Abstract Apparatus for testing electronic devices having a high density array of pin leads includes a zero insertion force socket having coaxial output leads with the inner conductor being a conductor pair with the coaxial lead terminating at a number of test heads. Each test head includes switching means for terminating the output coaxial lead in a characteristic impedance. The various test heads are then coaxially coupled, maintaining the two conductor inner lead pair, to more distant signal sources and receivers of both the ac and dc types to provide for Kelvin testing by separately connecting the inner conductor pair to power and sense devices or shorting the conductor pair together and conducting ac testing by use of pulsers and discriminators, or other dynamic test sources or sense devices such as sinewave devices.
Apparatus for testing electronic devices having a high density array of pin leads comprising: test socket means for receiving said pin leads and having a plurality of output leads each corresponding to one of said pin leads said ouptut leads having an array density corresponding to said pin lead density, each of said output leads having an inner conductor pair insulated from one another and an outer shield; a plurality of first switcing means in close proximity to said test socket means for selectively terminating said output leads in a predetermined characteristic impedance; signal sourcing and receiving means for sending and receiving pulses and d.c. signals; a plurality of leads having an inner conductor pair insulated from each other and an outer shield for connecting to said output leads at the locations of said plurality of first switching means; second switching means for selectively connecting said signal sourcing and receiving means to said connecting leads and for shorting said inner conductor pairs to provide said characteristic impedance for said signal sourcing and receiving means.
Claim 2
Dependent Claim
174 words
Apparatus for testing electronic devices having a high density array of pin leads comprising: test socket means for receiving said pin leads and having a plurality of output leads each corresponding to one of said pin leads said ouptut leads having an array density corresponding to said pin lead density, each of said output leads having an inner conductor pair insulated from one another and an outer shield; a plurality of first switcing means in close proximity to said test socket means for selectively terminating said output leads in a predetermined characteristic impedance; signal sourcing and receiving means for sending and receiving pulses and d.c. signals; a plurality of leads having an inner conductor pair insulated from each other and an outer shield for connecting to said output leads at the locations of said plurality of first switching means; second switching means for selectively connecting said signal sourcing and receiving means to said connecting leads and for shorting said inner conductor pairs to provide said characteristic impedance for said signal sourcing and receiving means.
Claim 3
Dependent Claim
79 words
Apparatus as in claim 1 where said signal sourcing and receiving means includes a constant direct current source and d.c. voltage sensing means and where said second switching means respectively connects one and the other of said inner conductor pairs of both said connecting and output leads to one and the other of said current source and d.c. voltage sensing means when said conductor pair of said lead is not shorted together whereby a d.c. Kelvin measurement is provided.
Claim 4
Dependent Claim
34 words
Apparatus as in claim 1 where said signal sourcing and receiving means includes a pulser and discriminator which said second switching means selectively connect to said shorted inner conductor pair of said connecting lead.