Photocurable imidizable polyene-polythiol compositions, method of coating therewith and coated articles

Claim 2

An amide-acid polyene of the formula: ##STR21## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR22## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10.

Claim 3

An imide-containing polyene of the formula ##STR23## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR24## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10.

Claim 4

An imide-containing polyene of the formula ##STR23## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR24## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10.

Claim 7

The method according to claim 3 wherein the anhydride-containing member is a dianhydride.

Claim 8

The method according to claim 3 wherein the anhydride-containing member is an acid anhydride.

Claim 9

The method according to claim 3 wherein the anhydride-containing member is an anhydride acid halide and the halide formed from reacting the anhydride acid halide with the ethylenically unsaturated alcohol is removed prior to reaction with the primary diamine.

Claim 10

The process of imidizing the amide-acid polyene of claim 1 which comprises heating said polyene at a temperature in the range 50°-250° C for a time sufficient to cause imidization.

Claim 11

The process according to claim 7 wherein the imidization is carried out in an inert solvent for the amide-acid polyene at a temperature in the range 50°-150° C.

Claim 12

A photocurable composition comprising (A) an amide-acid containing polyene of the formula: ##STR27## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR28## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator.

Claim 13

A photocurable composition comprising (A) an amide-acid containing polyene of the formula: ##STR27## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR28## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator.

Claim 14

A photocurable composition comprising (A) an imide-containing polyene of the formula: ##STR29## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR30## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator.

Claim 15

A photocurable composition comprising (A) an imide-containing polyene of the formula: ##STR29## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR30## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator.

Claim 16

The process of forming a solid cured amide-acid containing polythioether which comprises admixing (A) a polyene of the formula: ##STR31## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR32## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH)HD n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator and, thereafter, exposing the mixture to actinic radiation.

Claim 17

The process of forming a solid cured amide-acid containing polythioether which comprises admixing (A) a polyene of the formula: ##STR31## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR32## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH)HD n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator and, thereafter, exposing the mixture to actinic radiation.

Claim 18

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR33## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CH"═CH 2 and ##STR34## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator exposing said admixture to actinic radiation and, thereafter, heating the cured polythioether at a temperature in the range 50°-250° C for a time sufficient to imidize the amide-acid in the polyene.

Claim 19

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR33## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CH"═CH 2 and ##STR34## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator exposing said admixture to actinic radiation and, thereafter, heating the cured polythioether at a temperature in the range 50°-250° C for a time sufficient to imidize the amide-acid in the polyene.

Claim 20

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR35## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR36## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and 0.01-5% by weight of (A) and (B) of a pinacol of the general formula: ##STR37## wherein R 1 and R 3 are members independently selected from the group consisting of substituted and unsubstituted aromatic radicals, R 2 and R 4 are members independently selected from the group consisting of substituted and unsubstituted aliphatic and aromatic radicals and X and Y are members independently selected from the group consisting of hydroxyl, alkoxy and aryloxy and, thereafter, heating the admixture in the range 50°-250° C.

Claim 21

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR35## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR36## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and 0.01-5% by weight of (A) and (B) of a pinacol of the general formula: ##STR37## wherein R 1 and R 3 are members independently selected from the group consisting of substituted and unsubstituted aromatic radicals, R 2 and R 4 are members independently selected from the group consisting of substituted and unsubstituted aliphatic and aromatic radicals and X and Y are members independently selected from the group consisting of hydroxyl, alkoxy and aryloxy and, thereafter, heating the admixture in the range 50°-250° C.

Claim 22

The process of forming a solid cured imide containing polythioether which comprises admixing (A) an imide containing polyene of the formula: ##STR38## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR39## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator. and, thereafter, exposing the mixture to actinic radiation.

Claim 23

The process of forming a solid cured imide containing polythioether which comprises admixing (A) an imide containing polyene of the formula: ##STR38## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR39## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator. and, thereafter, exposing the mixture to actinic radiation.

Claim 24

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR40## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR41## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and 0.01-5% by weight of (A) and (B) of a pinacol of the general formula: ##STR42## wherein R 1 and R 3 are members independently selected from the group consisting of substituted and unsubstituted aromatic radicals, R 2 and R 4 are members independently selected from the group consisting of substituted and unsubstituted aliphatic and aromatic radicals and X and Y are members independently selected from the group consisting of hydroxyl, alkoxy and aryloxy and, thereafter, heating the admixture in the range 50°-250° C.

