Wax-flux composition containing a succinimide salt of an alkylaryl sulfonic acid for soldering

Claim 2

A process for soldering an electrical component to a printed circuit board, said board comprising a non-conducting substrate and a pattern of an electrically conductive metal laminated to said substrate, said metal being solderable with a low-melting-point alloy solder, said board having component lead receiving holes through both said substrate and said metal pattern, said component having electrical leads, and said component being mounted on said board by having at least one of said leads inserted through a said lead receiving hole, said process comprising: a. applying a molten wax-flux composition to the metal pattern side of said board and to said component lead; b. allowing said wax-flux composition to solidify; c. trimming said component lead; and d. soldering said component to said printed circuit board with a low-melting-point alloy solder, wherein said wax-flux composition comprises: I. a major amount of a wax having an AMP between 0° C and 100° C; and Ii. an amount effective to cause fluxing, at or below the soldering temperature, of the piece to be soldered in said process of a wax-soluble product obtained by first reacting a C 20 -C 400 aliphatic hydrocarbon-substituted succinic acid or a derivative thereof which is capable of forming carboximide bonds with a C 2 -C 30 , N 2 -N 10 alkylene polyamine to form a carboximide and then reacting said carboximide with a (C 8 -C 30 alkyl)aryl sulfonic acid.

Claim 3

The process of claim 1 wherein: a. said wax-flux composition is applied to said board by contacting the metal pattern side of said board with the crest of a standing wave of said molten wax-flux composition; and b. said component is soldered to said board by contacting the metal pattern side of said board with the crest of a standing wave of said low-melting-point alloy solder.

Claim 4

The process of claim 2 wherein said component lead is trimmed by a circular saw.

Claim 5

A process for soldering an electrical component to a printed circuit board, said board comprising a non-conducting substrate and a pattern of an electrically conductive metal laminated to said substrate, said metal being solderable with a low-melting-point alloy solder, said board having component lead receiving holes through both said substrate and said metal pattern, said component having electrical leads, and said component being mounted on said board by having at least one of said leads inserted through a said lead receiving hole, said process comprising: a. applying a molten wax-flux composition to the metal pattern side of said board and to said component lead; b. allowing said wax-flux composition to solidify; c. trimming said component lead; and d. soldering said component to said printed circuit board with a low-melting-point alloy solder, wherein said wax-flux composition comprises: I. a major amount of a wax having an AMP between 0° C and 100° C; and Ii. an amount effective to cause fluxing, at or below the soldering temperature, of the piece to be soldered in said process of a wax-soluble product of the formula ##STR4## wherein X represents: ##STR5## with at least one X being the latter radical; R 1 and R 4 each independently represent hydrogen or an alkyl containing from 1 to about 5 carbon atoms; A is an alkylene radical containing from 2 to about 6 carbon atoms; y is a number from 0 to 10 such that when A represents ethylene R 1 on adjacent nitrogen atoms may be joined to form ethylene; R 3 represents an alkyl or alkenyl radical of from about 20 to about 400 carbon atoms; Ar represents an aryl group; R 2 represents a wax-solublizing group containing from 1 to about 22 carbon atoms; n represents a positive integer of from 1 to 3 wherein the total number of carbon atoms contained in all of said R 2 groups is from 8 to about 80 carbon atoms; and z represents a number from 1 up to the number of titratable amine nitrogens.

Claim 6

A process for soldering an electrical component to a printed circuit board, said board comprising a non-conducting substrate and a pattern of an electrically conductive metal laminated to said substrate, said metal being solderable with a low-melting-point alloy solder, said board having component lead receiving holes through both said substrate and said metal pattern, said component having electrical leads, and said component being mounted on said board by having at least one of said leads inserted through a said lead receiving hole, said process comprising: a. applying a molten wax-flux composition to the metal pattern side of said board and to said component lead; b. allowing said wax-flux composition to solidify; c. trimming said component lead; and d. soldering said component to said printed circuit board with a low-melting-point alloy solder, wherein said wax-flux composition comprises: I. a major amount of a wax having an AMP between 0° C and 100° C; and Ii. an amount effective to cause fluxing, at or below the soldering temperature, of the piece to be soldered in said process of a wax-soluble product of the formula ##STR4## wherein X represents: ##STR5## with at least one X being the latter radical; R 1 and R 4 each independently represent hydrogen or an alkyl containing from 1 to about 5 carbon atoms; A is an alkylene radical containing from 2 to about 6 carbon atoms; y is a number from 0 to 10 such that when A represents ethylene R 1 on adjacent nitrogen atoms may be joined to form ethylene; R 3 represents an alkyl or alkenyl radical of from about 20 to about 400 carbon atoms; Ar represents an aryl group; R 2 represents a wax-solublizing group containing from 1 to about 22 carbon atoms; n represents a positive integer of from 1 to 3 wherein the total number of carbon atoms contained in all of said R 2 groups is from 8 to about 80 carbon atoms; and z represents a number from 1 up to the number of titratable amine nitrogens.

Claim 7

The process of claim 4 wherein: a. said wax-flux composition is applied to said board by contacting the metal pattern side of said board with the crest of a standing wave of said wax-flux composition; and b. said component is soldered to said board by contacting the metal pattern side of said board with the crest of a standing wave of said low-melting-point alloy solder.

Claim 8

The process of claim 5 wherein said component lead is trimmed by a circular saw.