Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
162 words
A method of producing a diode comprising the steps of: a. providing a semiconductor body of a first conductivity type and having a high resistivity; b. carrying out from at least one surface of said semi-conductor body at least two successive diffusions with a higher concentration of doping impurities of the said first conductivity type, a first region of said semiconductor diode being formed by the portion of said semiconductor body that is substantially free of said diffused doping impurities and the diffused portion of said semiconductor body forming a more highly doped second region of said semiconductor body, said doping impurity concentration in said second region having a graded distribution such that said impurity concentration increases with increasing distance from the interface between said first and second region; c. reducing the thickness of said first region; and then d. providing in said first region a zone of opposite conductivity type so as to form a diode junction in said first region.
Claim 2
Independent Claim
162 words
A method of producing a diode comprising the steps of: a. providing a semiconductor body of a first conductivity type and having a high resistivity; b. carrying out from at least one surface of said semi-conductor body at least two successive diffusions with a higher concentration of doping impurities of the said first conductivity type, a first region of said semiconductor diode being formed by the portion of said semiconductor body that is substantially free of said diffused doping impurities and the diffused portion of said semiconductor body forming a more highly doped second region of said semiconductor body, said doping impurity concentration in said second region having a graded distribution such that said impurity concentration increases with increasing distance from the interface between said first and second region; c. reducing the thickness of said first region; and then d. providing in said first region a zone of opposite conductivity type so as to form a diode junction in said first region.
Claim 3
Dependent Claim
38 words
A method as defined in claim 1, wherein said impurities are diffused in said semiconductor body to a predetermined depth so that the thickness of said first region is substantially equal to the thickness of said second region.
Claim 4
Dependent Claim
56 words
A method as defined in claim 1, wherein said second region comprises a first zone and a second zone produced by two successive diffusions, the doping impurity concentration and the depth of said second zones being higher and smaller, respectively, than those of said first zone, said first zone being disposed nearer to said diode junction.
Claim 5
Dependent Claim
52 words
A method as claimed in claim 1, wherein said second region is obtained by diffusion via a single main surface of said semiconductor body, said method further comprising the step of reducing the thickness of said first region from the surface opposite to the surface through which the diffusion has taken place.
Claim 6
Dependent Claim
93 words
A method as claimed in claim 1, wherein said second region is produced by carrying out at least one diffusion with high impurity concentration through each of the two oppositely located main surfaces of said semiconductor body, said diffusion being carried out to a depth which is at least equal to one diffusion length of the minority charge carriers, and said method further comprises reducing the thickness of said semiconductor body from one of said main surfaces thereof, by a value which said semiconductor is at least equal to the said diffusion depth.