US4084022A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for tin plating printed boards
Assignee: Siemens AG
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Filing: 1976-09-23
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Granted: 1978-04-11
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Expires: 1996-09-23
Abstract
Abstract A method for tin plating printed boards is disclosed wherein faulty bonding is prevented by masking the printed boards with a heat and solder resistant coating material. This coating material is selectively applied to the printed boards in those areas where misbonding due to gap bridging and bubble formation is most likely to occur. For example, a small amount of coating material may be applied across conductor paths between two adjacent areas. In addition, the coating material may be evenly distributed in a grid like fashion throughout the area of the printed boards. Where the tin plating process is a wave soldering process, the coating material may be applied in the direction of conveyance of the printed board in order to avoid interference with the discharge of the tin.
Inventors
- 👤 Josef Tratz
- 👤 Egon Jager
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 21:10
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K1/00; H05K1/02; H05K1/0286; H05K1/0287; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/0989; H05K2201/09909; H05K2203/00; H05K2203/04; H05K2203/044; H05K2203/17; H05K2203/175; H05K3/3465; H05K3/3468
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
107 words
A process for bonding a printed circuit board with tin by passing the printed circuit board through a bath of tin, said printed circuit board having a number of closely spaced conductor paths separated by non-conductive areas, wherein the process comprises the step of: masking selected portions of said printed circuit board with heat and solder resistant coating material where the non-conductive areas are small to prevent misbonding due to bubble formation and gap bridging, each of said selected portions including a short section of an associated conductor path and a small section of the non-conductive areas adjacent to the short section of said associated conductor path.
Claim 2
Dependent Claim
107 words
A process for bonding a printed circuit board with tin by passing the printed circuit board through a bath of tin, said printed circuit board having a number of closely spaced conductor paths separated by non-conductive areas, wherein the process comprises the step of: masking selected portions of said printed circuit board with heat and solder resistant coating material where the non-conductive areas are small to prevent misbonding due to bubble formation and gap bridging, each of said selected portions including a short section of an associated conductor path and a small section of the non-conductive areas adjacent to the short section of said associated conductor path.
Claim 3
Dependent Claim
13 words
The process as defined in claim 1, wherein said coating material is lacquer.
Claim 4
Dependent Claim
22 words
The process as defined in claim 1, wherein each of said selected portions includes a narrow strip crossing said associated conductor path.
Claim 5
Dependent Claim
26 words
The process as defined in claim 3, wherein said selected portions include a plurality of said narrow strips crossing a plurality of parallel running conductor paths.
Claim 6
Dependent Claim
30 words
The process as defined in claim 3, wherein said printed circuit board comprises a network of intersecting conductor paths, said selected portions being evenly distributed over said printed circuit board.
Claim 7
Dependent Claim
52 words
The process as defined in claim 5, wherein said process is a wave soldering process and said selected portions include a plurality of said narrow strips crossing a plurality of said conductor paths, said narrow strips extending across said conductor paths parallel to the direction of conveyance of said printed circuit board.
Claim 8
Dependent Claim
129 words
A process for bonding a printed circuit board with tin by passing the printed circuit board through a bath of tin, said printed circuit board having a number of closely spaced conductor paths separated by non-conductive areas, wherein the process comprises the steps of: masking selected portions of said printed circuit board with heat and solder resistant coating material where the non-conductive areas are small to prevent misbonding due to bubble formation and gap bridging, each of said selected portions including a short section of an associated conductor path and a small section of the non-conductive areas adjacent to the short section of said associated conductor path; and, passing said printed circuit board through said bath of tin to bond the full length of said conductor paths with tin.
Claim 9
Dependent Claim
129 words
A process for bonding a printed circuit board with tin by passing the printed circuit board through a bath of tin, said printed circuit board having a number of closely spaced conductor paths separated by non-conductive areas, wherein the process comprises the steps of: masking selected portions of said printed circuit board with heat and solder resistant coating material where the non-conductive areas are small to prevent misbonding due to bubble formation and gap bridging, each of said selected portions including a short section of an associated conductor path and a small section of the non-conductive areas adjacent to the short section of said associated conductor path; and, passing said printed circuit board through said bath of tin to bond the full length of said conductor paths with tin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-04-10 | 1981-10-10 | 1982-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-04-10 | 1985-10-10 | 1986-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-04-10 | 1989-10-10 | 1990-04-11 | $7700.00 | Window Closed / Lapsed |