Method of manufacturing semi-conductor devices

Claim 2

A continuous process for mounting semiconductor devices each of which are rectangular-shaped in plan and having contacts thereon on a continuous strip including a plurality of lead frames, the lead frames being uniformly spaced along the longitudinal axis of the strip, each lead frame having a matrix of conductors, the end portions of which are adapted for connection to the contacts of a corresponding semiconductor device comprises placing in the desired registration on a lead frame of the lead frame strip a masking member to define at least one rectangular-shaped aperture for accurately locating a semiconductor device, continuously feeding the lead frame strip and masking member longitudinally between a first and a second station with the aperture defined in the masking member being in a desired registration on a lead frame of the lead frame strip such that the conductor end portions of that lead frame are exposed through the aperture, precisely positioning the lead frame and the masking member with respect to each other as they are fed such that when a corresponding semiconductor device is inserted in the required orientation into the aperture each device contact is exclusively opposite to a co-operating conductor end portion, and bonding the device contacts to the co-operating conductor end portions.

Claim 3

A method as claimed in claim 1 in which the aperture defined in the masking member is square-shaped in plan, and further including the step of positioning a corresponding semiconductor device which is also square-shaped in plan in said aperture when the masking member is in the desired registration with the lead frame strip during the path of travel of the masking member and the lead frame strip between said first and said second station as said strip is fed.

Claim 4

A method as claimed in claim 1 in which the masking member defines a plurality of apertures disposed along the longitudinal axis of the masking member, and said lead frame strip and masking member are fed adjacent each other such that consecutive apertures expose conductor end portions of consecutive lead frames of the lead frame strip.

Claim 5

A method as claimed in claim 1 including at least one sprocket wheel at one of said stations, said sprocket wheel engaging co-operating sprocket holes formed in both the masking member and the lead frame strip to feed the masking member and the lead frame strip in the desired registration with each other between said first and said second stations upon rotation of said sprocket wheel.

Claim 6

A method as claimed in claim 1 including the step of automatically inserting corresponding semiconductor devices in each aperture defined in the masking member when the masking member is in the desired registration with the lead frame strip, during the travel of the masking member and the lead frame strip between the first and second stations.

Claim 7

The method as claimed in claim 1 wherein said lead frame strip and masking member are fed in a controlled manner.

Claim 8

A method as claimed in claim 6 wherein said lead frame strip and masking member are disposed to pass over said sprocket wheel together to take into account the curvature of the sprocket wheel over which the lead frame strip and masking member pass.

Claim 9

A continuous process for mounting semiconductor devices each rectangular-shaped in plan on a strip of corresponding lead frames, the lead frames being uniformly spaced along the longitudinal axis of the strip, each lead frame having a matrix of conductors, the end portions of which are adapted for connection to contacts of a corresponding semiconductor device comprises continuously feeding and positioning a masking member to define at least one rectangular-shaped aperture, continuously feeding the lead frame strip longitudinally between a first and a second station with the aperture defined in the masking member being in a desired registration on a lead frame of the lead frame strip such that the conductor end portions for connection to contacts of a corresponding semiconductor device are exposed through the aperture, precisely positioning the lead frame and the aperture such that when a corresponding semiconductor device is inserted in the required orientation into the aperture each device contact is exclusively opposite to a co-operating conductor end portion, and bonding the device contacts to the co-operating conductor end portions, the aperture defined in the masking member having dimensions to allow a corresponding semiconductor device to be a sufficiently close fit within the aperture to ensure that each device contact exclusively is opposite to the conductor end portion to which the contact is to be connected when the masking member is in the required registration with the lead frame.

Claim 10

A continuous process for mounting semiconductor devices each rectangular-shaped in plan on a strip of corresponding lead frames, the lead frames being uniformly spaced along the longitudinal axis of the strip, each lead frame having a matrix of conductors, the end portions of which are adapted for connection to contacts of a corresponding semiconductor device comprises continuously feeding and positioning a masking member to define at least one rectangular-shaped aperture, continuously feeding the lead frame strip longitudinally between a first and a second station with the aperture defined in the masking member being in a desired registration on a lead frame of the lead frame strip such that the conductor end portions for connection to contacts of a corresponding semiconductor device are exposed through the aperture, precisely positioning the lead frame and the aperture such that when a corresponding semiconductor device is inserted in the required orientation into the aperture each device contact is exclusively opposite to a co-operating conductor end portion, and bonding the device contacts to the co-operating conductor end portions, the aperture defined in the masking member having dimensions to allow a corresponding semiconductor device to be a sufficiently close fit within the aperture to ensure that each device contact exclusively is opposite to the conductor end portion to which the contact is to be connected when the masking member is in the required registration with the lead frame.

