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US4069493A Expired / Lapsed US ⏱️ 0.0 years remaining

Novel integrated circuit and method of manufacturing same

Assignee: Thales SA
•
Filing: 1976-04-26
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Granted: 1978-01-17
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Expires: 1996-04-26
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Abstract

Abstract An integrated circuit comprises a high-resistivity substrate 1 which virtually insulates the various integrated components of the circuit from one another and reduces the parasitic capacitances. This components are constituted by ion implantation through high-precision masks, without exceeding 800° C in temperature. This is the case with the source 3, the gate 9 and the drain 4, of the field-effect transistor (shown in FIG. 1).

Inventors

  • 👤 Albert Bobenrieth

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 14:45
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/80; H10D30/83; H10D84/00; H10D84/80; H10D84/811; H10D84/817; H10D86/00; H10D99/00; H10P; H10P30/00; H10P30/20; H10P30/22; H10W; H10W10/00; H10W10/01

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 160 words
A field effect transistor comprising: a weakly doped semiconductive substrate of a first conductivity type having a substantially plane surface, and, in said substrate, contiguous to said surface; a source and a drain region consisting of a first and a second ion implanted regions of a common depth, said common depth being on the order of one micron, said regions being highly doped by impurities of a second conductivity type opposite to said first type; a channel region consisting of a third ion implanted region of a common depth as said first and second regions and filling the whole space between said regions, said third region being of said second conductivity type but less doped than said first and second regions; a gate region consisting of a fourth ion implanted region, occupying a portion of said third region situated at equal distance of said first and second regions, said fourth region having a depth on the order of 0.5 micron.
Claim 2
Dependent Claim 160 words
A field effect transistor comprising: a weakly doped semiconductive substrate of a first conductivity type having a substantially plane surface, and, in said substrate, contiguous to said surface; a source and a drain region consisting of a first and a second ion implanted regions of a common depth, said common depth being on the order of one micron, said regions being highly doped by impurities of a second conductivity type opposite to said first type; a channel region consisting of a third ion implanted region of a common depth as said first and second regions and filling the whole space between said regions, said third region being of said second conductivity type but less doped than said first and second regions; a gate region consisting of a fourth ion implanted region, occupying a portion of said third region situated at equal distance of said first and second regions, said fourth region having a depth on the order of 0.5 micron.
Claim 3
Dependent Claim 146 words
A field effect transistor comprising: a weakly doped semiconductive substrate of a first conductivity type having a substantially plane surface, and a source and drain region contiguous to said surface, consisting of a first and a second regions of a common depth ion implanted in said substrate, said common depth being on the order of one micron, said regions being highly doped by impurities of a second conductivity type opposite to said first type; a channel region contiguous to said surface, consisting of a third region ion implanted in said substrate, of a common depth as said first and second regions and filling the whole space between said region, said third region being of said second conductivity type but less doped than said first and second regions; a Schottky gate occupying a portion of said surface situated at equal distance of said first and second regions.
Claim 4
Dependent Claim 146 words
A field effect transistor comprising: a weakly doped semiconductive substrate of a first conductivity type having a substantially plane surface, and a source and drain region contiguous to said surface, consisting of a first and a second regions of a common depth ion implanted in said substrate, said common depth being on the order of one micron, said regions being highly doped by impurities of a second conductivity type opposite to said first type; a channel region contiguous to said surface, consisting of a third region ion implanted in said substrate, of a common depth as said first and second regions and filling the whole space between said region, said third region being of said second conductivity type but less doped than said first and second regions; a Schottky gate occupying a portion of said surface situated at equal distance of said first and second regions.
Claim 5
Dependent Claim 26 words
An integrated circuit comprising a field effect transistor as claimed in claim 1, further comprising at least one resistor constituted by a portion of said substrate.
Claim 6
Dependent Claim 25 words
An integrated circuit comprising a field effect transistor as claimed in claim 2, further comprising at least one resistor constituted by a portion of substrate.

References Cited (Backward Citations)

US3413531A Cited
US3761328A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1981-01-16 1981-07-18 1982-01-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1985-01-16 1985-07-18 1986-01-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1989-01-16 1989-07-18 1990-01-17 $7700.00 Window Closed / Lapsed

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