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US4072593A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for production of a resistance element for resistance thermometers

Assignee: Evonik Operations GmbH
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Filing: 1976-12-16
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Granted: 1978-02-07
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Expires: 1996-12-16
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Abstract

Abstract There is provided a process of producing a resistance element for a resistance thermometer consisting of a thin platinum layer on an insulating solid as a carrier, by sputtering the platinum layer on the solid in a krypton-oxygen or xenon-oxygen mixture.

Inventors

  • 👤 Walter Diehl
  • 👤 Wolfgang Koehler

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 05:12
CPC Classifications
G; G01; G01K; G01K7/00; G01K7/16; G01K7/18; H; H01; H01C; H01C17/00; H01C17/06; H01C17/075; H01C17/12

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 56 words
A process of producing a resistance element for a resistance thermometer by sputtering, said resistance element consisting essentially of a thin platinum layer as the resistance material on an insulating material as a substrate, the improvement comprising applying the platinum to the substrate by sputtering in a gaseous oxidizing atmosphere consisting essentially of krypton-oxygen or xenon-oxygen.
Claim 2
Dependent Claim 56 words
A process of producing a resistance element for a resistance thermometer by sputtering, said resistance element consisting essentially of a thin platinum layer as the resistance material on an insulating material as a substrate, the improvement comprising applying the platinum to the substrate by sputtering in a gaseous oxidizing atmosphere consisting essentially of krypton-oxygen or xenon-oxygen.
Claim 3
Dependent Claim 27 words
A process according to claim 1 comprising the additional step of tempering the thin platinum layer at a temperature between 700° and 1200° C. after the sputtering.
Claim 4
Dependent Claim 23 words
The process according to claim 2 wherein a bias voltage less than the sputtering voltage is applied to the substrate during the sputtering.
Claim 5
Dependent Claim 23 words
The process according to claim 1, wherein a bias voltage less than the sputtering voltage is applied to the substrate during the sputtering.
Claim 6
Dependent Claim 16 words
The process of claim 1 wherein the gaseous atmosphere contains 20% oxygen and the balance xenon.
Claim 7
Dependent Claim 23 words
The process of claim 1 wherein the gaseous atmosphere is 10 to 50% oxygen by volume and the balance is krypton or xenon.
Claim 8
Dependent Claim 21 words
The process of claim 6 wherein the gaseous atmosphere is 10 to 50% oxygen by volume and the balance is xenon.
Claim 9
Dependent Claim 11 words
The process of claim 7 wherein the sputtering is RF sputtering.
Claim 10
Dependent Claim 11 words
The process of claim 6 wherein the sputtering is RF sputtering.
Claim 11
Dependent Claim 11 words
The process of claim 1 wherein the sputtering is RF sputtering.

References Cited (Backward Citations)

US3645783A Cited
US3833410A Cited
US3845443A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1981-02-06 1981-08-08 1982-02-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1985-02-06 1985-08-08 1986-02-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1989-02-06 1989-08-08 1990-02-07 $7700.00 Window Closed / Lapsed

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