Glass-moulded type semiconductor device

Claim 2

A glass-moulded type semiconductor device comprising at least one semiconductor pellet having at least one p-n junction extending to a lateral circumferential surface, lead electrodes each having a thermal expansion coefficient much greater than that of said at least one semiconductor pellet and including a header portion to which said at least one semiconductor pellet can be adhesively fixed, a soft solder having a low melting point for adhesively fixing said lead electrodes to both sides of said at least one semiconductor pellet, and a mould glass having a passivation function to said at least one p-n junction of said at least one semiconductor pellet and adhesively fixed to said at least one semiconductor pellet all over the surface of its lateral circumference and having a thermal expansion coefficient substantially approximate to that of said at least one semiconductor pellet.

Claim 3

A glass-moulded type semiconductor device according to claim 1, wherein said lead electrodes are provided at least at their header portion with a film non-adhesive to said mould glass, and said mould glass is provided over a range elongating from the header portion of one of said lead electrodes to the header portion of the other.

Claim 4

A glass-moulded type semiconductor device according to claim 1, wherein said lead electrodes include a flange portion at a position a predetermined distance spaced from said header portion and are provided with a film which elongates at least from the header to flange portions and has non-adhesive property to the mould glass, and said mould glass is provided over a range elongating from the flange portion of one of said lead electrodes to the flange portion of the other.

Claim 5

A glass-moulded type semiconductor device according to claim 1, wherein said lead electrodes are made of copper or copper alloy and said at least one semiconductor pellet is made of silicon, and wherein a stopper for preventing the mutual diffusion of copper and silicon is provided between the header portion of said lead electrode and said at least one semiconductor pellet.

Claim 6

A glass-moulded type semiconductor device according to claim 3, wherein said at least one semiconductor pellet is of a mesa-type in structure having main surfaces different in area on both sides thereof, the header portion of said lead electrodes having a diameter substantially coinciding with a diameter of the main surface of small area on one side of said at least one semiconductor pellet, and the flange portion thereof having a diameter substantially coinciding with a diameter of the main surface of large area on the other side of said at least one semiconductor pellet.

Claim 7

A glass-moulded type semiconductor device according to claim 1, wherein the header portion of said lead electrodes is large in area on the side on which said at least one semiconductor pellet adheres thereto and small in area on the other side, and trapezoidal in section taken along a direction along with said at least one semiconductor pellet adheres thereto.

Claim 8

A glass-moulded semiconductor device comprising: a semiconductor pellet structure including at least one pn junction which extends to a lateral circumferential surface bounded by first and second end surfaces; a first lead electrode having a thermal expansion coefficient much greater than that of said semiconductor pellet structure, said first lead electrode having a header portion at one end thereof which faces said first end surface of said semiconductor pellet structure; a second lead electrode having a thermal expansion coefficient much greater than that of said semiconductor pellet structure, said second lead electrode having a header portion at one end thereof which faces said second end surface of said semiconductor pellet structure; first means, disposed between and contiguous with said first end surface of said semiconductor pellet structure and the header portion of said first lead electrode, for fixedly securing said first lead electrode to said semiconductor pellet structure and including soft solder material having a low melting point which is contiguous with both said first end surface of said semiconductor pellet structure and the header portion of said first lead electrode; second means, disposed between and contiguous with said second end surface of said semiconductor pellet structure and the header portion of said second lead electrode, for fixedly securing said second lead electrode to said semiconductor pellet structure and including said soft solder material having said low melting point which is contiguous with both said second end surface of said semiconductor pellet structure and the header portion of said second lead electrode; and moulded glass material for passivating said at least one pn junction and being contiguous with the entire lateral circumferential surface of said semiconductor pellet structure and having a thermal expansion coefficient approximating that of said semiconductor pellet structure; and wherein said low melting point of said soft solder material is lower than the melting point of said moulded glass material.

Claim 9

A glass-moulded semiconductor device comprising: a semiconductor pellet structure including at least one pn junction which extends to a lateral circumferential surface bounded by first and second end surfaces; a first lead electrode having a thermal expansion coefficient much greater than that of said semiconductor pellet structure, said first lead electrode having a header portion at one end thereof which faces said first end surface of said semiconductor pellet structure; a second lead electrode having a thermal expansion coefficient much greater than that of said semiconductor pellet structure, said second lead electrode having a header portion at one end thereof which faces said second end surface of said semiconductor pellet structure; first means, disposed between and contiguous with said first end surface of said semiconductor pellet structure and the header portion of said first lead electrode, for fixedly securing said first lead electrode to said semiconductor pellet structure and including soft solder material having a low melting point which is contiguous with both said first end surface of said semiconductor pellet structure and the header portion of said first lead electrode; second means, disposed between and contiguous with said second end surface of said semiconductor pellet structure and the header portion of said second lead electrode, for fixedly securing said second lead electrode to said semiconductor pellet structure and including said soft solder material having said low melting point which is contiguous with both said second end surface of said semiconductor pellet structure and the header portion of said second lead electrode; and moulded glass material for passivating said at least one pn junction and being contiguous with the entire lateral circumferential surface of said semiconductor pellet structure and having a thermal expansion coefficient approximating that of said semiconductor pellet structure; and wherein said low melting point of said soft solder material is lower than the melting point of said moulded glass material.

Claim 10

A glass-moulded semiconductor device according to claim 7, wherein each of said first and second means includes a stopper, made of a material which prevents the mutual diffusion of the semiconductor material of said semiconductor pellet structure and the material of each of said lead electrodes into each other, having opposite surfaces contiguous with and disposed between layers of said soft solder material.

Claim 11

A glass-moulded semiconductor device according to claim 8, wherein at least the header portion of each lead electrode includes a film of material to which said glass material is non-adhesive.

Claim 12

A glass-moulded semiconductor device according to claim 9, wherein each lead electrode has a flange portion spaced apart from the header portion thereof, said moulded glass being confined between the flange portions of said lead electrodes.

Claim 13

A glass-moulded semiconductor device according to claim 10, wherein said film of material to which said glass material is non-adhesive extends to include the flange portions of said lead electrodes.

Claim 14

A glass-moulded semiconductor device according to claim 8, wherein said semiconductor pellet structure is made of silicon, each lead electrode is made of copper, and said soft solder material is a lead-silver-tin solder.

Claim 15

A glass-moulded semiconductor device according to claim 7, wherein said semiconductor pellet structure has a mesa configuration one of said first and second end surfaces of which has a diameter corresponding to that of the header portion of the lead electrode to which it is fixedly secured.

Claim 16

A glass-moulded semiconductor device according to claim 13, wherein each of said first and second means includes a stopper, made of a material which prevents the mutual diffusion of the semiconductor material of said semiconductor pellet structure and the material of each of said lead electrodes into each other, having opposite surfaces contiguous with and disposed between layers of said soft solder material.

Claim 17

A glass-moulded semiconductor device according to claim 14, wherein each of the first and second end surfaces of said semiconductor pellet structure is provided with a film of a material which is contiguous with the semiconductor material of said pellet structure and said soft solder material, and is made of a material to which said soft solder material readily adheres.

Claim 18

A glass-moulded semiconductor device according to claim 15, wherein each of said stoppers is made of a material the thermal expansion coefficient of which is intermediate those of the semiconductor material of said pellet structure and the material of said lead electrodes.

Claim 19

A glass-moulded semiconductor device according to claim 16, wherein said semiconductor pellet structure is made of silicon, each lead electrode is made of copper, each stopper is made of an iron-nickel alloy, and said soft solder material is a lead-silver-tin solder.

Claim 20

A glass-moulded semiconductor device according to claim 7, wherein the header portion of each electrode includes a stopper made of a material which prevents the mutual diffusion of the semiconductor material of said semiconductor pellet structure and the material of the lead electrode into each other, the soft solder material being contiguous with one surface of said stopper.

Claim 21

A glass-moulded semiconductor device according to claim 18, wherein at least the header portion of each lead electrode includes a film of material to which said glass material is non-adhesive.

Claim 22

A glass-moulded semiconductor device according to claim 19, wherein each lead electrode has a flange portion spaced apart from the header portion thereof, said moulded glass being confined between the flange portions of said lead electrodes.

Claim 23

A glass-moulded semiconductor device according to claim 18, wherein each of said stoppers is made of a material the thermal expansion coefficient of which is intermediate those of the semiconductor material of said pellet structure and the material of said lead electrodes.

Claim 24

A glass-moulded semiconductor device according to claim 21, wherein said semiconductor pellet structure is made of silicon, each lead electrode is made of copper, each stopper is made of an iron-nickel alloy, and said soft solder material is a lead-silver-tin solder.

Claim 25

A glass-moulded semiconductor device according to claim 18, wherein the entirety of the header portion of each electrode is formed of said stopper.

Claim 26

A glass-moulded semiconductor device according to claim 7, wherein each of said first and second means consists exclusively of a thin layer of said soft solder material, and wherein said first and second end surfaces of said semiconductor pellet structure and the surfaces of each of said header portions of said lead electrodes are provided with films of material which prevent the mutual diffusion of the semiconductor material of said semiconductor pellet structure and the material of each of said lead electrodes into each other, contiguous with the respective thin layers of soft solder material therebetween.

Claim 27

A glass-moulded semiconductor device according to claim 24, wherein the header portion of each lead electrode has a frusto-conical configuration and has at least one axial recess in the surface thereof into which said moulded glass material penetrates.

Claim 28

A glass-moulded semiconductor device according to claim 24, wherein the header portion of each lead electrode has a frusto-conical configuration and has at least one projection on the surface thereof surrounded by the moulded glass material.

Claim 29

A glass-moulded semiconductor device according to claim 24, wherein said films of materials are films of a material to which said glass material is non-adhesive.

Claim 30

A glass-moulded semiconductor device according to claim 27, wherein said semiconductor pellet structure is made of silicon, each lead electrodes is made of copper, said soft solder material is lead-silver-tin solder, and said films of material are made of nickel.