Polyimide containing silicones as protective coating on semiconductor device

Claim 1

A semiconductor element comprised of a body of semiconductor material having at least two regions of opposite-type semiconductivity and a P-N junction disposed between each pair of regions of opposite type semiconductivity: and end portion of at least one P-N junction exposed at a surface of the body; and at least one layer of conformal protective coating material disposed on the exposed end portion of the at least one P-N junction, the layer comprising a copolymer which is a reaction product of a tetracarboxylic acid dianhydride, a diamine and a di(aminoalkyl) siloxane, which is a copolymer having recurring structural units of a block copolymer of the formulas: ##STR8## wherein: R is a divalent hydrocarbon radical: R' is a monovalent hydrocarbon radical wherein each R' may be the same radical or a different radical from the others; R" is a tetravalent organic radical; Q is a divalent organic radical which is a residue of an organic diamine; x is an integer having a value of from 1 to 10: m is an integer greater than 1 and n is an integer greater than 1, p is an integer greater than or equal to 0, and the recurring units designated by m, n, and p are such that the mole percent of silicone diamine in the total polymer constitutes 18 to 45 mole percent of the total diamines in the copolymer.