← Back to Patent Explorer
US3090706A Expired / Lapsed US ⏱️ 0.0 years remaining

Printed circuit process

Assignee: Motorola Solutions Inc
•
Filing: 1959-07-03
•
Granted: 1963-05-21
•
Expires: 1979-07-03
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

No abstract record available.

Inventors

  • 👤 Erwin E Cado

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 04:58
CPC Classifications
C; C23; C23C; C23C2/00; C23C2/02; C09; C09D; C09D167/00; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/40; H05K3/42; H05K3/425; H05K3/426; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0344; H05K3/282; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24851; Y10T428/24917

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 137 words
IN A PRINTED CIRCUIT ASSEMBLY ADAPTED FOR A SOLDERING OPERATION IN WHICH A FACE OF ASSEMBLY IS SUBSTANTIALLY ENTIRELY CONTACTED WITH MOLTEN SOLDER, SAID ASSEMBLY INCLUDING A RELATIVELY PERMANENT INSULATING BASE AND WHICH HAS METALLIC WIRING CONDUCTORS APPLIED ON AT LEAST ONE SURFACE OF THE BASE, THE IMPROVEMENT COMPRISING A PATTERNED OVERCOAT OF MELAMINE RESIN BASE MATERIAL INCLUDING A THIXOTROPIC AGENT EXTENDING OVER AT LAST SAID ONE SURFACE OF THE PANEL AND OVER SELECTED PORTIONS OF THE METALLIC CONDUCTORS, SAID PATTERNED OVERCOAT BEING A HARD ADHESIVE LAYER WHICH AIDS IN RETAINING THE CONDUCTORS ON SAID SURFACE, AND SAID MELAMINE RESIN AND SAID THIXOTROPIC AGENT GIVING SAID LAYER HIGH THERMAL AND ELECTRICAL INSULATING CHARACTERISTICS TO PROTECT THE ASSEMBLY FROM HEAT AND THUS PREVENT LOOSENING OF SAID CONDUCTORS BY HEAT AND TO PREVENT UNDUE ELECTRICAL LEAKAGE BETWEEN SAID CONDUCTORS.
Claim 2
Dependent Claim 137 words
IN A PRINTED CIRCUIT ASSEMBLY ADAPTED FOR A SOLDERING OPERATION IN WHICH A FACE OF ASSEMBLY IS SUBSTANTIALLY ENTIRELY CONTACTED WITH MOLTEN SOLDER, SAID ASSEMBLY INCLUDING A RELATIVELY PERMANENT INSULATING BASE AND WHICH HAS METALLIC WIRING CONDUCTORS APPLIED ON AT LEAST ONE SURFACE OF THE BASE, THE IMPROVEMENT COMPRISING A PATTERNED OVERCOAT OF MELAMINE RESIN BASE MATERIAL INCLUDING A THIXOTROPIC AGENT EXTENDING OVER AT LAST SAID ONE SURFACE OF THE PANEL AND OVER SELECTED PORTIONS OF THE METALLIC CONDUCTORS, SAID PATTERNED OVERCOAT BEING A HARD ADHESIVE LAYER WHICH AIDS IN RETAINING THE CONDUCTORS ON SAID SURFACE, AND SAID MELAMINE RESIN AND SAID THIXOTROPIC AGENT GIVING SAID LAYER HIGH THERMAL AND ELECTRICAL INSULATING CHARACTERISTICS TO PROTECT THE ASSEMBLY FROM HEAT AND THUS PREVENT LOOSENING OF SAID CONDUCTORS BY HEAT AND TO PREVENT UNDUE ELECTRICAL LEAKAGE BETWEEN SAID CONDUCTORS.

References Cited (Backward Citations)

US2695351A Cited
US2777192A Cited
US2740193A Cited
US2874085A Cited
US2988839A Cited
DE1023101B Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1966-05-20 1966-11-19 1967-05-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1970-05-20 1970-11-19 1971-05-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1974-05-20 1974-11-19 1975-05-21 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag