US3624677A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Manufacture of semiconductor elements
Assignee: Siemens Mobility Ltd
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Filing: 1968-06-10
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Granted: 1971-11-30
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Expires: 1988-06-10
Abstract
Abstract A method of manufacturing semiconductor elements of truncated pyramidal form, which method includes the steps of forming in a wafer of semiconductor material having opposed major faces a PN junction extending parallel to and lying between the major faces of the wafer, and subsequently cutting the wafer into a plurality of discrete semiconductor elements by a plurality of crisscross cuts the sidewalls of each of which are inclined at an angle of other than 90* to the PN junction.
Inventors
- 👤 Allan Pearson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 14:28
CPC Classifications
H; H10; H10P; H10P52/00; B; B28; B28D; B28D5/00; B28D5/04; B28D5/042; Y; Y10; Y10T; Y10T83/00; Y10T83/04; Y10T83/0524; Y10T83/0572
Claims Analysis
Total Claims: 1
Claim 1
Independent Claim
22 words
A method as claimed in claim 1 wherein abrasive material is fed to the knife-edged cutting tool during oscillation of the tool.
References Cited (Backward Citations)
US2743506A
Cited
US2784479A
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US3054709A
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US3307240A
Cited
US3332143A
Cited
US3326071A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-11-29 | 1975-05-31 | 1975-11-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-11-29 | 1979-05-31 | 1979-11-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-11-29 | 1983-05-31 | 1983-11-30 | $7700.00 | Window Closed / Lapsed |