Hermetic topsealant coating and process for its formation

Claim 2

A process for forming a hermetic seal coating on electronic circuitry comprising applying to said circuitry a mixture which includes: a. a vinyl unsaturated silane monomer b. a bifunctional silane adhesion promoter c. a polymeric plasticizer, and d. an organic solvent and curing said mixture to form a solid, adherent, cross-linked polysilane coating on said circuitry.

Claim 3

The process of claim 1 wherein the mixture includes by weight 0.5 to 10 parts of monomer, 0.5 to 10 parts of adhesion promoter, 1 to 15 parts of polymeric plasticizer and sufficient organic solvent to provide a mixture which contains 1 to 50% by weight concentration of the other ingredients.

Claim 4

A composition for forming a hermetic seal coating on electronic circuitry comprising a mixture which includes: a. a vinyl unsaturated silane monomer b. a bifunctional silane adhesion promoter c. a polymeric plasticizer, and d. an organic solvent.

Claim 5

A composition for forming a hermetic seal coating on electronic circuitry comprising a mixture which includes: a. a vinyl unsaturated silane monomer b. a bifunctional silane adhesion promoter c. a polymeric plasticizer, and d. an organic solvent.

Claim 6

The composition of claim 3 wherein the mixture includes by weight 0.5 to 10 parts of monomer, 0.5 to 10 parts of adhesion promoter, 0.1 to 15 parts of plasticizer, and sufficient organic solvent to provide a mixture which contains 1 to 50% by weight concentration of the other ingredients.

Claim 7

The composition of claim 4 wherein said mixture includes a stabilizer.

Claim 8

The composition of claim 5 in which the mixture includes by weight: 0 to 80 parts of stabilizer.

Claim 9

A process for forming a hermetic seal coating over electronic circuitry, which is supported on the surface of a substrate, comprising applying to said surface and circuitry a mixture which includes: a. 0.5 to 10 parts by weight of a vinyl unsaturated silane monomer selected from the group consisting of, pentamethyldisiloxane methylmethacrylate, vinyltrichlorosilane, vinyltriethoxysilane and vinyltris(2-methoxyethoxy)silane; b. 0.5 to 10 parts by weight of a bifunctional silane adhesion promoter selected from the group consisting of, gamma-aminopropyltriethoxysilane, beta-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane, and N-beta(aminoethyl)-gamma-aminopropyl-trimethoxysilane; c. 0.1-15 parts by weight of a polymeric plasticizer selected from the group consisting of, epoxy resins, polyesters, polycarbonates, polychloroprene, polystyrene, alkyd resins, allyl resins, amino resins, polysulfone resins, vinyl polymers and copolymers, urea and melamine resins and amide/imide polymers, d. 0.0-80 parts by weight of a stabilizer selected from the group consisting of dimethylacetamide, N N-dimethylaniline, piperidine, 4',4'-dimethoxy-diphenylamine, and phenyl-alpha-naphthylamine, and e. an organic solvent in an amount to provide 1-50% by weight concentration of the other ingredients, and curing said mixture to form a solid, adherent, cross-linked polysilane coating having a thickness of from about 50 microinches to about 3 mils on said surface and circuitry.

Claim 10

A process for forming a hermetic seal coating over electronic circuitry, which is supported on the surface of a substrate, comprising applying to said surface and circuitry a mixture which includes: a. 0.5 to 10 parts by weight of a vinyl unsaturated silane monomer selected from the group consisting of, pentamethyldisiloxane methylmethacrylate, vinyltrichlorosilane, vinyltriethoxysilane and vinyltris(2-methoxyethoxy)silane; b. 0.5 to 10 parts by weight of a bifunctional silane adhesion promoter selected from the group consisting of, gamma-aminopropyltriethoxysilane, beta-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane, and N-beta(aminoethyl)-gamma-aminopropyl-trimethoxysilane; c. 0.1-15 parts by weight of a polymeric plasticizer selected from the group consisting of, epoxy resins, polyesters, polycarbonates, polychloroprene, polystyrene, alkyd resins, allyl resins, amino resins, polysulfone resins, vinyl polymers and copolymers, urea and melamine resins and amide/imide polymers, d. 0.0-80 parts by weight of a stabilizer selected from the group consisting of dimethylacetamide, N N-dimethylaniline, piperidine, 4',4'-dimethoxy-diphenylamine, and phenyl-alpha-naphthylamine, and e. an organic solvent in an amount to provide 1-50% by weight concentration of the other ingredients, and curing said mixture to form a solid, adherent, cross-linked polysilane coating having a thickness of from about 50 microinches to about 3 mils on said surface and circuitry.

