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US4063673A Expired / Lapsed US ⏱️ 0.0 years remaining

Ultrasonic bonding head

Assignee: Motorola Solutions Inc
•
Filing: 1976-08-11
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Granted: 1977-12-20
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Expires: 1996-08-11
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Abstract

Abstract A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost stepped portion of the impact surface insures that the wire is maintained in a stationary or positively-held position with respect to the conductive regions so as to then allow both the stepped surfaces to transmit ultrasonic energy and insure scrubbing action between the elements to be bonded.

Inventors

  • 👤 Stanley Gaicki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 20:53
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/10; B23K20/106; H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/5363

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 98 words
A stepped bonding head for receiving a wire having a diameter substantially in the range of 8-25 mils for simultaneously providing holding and bonding forces during a bonding operation comprising: a. first and second recessed bonding surfaces being located at different planes from each other and separated from each other a predetermined vertical distance by a third surface, and b. said third surface being disposed at an angle for transversely intersecting the longitudinal axis of said wire during the bonding operation and said predetermined vertical distance being of a dimension less than that capable of shearing said wire.
Claim 2
Dependent Claim 98 words
A stepped bonding head for receiving a wire having a diameter substantially in the range of 8-25 mils for simultaneously providing holding and bonding forces during a bonding operation comprising: a. first and second recessed bonding surfaces being located at different planes from each other and separated from each other a predetermined vertical distance by a third surface, and b. said third surface being disposed at an angle for transversely intersecting the longitudinal axis of said wire during the bonding operation and said predetermined vertical distance being of a dimension less than that capable of shearing said wire.
Claim 3
Dependent Claim 64 words
A stepped bonding head for receiving a wire having diameter substantially in the range of 8-25 mils for simultaneously providing holding and bonding forces during a bonding operation as in claim 1 wherein: said stepped bonding head member further includes a means for transmitting ultrasonic energy to said bonding head for effecting an ultrasonic bond between said wire and an electrically conductive metal region.
Claim 4
Dependent Claim 59 words
A stepped bonding head for receiving a wire having diameter substantially in the range of 8-25 mils for simultaneously providing holding and bonding forces during a bonding operation as in claim 2 wherein: a. said electrically conductive region comprises a metallic post, and said ultrasonic energy is operative to insure a scrubbing action between said wire and said post.
Claim 5
Dependent Claim 47 words
A stepped bonding head for receiving a wire having diameter substantially in the range of 8-25 mils for simultaneously providing holding and bonding forces during a bonding operation as in claim 1 wherein: a. said first and second recessed bonding surfaces are each constituted by non-intersecting surfaces.
Claim 6
Dependent Claim 50 words
A stepped bonding head for receiving a wire having a diameter substantially in the range of 8-25 mils for simultaneously providing holding and bonding forces during a bonding operation as in claim 1 wherein: a. said first and second recessed bonding surfaces are each constituted by surfaces capable of intersecting.

References Cited (Backward Citations)

US3216640A Cited
US3383757A Cited
US3347442A Cited
US3461538A Cited
US3627192A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-12-19 1981-06-20 1981-12-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-12-19 1985-06-20 1985-12-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-12-19 1989-06-20 1989-12-20 $7700.00 Window Closed / Lapsed

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