Patent US4089766A successfully refreshed from Google Patents.
US4089766A
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Method of passivating and planarizing a metallization pattern
Assignee: International Business Machines Corp
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Filing: 1977-06-17
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Granted: 1978-05-16
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Expires: 1997-06-17
Abstract
Abstract Disclosed is a process for passivating a first metallization pattern on a semiconductor substrate and providing a substantially planar quartz surface for subsequent metallization patterns in which a first polymer layer is applied over a first metallization layer and other portions of the substrate, providing a substantially planar surface. After a first curing, the first layer of polymer material is removed down to a thin layer of defined thickness over the first metallization pattern and, after a second curing, a quartz layer is applied over the polymer layer forming a substantially planar quartz top surface. Also disclosed is a method of forming via holes to the first metallization pattern as well as particular photoresist resins.
Inventors
- 👤 Gabor Paal
- 👤 Klaus Schackert
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 13:14
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; H10P14/63; H10P14/6326; H10P14/6342; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/092
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
109 words
A process for passivating a metallization pattern on a substrate and for providing a substantially planar top surface for subsequent layers of metallization comprising the steps of: providing a substrate with a first metallization pattern thereon; applying a polymer material over said substrate and said metallization such that said polymer material will have a substantially planar top surface; heating said structure as a first curing step for said polymer material; removing said polymer material down to a thin layer of defined thickness over the first metallization pattern; heating said resultant structure providing a second curing for said polymer material; and applying a layer of quartz over said polymer layer.
Claim 2
Dependent Claim
109 words
A process for passivating a metallization pattern on a substrate and for providing a substantially planar top surface for subsequent layers of metallization comprising the steps of: providing a substrate with a first metallization pattern thereon; applying a polymer material over said substrate and said metallization such that said polymer material will have a substantially planar top surface; heating said structure as a first curing step for said polymer material; removing said polymer material down to a thin layer of defined thickness over the first metallization pattern; heating said resultant structure providing a second curing for said polymer material; and applying a layer of quartz over said polymer layer.
Claim 3
Dependent Claim
37 words
A process as in claim 1 wherein said polymer material is a photoresist comprising: a resin selected from the group consisting of o-diazoarylquinone/phenolformaldehyde resin and a soluble formaldehyde resin with a content of a radical forming agent.
Claim 4
Dependent Claim
21 words
A process as in claim 2 wherein said radical forming agent comprises: peroxidic polymerization initiators, azobisisobutyronitril or thermally curable phenolformaldehyde resins.
Claim 5
Dependent Claim
28 words
A process as in claim 1 wherein the step of applying said layer of polymer material comprises: applying said polymer material by means of a spin coating process.
Claim 6
Dependent Claim
52 words
A process as in claim 1 wherein the step of removing said cured layer of polymer material is performed by the method comprising the step of: removing the polymer material in a solution containing phosphoric acid and potassium permanganate down to a thin layer of a defined thickness over the metallization pattern.
Claim 7
Dependent Claim
34 words
A process as in claim 1 wherein the step of curing said polymer layer for the second time comprises the step of: performing the second curing at a higher temperature than the first curing.
Claim 8
Dependent Claim
27 words
A process as in claim 1 wherein the step of applying the quartz layer comprises the step of: applying the quartz layer by means of cathode sputtering.
References Cited (Backward Citations)
US4025411A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-05-15 | 1981-11-14 | 1982-05-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-05-15 | 1985-11-14 | 1986-05-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-05-15 | 1989-11-14 | 1990-05-16 | $7700.00 | Window Closed / Lapsed |