Claim 11

A method as claimed in claim 8 wherein said lead frame strip and masking member are rotatably fed over a wheel supported at said first station and a second wheel rotatably supported at said second station, at least one of said wheels positively driving said lead frame strip and said masking member in a controlled manner.

Claim 12

A method as claimed in claim 8 in which the aperture defined in the masking member is square-shaped in plan and further includes the step of positioning a corresponding semiconductor device which is also square-shaped in plan.

Claim 13

A method as claimed in claim 8 in which the masking member includes a plurality of apertures and further including the step of exposing consecutive conductor end portions of consecutive lead frames of the lead frame strip through the apertures.

Claim 14

A method as claimed in claim 9 wherein said positive driving step includes feeding the masking member and the lead frame strip in desired registration with each other through said part of the apparatus upon rotation of a sprocket wheel, said sprocket wheel engaging co-operating sprocket holes formed in both the masking member and the lead frame strip.

Claim 15

A method as claimed in claim 8 further including automatically inserting corresponding semiconductor devices in each aperture defined in the masking member when the masking member is in the desired registration with the lead frame strip during the path of travel of the masking member and the lead frame strip between the first and second stations.

Claim 16

A continuous process for mounting semiconductor devices each rectangular-shaped in plan on a strip of corresponding lead frames, the lead frames being uniformly spaced along the longitudinal axis of the strip, each lead frame having a matrix of conductors, the end portion of which are adapted for connection to contacts of a corresponding semiconductor device comprises defining at least one rectangular-shaped aperture, in a masking member continuously feeding the lead frame strip longitudinally between a first and a second station transporting the aperture defined in the masking member so as to maintain the aperture in a desired registration with a lead frame of the lead frame strip such that conductor end portions for connection to contacts of a corresponding semiconductor device are exposed through the aperture, precisely positioning the lead frame and the aperture such that when a corresponding semiconductor device is inserted to the required orientation into the aperture each device contact is exclusively opposite to a co-operating conductor end portion, and bonding the device contacts to the cooperating conductor end portions, the lead frame strip and the masking member being fed one atop the other the aperture defined in the masking member such that the leading walls of the aperture as the masking member is fed between said stations are inclined in relation to the longitudinal axis of the lead frame strip and each device contact exclusively is opposite to the conductor end portion to which the contact is to be connected when the masking member is in the required registration with the lead frame and the device is contiguous with the following walls of the aperture.

Claim 17

A continuous process for mounting semiconductor devices each rectangular-shaped in plan on a strip of corresponding lead frames, the lead frames being uniformly spaced along the longitudinal axis of the strip, each lead frame having a matrix of conductors, the end portion of which are adapted for connection to contacts of a corresponding semiconductor device comprises defining at least one rectangular-shaped aperture, in a masking member continuously feeding the lead frame strip longitudinally between a first and a second station transporting the aperture defined in the masking member so as to maintain the aperture in a desired registration with a lead frame of the lead frame strip such that conductor end portions for connection to contacts of a corresponding semiconductor device are exposed through the aperture, precisely positioning the lead frame and the aperture such that when a corresponding semiconductor device is inserted to the required orientation into the aperture each device contact is exclusively opposite to a co-operating conductor end portion, and bonding the device contacts to the cooperating conductor end portions, the lead frame strip and the masking member being fed one atop the other the aperture defined in the masking member such that the leading walls of the aperture as the masking member is fed between said stations are inclined in relation to the longitudinal axis of the lead frame strip and each device contact exclusively is opposite to the conductor end portion to which the contact is to be connected when the masking member is in the required registration with the lead frame and the device is contiguous with the following walls of the aperture.

Claim 18

A method as claimed in claim 14 including the step of maintaining the semiconductor device contiguous with the following walls of the aperture.

Claim 19

A method as claimed in claim 15 in which the step for maintaining the corresponding semiconductor device contiguous with the following walls of the aperture includes contacting said device with a brush mounted adjacent the path of travel of the lead frame strip and masking member to sweep the semiconductor device into the required position as the masking member and the lead frame strip are fed from the first station to said second station.