Claim 11

The process of claim 7 wherein the monomer is pentamethyldisiloxane methylmethacrylate and the adhesion promoter is beta-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane.

Claim 12

The process of claim 7 wherein the monomer is pentamethyldisiloxane and the adhesion promoter is gamma-aminopropyltriethoxysilane.

Claim 13

The process of claim 7 wherein the curing is achieved by a three step heating cycle in which the mixture is first dried to a viscous state by heating at temperatures of from about 40° to 75° C, is next polymerized to a solid film by heating at temperatures of from about 80° to 110° C and is finally cured to a dimensionally stable state by heating at temperatures of from about 115° to 180° C.

Claim 14

A composition for forming a hermetic seal coating on electronic circuitry comprising a mixture which includes: a. 0.5 to 10 parts by weight of, a vinyl unsaturated silane monomer selected from the group consisting of, pentamethyldisiloxane methylmethacrylate, vinyltrichlorosilane, vinyltriethoxysilane and vinyltris(2-methoxyethoxy)silane; b. 0.5 to 10 parts by weight of a bifunctional silane adhesion promoter selected from the group consisting of, gamma-aminopropyltriethoxysilane, beta-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane, and N-beta(aminoethyl)-gamma-aminopropyl-trimethoxysilane; c. 0.1-15 parts by weight of a polymeric plasticizer selected from the group consisting of, epoxy resins, polyesters, polycarbonates, polychloroprene, polystyrene, alkyd resins, allyl resins, amino resins, polysulfone resins, vinyl polymers and copolymers, urea and melamine resins and amide/imide polymers, d. 0.0-80 parts by weight of a stabilizer selected from the group consisting of dimethylacetamide, N N-dimethylaniline, piperidine, 4',4'-dimethoxy-diphenylamine, and phenyl-alpha-naphthylamine, and e. an organic solvent in an amount to provide 1-50% by weight concentration of the other ingredients.

Claim 15

A composition for forming a hermetic seal coating on electronic circuitry comprising a mixture which includes: a. 0.5 to 10 parts by weight of, a vinyl unsaturated silane monomer selected from the group consisting of, pentamethyldisiloxane methylmethacrylate, vinyltrichlorosilane, vinyltriethoxysilane and vinyltris(2-methoxyethoxy)silane; b. 0.5 to 10 parts by weight of a bifunctional silane adhesion promoter selected from the group consisting of, gamma-aminopropyltriethoxysilane, beta-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane, and N-beta(aminoethyl)-gamma-aminopropyl-trimethoxysilane; c. 0.1-15 parts by weight of a polymeric plasticizer selected from the group consisting of, epoxy resins, polyesters, polycarbonates, polychloroprene, polystyrene, alkyd resins, allyl resins, amino resins, polysulfone resins, vinyl polymers and copolymers, urea and melamine resins and amide/imide polymers, d. 0.0-80 parts by weight of a stabilizer selected from the group consisting of dimethylacetamide, N N-dimethylaniline, piperidine, 4',4'-dimethoxy-diphenylamine, and phenyl-alpha-naphthylamine, and e. an organic solvent in an amount to provide 1-50% by weight concentration of the other ingredients.

