Metallized ceramic and printed circuit module

Claim 1

A metallized ceramic and printed circuit module which comprises: a plurality of integrated circuit chips; a metallized circuit ceramic substrate on which said chips are mounted with one layer of circuit lines on the surface of said substrate being connected to said chips, the number of interconnections between said circuit lines and chips being limited because no two of said circuit lines can cross; a plurality of I/O pins arranged on a closely spaced pin grid to provide a high I/O pin density and which pins are staggered in height to provide short pins and relatively longer pins; a multilayer organic printed circuit carrier having a plurality of signal, ground and voltage planes and having plated thru holes connected to said planes and arranged on a pin grid corresponding to the pin grid of said module and into which said pins are plugged with said longer pins protruding out the other side of the carrier and said shorter pins ending with said carrer, said high I/O pin density allowing multichip wiring to provide said multilayer carrier with ample wireability for multichip applications, said interconnections between said short pins compensating for the lack of crossover ability in the layer of circuit lines on said ceramic substrate; and a printed circuit card having plated thru holes arranged on a low I/O pin density grid corresponding to only that of said longer pins and into which said longer pins are plugged to connect with circuitry thereon.