Claim 25

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR40## wherein → denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR41## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and 0.01-5% by weight of (A) and (B) of a pinacol of the general formula: ##STR42## wherein R 1 and R 3 are members independently selected from the group consisting of substituted and unsubstituted aromatic radicals, R 2 and R 4 are members independently selected from the group consisting of substituted and unsubstituted aliphatic and aromatic radicals and X and Y are members independently selected from the group consisting of hydroxyl, alkoxy and aryloxy and, thereafter, heating the admixture in the range 50°-250° C.

Claim 26

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR43## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR44## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator heating said admixture at a temperature in the range 50°-250° C for a time sufficient to imidize the amide-acid in the polyene and, thereafter, exposing said admixture to actinic radiation to form a cured imide containing polythioether.

Claim 27

The process of forming a solid cured imide containing polythioether which comprises admixing (A) a polyene of the formula: ##STR43## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR44## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator heating said admixture at a temperature in the range 50°-250° C for a time sufficient to imidize the amide-acid in the polyene and, thereafter, exposing said admixture to actinic radiation to form a cured imide containing polythioether.

Claim 28

An article comprising the composition of claim 9 as a coating on a substrate.

Claim 29

The article according to claim 17 wherein the substrate is an electrical conductor.

Claim 30

An article comprising the composition of claim 10 as a coating on a substrate.

Claim 31

The article of claim 19 wherein the substrate is an electrical conductor.

Claim 32

An article comprising a cured amide-acid containing polythioether as a coating on a substrate.

Claim 33

An article comprising a cured amide-acid containing polythioether as a coating on a substrate.

Claim 34

The article according to claim 21 wherein the substrate is an electrical conductor.

Claim 35

An article comprising a cured imide containing polythioether as a coating on a substrate.

Claim 36

An article comprising a cured imide containing polythioether as a coating on a substrate.

Claim 37

The article according to claim 23 wherein the substrate is an electrical conductor.

Claim 38

The article according to claim 24 wherein the electrical conductor is a wire.

Claim 39

The process of coating a substrate which comprises applying to a substrate a curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR45## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR46## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, exposing said curable composition under ambient conditions to a free radical generator to form a solidified, cured polythioether coating on said substrate and, thereafter heating said cured composition in the range 50°-250° C to imidize the polyene.

Claim 40

The process of coating a substrate which comprises applying to a substrate a curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR45## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR46## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, exposing said curable composition under ambient conditions to a free radical generator to form a solidified, cured polythioether coating on said substrate and, thereafter heating said cured composition in the range 50°-250° C to imidize the polyene.

Claim 41

The process according to claim 26 wherein the curable composition contains 0.005 to 50% by weight of the polyene and polythiol of said curable composition of a photocuring rate accelerator and the free radical generator is actinic radiation.

Claim 42

The process according to claim 26 wherein the free radical generator is high energy ionizing radiation.

Claim 43

A process for forming a continuous flexible adherent cured coating on the surface of an electrical conductor selected from the group consisting of wire and cable which comprises immersing said electrical conductor in a bath of a liquid radiation curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR47## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR48## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator, thus coating said electrical conductor with said composition, passing said coated electrical conductor through a die, exposing said coated electrical conductor to actinic radiation for a time sufficient to cure said coating on said electrical conductor under ambient conditions and, thereafter, heating said coated electrical conductor in the range 50°-250° C to imidize the polyene.

Claim 44

A process for forming a continuous flexible adherent cured coating on the surface of an electrical conductor selected from the group consisting of wire and cable which comprises immersing said electrical conductor in a bath of a liquid radiation curable composition comprising (A) an amide-acid containing polyene of the formula: ##STR47## wherein → denotes isomerism, R is a divalent organic moiety remaining after a primary diamine has reacted to form amide linkages; R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue; A is an alkylene group having from 1 to 10 carbon atoms; Y is a member of the group consisting of --CR"═CH 2 , --O--(CH 2 ) d --CR"═CH 2 and ##STR48## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R 8 --(SH) n where n is at least 2 and R 8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and (C) a photocuring rate accelerator, thus coating said electrical conductor with said composition, passing said coated electrical conductor through a die, exposing said coated electrical conductor to actinic radiation for a time sufficient to cure said coating on said electrical conductor under ambient conditions and, thereafter, heating said coated electrical conductor in the range 50°-250° C to imidize the polyene.