Thermosetting compositions containing poly(arylacetylenes)

Claim 2

A thermosetting composition comprising a blend of (1) a prepolymer of at least one polyacetylenically substituted aromatic compound, said prepolymer having a number average molecular weight from about 900 to about 12,000, a ratio of aromatic protons to olefinic protons greater than about 2.4 and containing from about 5 to about 20% acetylenic groups by weight of the prepolymer, with (2) from about 2 to about 200%, by weight of the prepolymer, of at least one aromatic organic compound containing at least two six-membered aromatic rings, said rings being unsubstituted or methylsubstituted, said rings being condensed with each other and coupled directly through a single oxygen atom or each ring being coupled directly through a single oxygen atom, said compound or mixtures thereof containing no crystalline organic phase at 220° C., having a viscosity of less than 20 centipoises at 220° C. and containing no more than 5% of material volatile at 240° C. when distilled according to the procedure of ASTM D20-56.

Claim 3

The thermosetting composition of claim 1 wherein the prepolymer comprises a polymer of a diethynylbenzene.

Claim 4

The thermosetting composition of claim 2 wherein the polymer of a diethynylbenzene is a copolymer of a diethynylbenzene and diphenylbutadiyne.

Claim 5

The thermosetting composition of claim 2 wherein the polymer of a diethynylbenzene is a copolymer of a diethynylbenzene and phenylacetylene.

Claim 6

The thermosetting composition of claim 2 wherein the aromatic organic compound is dibenzofuran.

Claim 7

The thermosetting composition of claim 2 wherein the aromatic organic compound is diphenyl ether.

Claim 8

The thermosetting composition of claim 6 wherein diphenylbutadiyne is used in conjunction with the diphenyl ether.

Claim 9

The process of preparing a thermoset resin essentially free of aliphatic unsaturation which comprises (1) in a first stage (a) preparing a prepolymer by polymerizing at least one polyacetylenically substituted aromatic compound by heating said compound with an aromatization catalyst in an inert organic diluent to a temperature of from about 55° C. to about 250° C. until from about 30% to about 90% of said compound has been converted to polymer, (b) separating the prepolymer from the polymerization reaction mixture, and (2) in a second stage, (a) fabricating a blend of said prepolymer and from about 2 to about 200%, by weight of the prepolymer, of at least one aromatic organic compound containing at least two six-membered aromatic rings, said rings being unsubstituted or methyl-substituted, said rings being condensed with each other and coupled directly through a single oxygen atom or each ring being coupled directly through a single oxygen atom, said compound or mixtures thereof containing no crystalline organic phase at 220° C., having a viscosity of less than 20 centipoises at 220° C. and containing no more than 5% of material volatile at 240° C. when distilled according to the procedure of ASTM D20-56, and (b) heating the fabricated blend to a temperature of from about 100° C. to about 300° C.

Claim 10

The process of preparing a thermoset resin essentially free of aliphatic unsaturation which comprises (1) in a first stage (a) preparing a prepolymer by polymerizing at least one polyacetylenically substituted aromatic compound by heating said compound with an aromatization catalyst in an inert organic diluent to a temperature of from about 55° C. to about 250° C. until from about 30% to about 90% of said compound has been converted to polymer, (b) separating the prepolymer from the polymerization reaction mixture, and (2) in a second stage, (a) fabricating a blend of said prepolymer and from about 2 to about 200%, by weight of the prepolymer, of at least one aromatic organic compound containing at least two six-membered aromatic rings, said rings being unsubstituted or methyl-substituted, said rings being condensed with each other and coupled directly through a single oxygen atom or each ring being coupled directly through a single oxygen atom, said compound or mixtures thereof containing no crystalline organic phase at 220° C., having a viscosity of less than 20 centipoises at 220° C. and containing no more than 5% of material volatile at 240° C. when distilled according to the procedure of ASTM D20-56, and (b) heating the fabricated blend to a temperature of from about 100° C. to about 300° C.