Patent US4026759A successfully refreshed from Google Patents.
US4026759A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making ingrown lead frame with strain relief
Assignee: International Business Machines Corp
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Filing: 1975-12-11
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Granted: 1977-05-31
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Expires: 1995-12-11
Abstract
Abstract A method for providing a large number of interconnections between a circuitizable wafer and a circuitizable substrate provides very fine line interconnections with built-in strain relief. A channel between the respective substrates is filled with a solvent soluble material which is applied in a manner such that a convex or concave shape is attained in the channel between the material. A sensitizer may be mixed with the solvent soluble material prior to its placement in the channel between the substrates, and then a photoresist is applied to the composite, exposed and developed, yielding the desired circuit configuration. Next, copper leads are additively electrolessly plated to the desired thickness in the exposed circuit areas. After the leads have been formed, the solvent soluble material is removed leaving curved, strain relief leads suspended in air with the two ends interconnecting the substrates.
Inventors
- 👤 Donald Gene McBride
- 👤 Philip Harold Pallady
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 11:23
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/142; H10W72/00; H10W72/60; H10W70/099; H10W70/67; H10W70/68; H10W70/682; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/30; H10W72/321; H10W90/00; H10W90/701; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
119 words
A method for providing interconnections between respective sites on two adjacent substrates, comprising the steps of: placing a curved, non-swelling solvent soluble material between the respective interconnection sites on said adjacent substrates, said solvent soluble material having a smooth surface and being adapted to accept a plate of conductor material; defining a desired interconnection pattern on said solvent soluble material and the sites on said substrates; depositing a conductor material in the defined interconnection pattern to thereby establish the desired curved interconnecting leads between respective sites on said two adjacent substrates; and dissolving and removing the solvent soluble material, thereby leaving the curved interconnecting leads suspended between said two substrates, the curve in each lead providing stress relief thereto.
Claim 2
Independent Claim
119 words
A method for providing interconnections between respective sites on two adjacent substrates, comprising the steps of: placing a curved, non-swelling solvent soluble material between the respective interconnection sites on said adjacent substrates, said solvent soluble material having a smooth surface and being adapted to accept a plate of conductor material; defining a desired interconnection pattern on said solvent soluble material and the sites on said substrates; depositing a conductor material in the defined interconnection pattern to thereby establish the desired curved interconnecting leads between respective sites on said two adjacent substrates; and dissolving and removing the solvent soluble material, thereby leaving the curved interconnecting leads suspended between said two substrates, the curve in each lead providing stress relief thereto.
Claim 3
Dependent Claim
17 words
The method according to claim 1 wherein the curved surface of said solvent soluble material is concave.
Claim 4
Dependent Claim
17 words
The method according to claim 1 wherein the curved surface of said solvent soluble material is convex.
Claim 5
Dependent Claim
20 words
The method according to claim 1 wherein all steps are carried out in a temperature of less than 150° Centigrade.
Claim 6
Dependent Claim
28 words
The method according to claim 1 wherein said solvent soluble material is dissolved by immersion in a solvent chosen from the group consisting of methylene chloride and trichloroethylene.
Claim 7
Independent Claim
101 words
A method for providing interconnections between respective sites on two adjacent substrates, comprising the steps of: placing a non-swelling solvent soluble material between the respective interconnection sites on said adjacent substrates, said solvent soluble material being shaped to provide a curved surface therebetween applying a photoresist over the solvent soluble material and said interconnection sites; exposing said photoresist to define the desired interconnecting paths between the sites on said substrates; developing said photoresist to define the desired interconnecting paths; electrolessly plating copper in said areas defined by said photoresist to thereby provide the interconnecting leads between respective sites on said substrates;
Claim 8
Independent Claim
101 words
A method for providing interconnections between respective sites on two adjacent substrates, comprising the steps of: placing a non-swelling solvent soluble material between the respective interconnection sites on said adjacent substrates, said solvent soluble material being shaped to provide a curved surface therebetween applying a photoresist over the solvent soluble material and said interconnection sites; exposing said photoresist to define the desired interconnecting paths between the sites on said substrates; developing said photoresist to define the desired interconnecting paths; electrolessly plating copper in said areas defined by said photoresist to thereby provide the interconnecting leads between respective sites on said substrates;
Claim 9
Dependent Claim
15 words
removing said undeveloped photoresist; and dissolving away the solvent soluble material from between said substrate.
Claim 10
Dependent Claim
15 words
removing said undeveloped photoresist; and dissolving away the solvent soluble material from between said substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-05-30 | 1980-11-29 | 1981-05-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-05-30 | 1984-11-29 | 1985-05-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-05-30 | 1988-11-29 | 1989-05-31 | $7700.00 | Window Closed / Lapsed |