee: BP Solar International LLC
•
Filing: 1977-06-16
•
Granted: 1978-06-27
•
Expires: 1997-06-16
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A method of forming a silicon solar energy cell, which comprises forming an electron generating junction on a single crystal silicon wafer and thereafter using a saw having a diamond blade to cut through the wafer and the junction formed therein.

Inventors

  • 👤 Joseph Lindmayer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 02:16
CPC Classifications
H; H10; H10P; H10P52/00; H10F; H10F71/00; H10F71/121; Y; Y02; Y02E; Y02E10/00; Y02E10/50; Y02E10/547; Y02P; Y02P70/00; Y02P70/50; Y10; Y10S; Y10S148/00; Y10S148/153

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 115 words
A method of improving the electron generating efficiency of a silicon solar energy cell while forming same from an individual wafer of silicon having at least one dimension larger than the corresponding dimension of the cell, comprising treating the wafer to produce at a surface thereof a junction at which electrons are generated when the surface is exposed to light, and thereafter using a dicing saw having a diamond blade rotating at least at 5,000 r.p.m. and cutting the individual treated wafer at and through said surface junction to form a cell having at least one dimension less than that of said wafer and improved electron generating efficiency when said surface is exposed to light.
Claim 2
Independent Claim 115 words
A method of improving the electron generating efficiency of a silicon solar energy cell while forming same from an individual wafer of silicon having at least one dimension larger than the corresponding dimension of the cell, comprising treating the wafer to produce at a surface thereof a junction at which electrons are generated when the surface is exposed to light, and thereafter using a dicing saw having a diamond blade rotating at least at 5,000 r.p.m. and cutting the individual treated wafer at and through said surface junction to form a cell having at least one dimension less than that of said wafer and improved electron generating efficiency when said surface is exposed to light.
Claim 3
Dependent Claim 19 words
A method as claimed in claim 1, in which said diamond blade rotates at about 5,000 to 20,000 r.p.m.
Claim 4
Dependent Claim 17 words
A method as claimed in claim 1, in which said diamond blade rotates at about 18,000 r.p.m.
Claim 5
Dependent Claim 20 words
A method as claimed in claim 1, in which the cutting speed is about 0.05 to 10 inches per second.
Claim 6
Dependent Claim 18 words
A method as claimed in claim 1, in which the cutting speed is about 1 inch per second.
Claim 7
Dependent Claim 15 words
A silicon solar energy cell formed by the practice of the method of claim 1.

References Cited (Backward Citations)

US3341937A Cited
US3422527A Cited
US3624677A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1981-06-26 1981-12-26 1982-06-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1985-06-26 1985-12-26 1986-06-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1989-06-26 1989-12-26 1990-06-27 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag