Patent US4063348A successfully refreshed from Google Patents.
← Back to Patent Explorer
US4063348A Expired / Lapsed US ⏱️ 0.0 years remaining

Unique packaging method for use on large semiconductor devices

Assignee: Bendix Corp
•
Filing: 1976-08-09
•
Granted: 1977-12-20
•
Expires: 1996-08-09
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A silicon controlled rectifier having a triangular base with a planar mounting surface and holes at the apices of the angles to receive screws for mounting the rectifier to a heat sink surface. A cylindrical anode is connected to the base and a semiconductor pellet is positioned on the base within the cylindrical anode. A spring loaded cathode tube is positioned coaxially within the cylindrical anode in engagement with the semiconductor pellet and a spring loaded gate is positioned coaxially within the cathode tube in engagement with the pellet to pressure mount the pellet on the base.

Inventors

  • 👤 Raymond Walter Borden
  • 👤 James Edward DeBard

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 06:37
CPC Classifications
H; H10; H10W; H10W72/00; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/136; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 130 words
A method of assembling a semiconductor device comprising securing a diaphragm with an aperture therein by means of insulation to a ring-shaped electrode, assembling a spring member on a cylindrical electrode having a flange at one end and inserting the cylindrical electrode through the aperture in the diaphragm and attaching the cylindrical electrode to the diaphragm with the spring-like member in relaxed position between the flange and the diaphragm, assembling a tube-like member to a base and positioning a semiconductor pellet within the tube-like member on the base, positioning the flange of the cylindrical electrode on the semiconductor pellet and compressing the spring member until the ring-shaped electrode engages the tube-like member on the base, and securing the ring-shaped electrode to the tube-like member with the spring member under compression.
Claim 2
Independent Claim 130 words
A method of assembling a semiconductor device comprising securing a diaphragm with an aperture therein by means of insulation to a ring-shaped electrode, assembling a spring member on a cylindrical electrode having a flange at one end and inserting the cylindrical electrode through the aperture in the diaphragm and attaching the cylindrical electrode to the diaphragm with the spring-like member in relaxed position between the flange and the diaphragm, assembling a tube-like member to a base and positioning a semiconductor pellet within the tube-like member on the base, positioning the flange of the cylindrical electrode on the semiconductor pellet and compressing the spring member until the ring-shaped electrode engages the tube-like member on the base, and securing the ring-shaped electrode to the tube-like member with the spring member under compression.
Claim 3
Dependent Claim 48 words
The method described in claim 1 including the steps of assembling a spring compressible electrode coaxial with the cylindrical electrode and insulated therefrom so that the spring compressible electrode contracts and engages the semiconductor pellet under compression when the other two electrodes are assembled to the base assembly.
Claim 4
Dependent Claim 58 words
A method of assembling a semiconductor device as described in claim 1 including the step of assembling a cup-shaped member to the base within the tube-like member to receive the semiconductor pellet and maintain the semiconductor pellet in centered position within the tube-like member on the base and provide an electrical interface between the base and the pellet.

References Cited (Backward Citations)

US3192454A Cited
GB1070092A Cited
US3480844A Cited
US3512249A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-12-19 1981-06-20 1981-12-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-12-19 1985-06-20 1985-12-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-12-19 1989-06-20 1989-12-20 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag