Brazed joint between a beryllium-base part and a part primarily of a metal that is retractable with beryllium to form a brittle intermetallic compound

Claim 2

In combination, a first part that is primarily of beryllium, a second part that is primarily of a metal that forms brittle intermediate compounds with beryllium at temperatures above a predetermined level, and a brazed joint between said first part and said second part that is made using temperatures above said predetermined level, said brazed joint comprising: a. a first layer of brazing alloy in contact with said first part and brazed thereto, said brazing alloy just prior to being brazed to said first part consisting essentially of silver and a minor constituent selected from the group consisting of tin, silicon, indium and combinations of two or more of said elemental minor constituents; the tin being present in a range of 4 to 15% by weight of the alloy in the case of a silver-tin alloy; the silicon being present in a range of 1 to 5% by weight of the alloy in the case of a silver-silicon alloy; the indium being present in a range of 6 to 25% by weight of the alloy in the case of a silver-indium alloy; and the combination being present in such a weight percentage that the alloy has a solidus temperature of between 675° C. and 900° C. in the case of an alloy of silver and said combination of elemental minor constituents; b. a second layer contacting said first layer and brazed thereto; said second layer being of a material that just prior to being brazed to said first layer consists essentially of silver, c. and means forming a brazed connection between said second layer and said second part.

Claim 3

The brazed joint of claim 1 in which said brazed connection between said second layer and said second part is made at temperatures exceeding 600° with a brazing alloy having a liquidus temperature below the solidus temperature of the brazing alloy of said first layer.

Claim 4

The structure of claim 2 in which said first part is the contact of a vacuum circuit interrupter and said second part is a support therefor.

Claim 5

The combination of claim 2 in which said brazing alloy of said connection between said second layer and said second part comprises silver and copper.

Claim 6

The brazed joint of claim 1 in which the primary metal of said second part is either copper, nickel, or iron.

Claim 7

The brazed joint of claim 1 in which the primary metal of said second part is copper.

Claim 8

The structure of claim 6 in which said first part is the contact of a vacuum circuit interrupter and said second part is a support therefor.

Claim 9

The combination of claim 6 in which, after the brazed joint has been made, the major portion of the interface between the brazing alloy and said first part is substantially free of brittle copper-beryllium intermetallic compounds.

Claim 10

The brazed joint of claim 1 in which the primary metal of said second part is nickel.

Claim 11

The brazed joint of claim 1 in which the primary metal of said second part is iron.

Claim 12

The brazed joint of claim 1 in which said first layer just prior to being brazed to said first part consists essentially of a silver-tin alloy.

Claim 13

The brazed joint of claim 1 in which said first layer just prior to being brazed to said first part consists essentially of a silver-tin alloy containing about 11% tin by weight of the alloy.

Claim 14

The brazed joint of claim 1 in which said first layer just prior to being brazed to said first part consists essentially of a silver-silicon alloy.

Claim 15

The brazed joint of claim 1 in which said first layer just prior to being brazed to said first part consists essentially of a silver-silicon alloy containing about 3% silicon by weight of the alloy.

Claim 16

The brazed joint of claim 1 in which said first layer just prior to being brazed to said first part consists essentially of a silver-indium alloy.

Claim 17

The brazed joint of claim 1 in which said first layer just prior to being brazed to said first part consists essentially of a silver-indium alloy containing about 15% indium by weight of the alloy.

Claim 18

The brazed joint of claim 1 in which said first layer just prior to being brazed to said first part consists essentially of an alloy of silver and the combination of two or more of the following: tin, silicon, and indium.

Claim 19

The structure of claim 1 in which said first part is the contact of a vacuum circuit interrupter and said second part is a support therefor.

Claim 20

The combination of claim 1 in which, after the brazed joint has been made, the major portion of the interface between the brazing alloy and said first part is substantially free of brittle intermetallic compounds of beryllium.

Claim 21

The combination of claim 1 in which, after the brazed joint has been made, the major portion of the interface between the brazing alloy and said first part is substantially free of brittle copper-beryllium intermetallic compounds.

Claim 22

In combination, a first part that is primarily of beryllium, a second part that is primarily of a metal that forms brittle intermetallic compounds with beryllium at temperatures above a predetermined level, and a brazed joint between said first part and said second part that is made using temperatures above said predetermined level, said brazed joint comprising: a. a first layer of brazing alloy in contact with said first part along a predetermined broad interface and brazed thereto along said interface, said brazing alloy just prior to being brazed to said first part consisting essentially of silver and a minor constituent selected from the group consisting of tin, silicon, indium and combinations of two or more of said elemental minor constituents; the tin being present in a range of 4 to 15% by weight of the alloy in the case of a silver-tin alloy; the silicon being present in a range of 1 to 5% by weight of the alloy in the case of a silver-silicon alloy; the indium being present in a range of 6 to 25% by weight of the alloy in the case of a silver-indium alloy; and the combination being present in such a weight percentage that the alloy has a solidus temperature of between 675° C. and 900° C. in the case of an alloy of silver and said combination of elemental minor constituents; b. and means forming a brazed connection between said first layer and said second part, c. said first layer being sufficiently thick to preclude any significant amount of diffusion through said first layer into said interface of such metal from said second part or from said brazed connection that will form a brittle intermetallic compound with beryllium at temperatures used in making said brazed connection.

Claim 23

In combination, a first part that is primarily of beryllium, a second part that is primarily of a metal that forms brittle intermetallic compounds with beryllium at temperatures above a predetermined level, and a brazed joint between said first part and said second part that is made using temperatures above said predetermined level, said brazed joint comprising: a. a first layer of brazing alloy in contact with said first part along a predetermined broad interface and brazed thereto along said interface, said brazing alloy just prior to being brazed to said first part consisting essentially of silver and a minor constituent selected from the group consisting of tin, silicon, indium and combinations of two or more of said elemental minor constituents; the tin being present in a range of 4 to 15% by weight of the alloy in the case of a silver-tin alloy; the silicon being present in a range of 1 to 5% by weight of the alloy in the case of a silver-silicon alloy; the indium being present in a range of 6 to 25% by weight of the alloy in the case of a silver-indium alloy; and the combination being present in such a weight percentage that the alloy has a solidus temperature of between 675° C. and 900° C. in the case of an alloy of silver and said combination of elemental minor constituents; b. and means forming a brazed connection between said first layer and said second part, c. said first layer being sufficiently thick to preclude any significant amount of diffusion through said first layer into said interface of such metal from said second part or from said brazed connection that will form a brittle intermetallic compound with beryllium at temperatures used in making said brazed connection.

Claim 24

The brazed joint of claim 21 in which said first layer just prior to being brazed to said first part consists essentially of a silver-tin alloy.

Claim 25

The brazed joint of claim 21 in which said first layer just prior to being brazed to said first part consists essentially of a silver-silicon alloy.

Claim 26

The brazed joint of claim 21 in which said first layer just prior to being brazed to said first part consists essentially of a silver-indium alloy.

Claim 27

The brazed joint of claim 21 in which said first layer just prior to being brazed to said first part consists essentially of an alloy of silver and the combination of two or more of the following: tin, silicon, and indium.

Claim 28

The brazed joint of claim 21 in which the primary metal of said second part is copper.

Claim 29

The combination of claim 21 in which said brazed connection is made at temperatures exceeding 600° C.