Thermoplastic polyester compositions containing polyamide additives

Claim 3

The method of claim 1 wherein the polyamide has a softening point in the range 100° C and 240° C and amine value less than 3.

Claim 4

The method of claim 1 wherein the thermoplastic resin is selected from the group consisting of poly(ethylene terephthalate), poly(butylene terephthalate), poly(1,4-cyclohexylenedimethylene terephthalate) and copolyesters thereof.

Claim 5

The method of claim 1 wherein the polyamide is derived from a high molcular weight dibasic acid containing 75% or more C 36 dimer acid obtained by the dimerization of C 18 unsaturated monocarboxylic acids.

Claim 6

The method of claim 4 wherein the high molecular weight dibasic acid has an acid value in the range 180 to 215, saponification value in the range 190 to 205 and neutral equivalent from 265 to 310.

Claim 7

The method of claim 5 wherein the high molecular weight dibasic acid is hydrogenated and contains 90% or more C 36 dimer acid.

Claim 8

The method of claim 4 wherein the short-chain, saturated, aliphatic dibasic acid contains from 6 to 13 carbon atoms and constitutes from 1 to 20 weight percent of the total dibasic acid charge and the diamine is a mixture of two diamines, said diamines differing by at least 3 carbon atoms with the longer chain diamine constituting from about 5 to 35%, based on equivalents, of the total diamine charge.

Claim 9

The method of claim 7 wherein the thermoplastic resin is selected from the group consisting of poly(ethylene terephthalate), poly(butylene terephthalate), poly(1,4-cyclohexylenedimethylene terephthalate) and copolyesters thereof and the polyamide has a number average molecular weight in the range 10,000 to 35,000, softening point in the range 150° C to 210° C and amine value less than one and is present in an amount from 0.1 to 10% by weight.

Claim 10

An improved resin composition comprising a thermoplastic polyester or copolyester resin and from 0.01 to 20% by weight, based on the weight of said resin, of a high molecular weight polyamide obtained by the reaction of a high molecular weight aliphatic or cycloaliphatic dibasic acid having from 18 to 52 carbon atoms and up to 30 weight percent, based on the total dibasic acid charge, of a short-chain, saturated, aliphatic dibasic acid containing from 2 to 13 carbon atoms with an aliphatic, saturated diamine containing from 2 to 10 carbon atoms or a mixture of said diamines, said polyamide having a number average molecular weight from about 5,000 to 50,000 a softening point in the range 100° C to 240° C and amine value less than three.

Claim 11

An improved resin composition comprising a thermoplastic polyester or copolyester resin and from 0.01 to 20% by weight, based on the weight of said resin, of a high molecular weight polyamide obtained by the reaction of a high molecular weight aliphatic or cycloaliphatic dibasic acid having from 18 to 52 carbon atoms and up to 30 weight percent, based on the total dibasic acid charge, of a short-chain, saturated, aliphatic dibasic acid containing from 2 to 13 carbon atoms with an aliphatic, saturated diamine containing from 2 to 10 carbon atoms or a mixture of said diamines, said polyamide having a number average molecular weight from about 5,000 to 50,000 a softening point in the range 100° C to 240° C and amine value less than three.

Claim 12

The composition of claim 9 wherein the thermoplastic resin is selected from the group consisting of poly(ethylene terephthalate), poly (butylene terephthalate), poly(1,4-cyclohexylenedimethylene terephthalate) and copolyesters thereof and the polyamide is derived from a high molecular weight dibasic acid containing 75% or more C 36 dimer acid, obtained by the dimerization of C 18 unsaturated monocarboxylic acids, and having an acid value in the range 180 to 215, saponification value in the range 190 to 205 and neutral equivalent from 265 to 310, from 1 to 20 weight percent, based on the total dibasic acid charge, of a saturated, aliphatic dibasic acid containing from 6 to 13 carbon atoms and a mixture of two diamines, said diamines differing by at least three carbon atoms with the long-chain diamine constituting from about 5 to 35%, based on equivalents, of the total diamine charge.

Claim 13

The composition of claim 10 wherein the polyamide constitutes from 0.1 to 10% by weight of the resin.

Claim 14

The composition of claim 11 wherein the polyamide has a number average molecular weight in the range 10,000 to 35,000, a softening point in the range 150° C to 210° C and amine value less than one.

Claim 15

The composition of claim 11 wherein the high molecular weight dibasic acid is hydrogenated and contains 90% or more C 36 dimer acid and the diamine is a mixture of ethylenediamine and hexamethylenediamine.