Claim 16

A process for forming a hermetic seal coating on metal conductor lines on the surface of a substrate having integrated circuit chips electrically bonded thereto comprising: applying to said surface a coating material comprises: a. 0.5 to 10 parts by weight of, a vinyl unsaturated silane monomer selected from the group consisting of, pentamethyldisiloxane methylmethacrylate, vinyltrichlorosilane, vinyltriethoxysilane and vinyltris(2-methoxyethoxy)silane; b. 0.5 to 10 parts by weight of a bifunctional silane adhesion promoter selected from the group consisting of, gamma-aminopropyltriethoxysilane, beta-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane, and N-beta(aminoethyl)-gamma-aminopropyl-trimethoxysilane; c. 0.1-15parts by weight of a polymeric plasticizer selected from the group consisting of, epoxy resins, polyesters, polycarbonates, polychloroprene, polystyrene, alkyd resins, allyl resins, amino resins, polysulfone resins, vinyl polymers and copolymers, urea and melamine resins and amide/imide polymers, d. 0.0-80 parts by weight of a stabilizer selected from the group consisting of dimethylacetamide, N N-dimethylaniline, piperidine, 4',4'-dimethoxy-diphenylamine, and phenyl-alpha-naphthylamine, and e. an organic solvent in an amount to provide 1-50% by weight concentration of the other ingredients, said coating material being applied to a wet thickness less than the distance between the substrate surface and the bottom surface of the chip with the solid content of said coating material being adjusted to provide a dry coating thickness on said conductor lines of 400 to 500 microinches, and curing said coating material by a three step heating cycle in which the mixture is first dried to a viscous state by heating at temperatures of from about 40° to 75° C, is next polymerized to a solid film by by heating at temperatures of from about 80° to 110° C and is finally cured to a dimensionally stable state by heating at temperatures of from about 115° to 180° C.

Claim 17

A process for forming a hermetic seal coating on metal conductor lines on the surface of a substrate having integrated circuit chips electrically bonded thereto comprising: applying to said surface a coating material comprises: a. 0.5 to 10 parts by weight of, a vinyl unsaturated silane monomer selected from the group consisting of, pentamethyldisiloxane methylmethacrylate, vinyltrichlorosilane, vinyltriethoxysilane and vinyltris(2-methoxyethoxy)silane; b. 0.5 to 10 parts by weight of a bifunctional silane adhesion promoter selected from the group consisting of, gamma-aminopropyltriethoxysilane, beta-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, gamma-glycidoxypropyltrimethoxysilane, and N-beta(aminoethyl)-gamma-aminopropyl-trimethoxysilane; c. 0.1-15parts by weight of a polymeric plasticizer selected from the group consisting of, epoxy resins, polyesters, polycarbonates, polychloroprene, polystyrene, alkyd resins, allyl resins, amino resins, polysulfone resins, vinyl polymers and copolymers, urea and melamine resins and amide/imide polymers, d. 0.0-80 parts by weight of a stabilizer selected from the group consisting of dimethylacetamide, N N-dimethylaniline, piperidine, 4',4'-dimethoxy-diphenylamine, and phenyl-alpha-naphthylamine, and e. an organic solvent in an amount to provide 1-50% by weight concentration of the other ingredients, said coating material being applied to a wet thickness less than the distance between the substrate surface and the bottom surface of the chip with the solid content of said coating material being adjusted to provide a dry coating thickness on said conductor lines of 400 to 500 microinches, and curing said coating material by a three step heating cycle in which the mixture is first dried to a viscous state by heating at temperatures of from about 40° to 75° C, is next polymerized to a solid film by by heating at temperatures of from about 80° to 110° C and is finally cured to a dimensionally stable state by heating at temperatures of from about 115° to 180° C.

Claim 18

The process of claim 12 wherein the coating material consists essentially of: 1-1.6 parts by weight said silane monomer, 1-1.6 parts by weight of said silane adhesion promoter, 1-2 parts by weight of said polymeric plasticizer, 3-10 parts by weight of said stabilizer, and 10-20 parts by weight of said organic solvent.