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US4022932A Expired / Lapsed US ⏱️ 0.0 years remaining

Resist reflow method for making submicron patterned resist masks

Assignee: International Business Machines Corp
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Filing: 1975-06-09
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Granted: 1977-05-10
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Expires: 1995-06-09
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Abstract

Abstract The method for making patterned resist masks having minimum opening dimensions. The mask is prepared initially using standard photo or electron beam lithography techniques to yield the smallest aperture dimensions consistent with the state-of-the-art. Then, the resulting mask is placed within a chamber containing an atmosphere of resist solvent vapor. The vapor is absorbed by the patterned resist mask causing controlled resist reflow which uniformly reduces the dimensions of the resist openings by an amount determined by time, temperature, resist thickness, resist type and solvent used.

Inventors

  • 👤 Bai Cwo Feng

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 12:58
CPC Classifications
H; H10; H10P; H10P95/00; H10W; H10W74/00; H10W74/40; H10W74/47; Y; Y10; Y10S; Y10S438/00; Y10S438/942; Y10S438/947; Y10S438/948

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 57 words
The method for making patterned resist masks comprising: forming on a substrate surface a patterned resist mask having windows exposing planar surface regions of said substrate, and flowing said resist mask by exposing said resist mask and substrate to a vapor of a solvent of said resist mask to reduce the area of each of said windows.
Claim 2
Independent Claim 57 words
The method for making patterned resist masks comprising: forming on a substrate surface a patterned resist mask having windows exposing planar surface regions of said substrate, and flowing said resist mask by exposing said resist mask and substrate to a vapor of a solvent of said resist mask to reduce the area of each of said windows.
Claim 3
Dependent Claim 17 words
The method as defined in claim 1 wherein said resist mask is made of a photosensitive material.
Claim 4
Dependent Claim 19 words
The method as defined in claim 1 wherein said resist mask is made of an electron beam sensitive material.
Claim 5
Dependent Claim 22 words
The method as defined in claim 1 wherein said resist mask is made of a photosensitive material and said solvent is acetone.
Claim 6
Dependent Claim 21 words
The method as defined in claim 4 wherein said flowing is carried out in a solvent vapor chamber at room temperature.
Claim 7
Dependent Claim 26 words
The method as defined in claim 4 wherein said substrate is formed by providing a semiconductor member and covering said member with an electrical insulating layer.
Claim 8
Dependent Claim 15 words
The method as defined in claim 6 wherein said electrical insulating layer is silicon dioxide.

References Cited (Backward Citations)

US243200A Cited
US2138578A Cited
US2294479A Cited
US3339526A Cited
US3597257A Cited
US3539381A Cited
US3737499A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-05-09 1980-11-08 1981-05-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-05-09 1984-11-08 1985-05-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-05-09 1988-11-08 1989-05-10 $7700.00 Window Closed / Lapsed

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