Claim 20

A method as claimed in claim 14 wherein said lead frame strip and masking member are positively fed by a first wheel rotatably supported at said first station or a second wheel rotatably supported at said second station, at least one of said wheels being a sprocket wheel and said lead frame strip and said masking member each including sprocket holes spaced along the length thereof such that said sprocket wheel engages the sprocket holes of said lead frame strip and said masking member and feeds said strip and said member in a controlled manner.

Claim 21

A method as claimed in claim 14 in which the aperture defined in the masking member is square-shaped in plan and further includes the step of positioning a corresponding semiconductor device which is also squareshaped in plan.

Claim 22

A method as claimed in claim 14 including exposing conductor end portions of consecutive lead frames of the lead frame strip is consecutive apertures in the masking member.

Claim 23

A method as claimed in claim 14 wherein both the masking member and the lead frame strip are positively fed in the desired registration with each other through said apparatus.

Claim 24

A method as claimed in claim 14 further including automatic inserting corresponding semiconductor devices in each aperture defined in the masking member when the masking member is in the desired registration with the lead frame strip between the first and second stations.

Claim 25

A continuous process for mounting semiconductor devices each rectangular shaped in plan on a strip of corresponding lead frames, the lead frames being uniformly spaced along the longitudinal axis of the strip, each lead frame having a matrix of conductors, the end portions of which are adapted for connection to contacts of a corresponding semiconductor device, comprises positioning a masking member to define at least one rectangular-shaped aperture for accurately locating the semiconductor devices, positively feeding the lead frame strip and the masking member longitudinally between a first and a second station with the aperture defined in the masking member being in a desired registration on a lead frame of the lead frame strip such that conductor end portions for connection to contacts of a corresponding semiconductor device are exposed through the aperture, the lead frame strip and the masking member being fed continuously one atop the other such that the lead frame and the aperture are in the required orientation for insertion into the aperture of a semiconductor device with each device contact being exclusively opposite to a co-operating conductor end portion, bonding the device contacts to the co-operating conductor end portions between the stations.

Claim 26

A continuous process for mounting semiconductor devices each rectangular shaped in plan on a strip of corresponding lead frames, the lead frames being uniformly spaced along the longitudinal axis of the strip, each lead frame having a matrix of conductors, the end portions of which are adapted for connection to contacts of a corresponding semiconductor device, comprises positioning a masking member to define at least one rectangular-shaped aperture for accurately locating the semiconductor devices, positively feeding the lead frame strip and the masking member longitudinally between a first and a second station with the aperture defined in the masking member being in a desired registration on a lead frame of the lead frame strip such that conductor end portions for connection to contacts of a corresponding semiconductor device are exposed through the aperture, the lead frame strip and the masking member being fed continuously one atop the other such that the lead frame and the aperture are in the required orientation for insertion into the aperture of a semiconductor device with each device contact being exclusively opposite to a co-operating conductor end portion, bonding the device contacts to the co-operating conductor end portions between the stations.

Claim 27

A method as set forth in claim 22 wherein said positive feeding step includes engaging said lead frame strip and masking member with at least one sprocket wheel at one of said stations, to feed the masking member and the lead frame strip in the desired registration with each other continuously between said first and said second stations upon rotation of said sprocket wheel.

Claim 28

A method as claimed in claim 22 including compensating for the curvature of the sprocket wheels.

Claim 29

A method as claimed in claim 24 including maintaining the aperture defined in the masking member to allow a corresponding semiconductor device to be a sufficiently close fit within the aperture so as to ensure that each device contact exclusively is opposite to the conductor end portion to which the contact is to be connected when the masking member is in the required registration with the lead frame.

Claim 30

A method as claimed in claim 24 including feeding the leading walls of the aperture as the masking member is fed through the apparatus in inclined relation to the longitudinal axis of the lead frame strip, and maintaining each device contact which is exclusively opposite to the conductor end portion to which the contact is to be connected when the masking member is in the required registration with the lead frame and the device contiguous with the following walls of the aperture.

Claim 31

A method as claimed in claim 26 further including positioning the corresponding semiconductor device contiguous with the following walls of the aperture when the masking member is in the desired registration with the lead frame strip.

Claim 32

A method as claimed in claim 27 wherein the step of positioning the corresponding semiconductor device continguous with the following walls of the aperture includes sweeping the semiconductor device into the required position as the masking member and the lead frame strip are fed between said stations.